公开(公告)号：US11769686B2

公开(公告)日：2023-09-26

申请号：US16330365

申请日：2016-09-29

Applicant: Intel Corporation

Inventor： Harinath Reddy ,  Harsono S. Simka ,  Christopher D. Thomas

IPC: B05B13/02 ,  B05B13/04 ,  H01L21/687 ,  C23C18/16 ,  H01L21/288 ,  H01L21/67

CPC classification number: H01L21/68764 ,  B05B13/02 ,  B05B13/0228 ,  B05B13/04 ,  C23C18/163 ,  C23C18/1642 ,  C23C18/1675 ,  H01L21/288 ,  H01L21/6715

Abstract: A single-substrate electroless (EL) plating apparatus including a workpiece chuck that is rotatable about rotation axis and inclinable about an axis of inclination. The chuck inclination may be controlled to a non-zero inclination angle during a dispense of plating solution to improve uniformity in the surface wetting and/or plating solution residence time across the a surface of a workpiece supported by the chuck. The angle of inclination may be only a few degrees off-level with the plating solution dispensed from a nozzle that scans over a high-side of the chuck along a radius of the workpiece while the chuck rotates. The angle of inclination may be actively controlled during dispense of the plating solution. The inclination angle may be larger at commencement of the plating solution dispense than at cessation of the dispense.

公开(公告)号：US20210375662A1

公开(公告)日：2021-12-02

申请号：US16330365

申请日：2016-09-29

Applicant: Intel Corporation

Inventor： Harinath Reddy ,  Harsono S. Simka ,  Christopher D. Thomas

IPC: H01L21/687 ,  H01L21/288 ,  C23C18/16

Abstract: A single-substrate electroless (EL) plating apparatus including a workpiece chuck that is rotatable about rotation axis and inclinable about an axis of inclination. The chuck inclination may be controlled to a non-zero inclination angle during a dispense of plating solution to improve uniformity in the surface wetting and/or plating solution residence time across the a surface of a workpiece supported by the chuck. The angle of inclination may be only a few degrees off-level with the plating solution dispensed from a nozzle that scans over a high-side of the chuck along a radius of the workpiece while the chuck rotates. The angle of inclination may be actively controlled during dispense of the plating solution. The inclination angle may be larger at commencement of the plating solution dispense than at cessation of the dispense.

公开(公告)号：US09932671B2

公开(公告)日：2018-04-03

申请号：US15119699

申请日：2014-03-27

Applicant: Intel Corporation

Inventor： James M. Blackwell ,  Patricio E. Romero ,  Scott B. Clendenning ,  Grant M. Kloster ,  Florian Gstrein ,  Harsono S. Simka ,  Paul A. Zimmerman ,  Robert L. Bristol

IPC: H01L21/336 ,  C23C16/455 ,  C23C16/18 ,  C23C16/48 ,  H01L21/768 ,  H01L21/285 ,  H01L29/66 ,  H01L21/033

CPC classification number: C23C16/45553 ,  C23C16/18 ,  C23C16/482 ,  H01L21/0337 ,  H01L21/28556 ,  H01L21/28562 ,  H01L21/76816 ,  H01L21/76879 ,  H01L21/76897 ,  H01L29/66795

Abstract: Precursor and process design for photo-assisted metal atomic layer deposition (ALD) and chemical vapor deposition (CVD) is described. In an example, a method of fabricating a thin metal film involves introducing precursor molecules proximate to a surface on or above a substrate, each of the precursor molecules having one or more metal centers surrounded by ligands. The method also involves depositing a metal layer on the surface by dissociating the ligands from the precursor molecules using a photo-assisted process.