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公开(公告)号：US20050077626A1
公开(公告)日：2005-04-14
申请号：US10791136
申请日：2004-03-02
申请人： Jacky Seiller , Jean-Francois Revel , Claude Douce
发明人： Jacky Seiller , Jean-Francois Revel , Claude Douce
IPC分类号： H01L23/485 , H01L23/522 , H01L23/528 , H01L21/44 , H01L23/48 , H01L29/40
CPC分类号： H01L24/05 , H01L23/5227 , H01L23/5283 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/451 , H01L2224/45144 , H01L2224/48453 , H01L2224/48463 , H01L2224/48624 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/00
摘要： An integrated circuit including one or several metallization levels, metal conductive strips and metal contact pads being formed on the last metallization level, the last level being covered with a passivation layer in which are formed openings above the contact pads. The thickness of the pads, at least at the level of their portions not covered by the passivation layer, is smaller than the thickness of said conductive strips.
摘要翻译： 包括一个或几个金属化水平的集成电路，金属导电条和金属接触焊盘在最后的金属化水平上形成，最后一个层被钝化层覆盖，其中在接触焊盘上形成开口。 至少在其未被钝化层覆盖的部分的水平面上的焊盘的厚度小于所述导电条的厚度。
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公开(公告)号：US07919864B2
公开(公告)日：2011-04-05
申请号：US10791136
申请日：2004-03-02
申请人： Jacky Seiller , Jean-François Revel , Claude Douce
发明人： Jacky Seiller , Jean-François Revel , Claude Douce
IPC分类号： H01L29/40 , H01L21/4763
CPC分类号： H01L24/05 , H01L23/5227 , H01L23/5283 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/451 , H01L2224/45144 , H01L2224/48453 , H01L2224/48463 , H01L2224/48624 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/00
摘要： An integrated circuit including one or several metallization levels, metal conductive strips and metal contact pads being formed on the last metallization level, the last level being covered with a passivation layer in which are formed openings above the contact pads. The thickness of the pads, at least at the level of their portions not covered by the passivation layer, is smaller than the thickness of said conductive strips.
摘要翻译： 包括一个或几个金属化水平的集成电路，金属导电条和金属接触焊盘在最后的金属化水平上形成，最后一个层被钝化层覆盖，其中在接触焊盘上形成开口。 至少在其未被钝化层覆盖的部分的水平面上的焊盘的厚度小于所述导电条的厚度。
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公开(公告)号：US08148258B2
公开(公告)日：2012-04-03
申请号：US12673975
申请日：2008-06-27
申请人： Romain Coffy , Jacky Seiller , Gil Provent
发明人： Romain Coffy , Jacky Seiller , Gil Provent
IPC分类号： H01L21/44
CPC分类号： H05K3/3473 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L2224/0401 , H01L2224/11472 , H01L2224/11474 , H01L2224/11849 , H01L2224/11903 , H01L2224/131 , H01L2224/13111 , H01L2224/1403 , H01L2224/16 , H01L2224/94 , H01L2924/00013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/014 , H01L2924/12036 , H05K2203/043 , H05K2203/0574 , H01L2224/11 , H01L2224/03 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A method for fabricating electrical bonding pads on the electrical contact areas of a wafer includes producing first blocks made of a solder material, producing second blocks made of a solder material on these first blocks, and passing the blocks through an oven so as to shape the blocks into approximately domed electrical bonding pads.
摘要翻译： 用于在晶片的电接触区域上制造电接合焊盘的方法包括制造由焊料材料制成的第一块，在这些第一块上产生由焊料材料制成的第二块，并使块通过炉， 嵌入大致圆顶的电焊盘。
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公开(公告)号：US20110151657A1
公开(公告)日：2011-06-23
申请号：US12673975
申请日：2008-06-27
申请人： Romain Coffy , Jacky Seiller , Gil Provent
发明人： Romain Coffy , Jacky Seiller , Gil Provent
IPC分类号： H01L21/28
CPC分类号： H05K3/3473 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L2224/0401 , H01L2224/11472 , H01L2224/11474 , H01L2224/11849 , H01L2224/11903 , H01L2224/131 , H01L2224/13111 , H01L2224/1403 , H01L2224/16 , H01L2224/94 , H01L2924/00013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/014 , H01L2924/12036 , H05K2203/043 , H05K2203/0574 , H01L2224/11 , H01L2224/03 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A method for fabricating electrical bonding pads on the electrical contact areas of a wafer includes producing first blocks made of a solder material, producing second blocks made of a solder material on these first blocks, and passing the blocks through an oven so as to shape the blocks into approximately domed electrical bonding pads.
摘要翻译： 用于在晶片的电接触区域上制造电接合焊盘的方法包括制造由焊料材料制成的第一块，在这些第一块上产生由焊料材料制成的第二块，并使块通过炉， 嵌入大致圆顶的电焊盘。
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公开(公告)号：US08227332B2
公开(公告)日：2012-07-24
申请号：US12262982
申请日：2008-10-31
申请人： Romain Coffy , Jacky Seiller , Gil Provent
发明人： Romain Coffy , Jacky Seiller , Gil Provent
IPC分类号： H01L21/44
CPC分类号： H05K3/242 , H01L24/03 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05552 , H01L2224/05555 , H01L2224/05666 , H01L2224/0603 , H01L2224/06051 , H01L2224/11422 , H01L2224/11472 , H01L2224/11912 , H01L2224/13012 , H01L2224/13099 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/13164 , H01L2224/1403 , H01L2224/14051 , H01L2224/94 , H01L2924/00013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/12036 , H01L2924/14 , H05K3/3473 , H05K2203/043 , H01L2224/11 , H01L2224/03 , H01L2924/01028 , H01L2224/05099 , H01L2224/13599 , H01L2224/05599 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A method for fabricating electrical bonding pads on one face of a wafer includes the production of electrically conductive areas and electrical connection branches connecting these conductive areas. A layer of mask material is deposited and openings are produced in this mask layer which extend above said conductive areas and at least some of which extend at least partly beyond the peripheral edges of the underlying conductive areas. Blocks made of a solder material are produces in the openings by electrodeposition in a bath. The mask material is then removed along with the connection branches. The wafer is passed through or placed in an oven so as to shape, on the conductive areas, the blocks into substantially domed electrical bonding pads.
摘要翻译： 用于在晶片的一个面上制造电接合焊盘的方法包括制造导电区域和连接这些导电区域的电连接分支。 沉积掩模材料层，并且在该掩模层中产生开口，该掩模层在所述导电区域之上延伸，并且至少其中一些延伸至少部分地超过下面的导电区域的周边边缘。 通过在浴中电沉积在开口中产生由焊料材料制成的块。 然后将掩模材料与连接分支一起移除。 将晶片通过或放置在烘箱中，以在导电区域上将块形成为基本上圆顶的电接合焊盘。
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公开(公告)号：US20090134514A1
公开(公告)日：2009-05-28
申请号：US12262982
申请日：2008-10-31
申请人： Romain Coffy , Jacky Seiller , Gil Provent
发明人： Romain Coffy , Jacky Seiller , Gil Provent
IPC分类号： H01L23/488 , H01L21/44
CPC分类号： H05K3/242 , H01L24/03 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05552 , H01L2224/05555 , H01L2224/05666 , H01L2224/0603 , H01L2224/06051 , H01L2224/11422 , H01L2224/11472 , H01L2224/11912 , H01L2224/13012 , H01L2224/13099 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/13164 , H01L2224/1403 , H01L2224/14051 , H01L2224/94 , H01L2924/00013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/12036 , H01L2924/14 , H05K3/3473 , H05K2203/043 , H01L2224/11 , H01L2224/03 , H01L2924/01028 , H01L2224/05099 , H01L2224/13599 , H01L2224/05599 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A method for fabricating electrical bonding pads on one face of a wafer includes the production of electrically conductive areas and electrical connection branches connecting these conductive areas. A layer of mask material is deposited and openings are produced in this mask layer which extend above said conductive areas and at least some of which extend at least partly beyond the peripheral edges of the underlying conductive areas. Blocks made of a solder material are produces in the openings by electrodeposition in a bath. The mask material is then removed along with the connection branches. The wafer is passed through or placed in an oven so as to shape, on the conductive areas, the blocks into substantially domed electrical bonding pads.
摘要翻译： 用于在晶片的一个面上制造电接合焊盘的方法包括制造导电区域和连接这些导电区域的电连接分支。 沉积掩模材料层，并且在该掩模层中产生开口，该掩模层在所述导电区域之上延伸，并且至少其中一些延伸至少部分地超过下面的导电区域的周边边缘。 通过在浴中电沉积在开口中产生由焊料材料制成的块。 然后将掩模材料与连接分支一起移除。 将晶片通过或放置在烘箱中，以在导电区域上将块形成为基本上圆顶的电接合焊盘。
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公开(公告)号：US20080157273A1
公开(公告)日：2008-07-03
申请号：US11965127
申请日：2007-12-27
CPC分类号： H01L23/5227 , H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05023 , H01L2224/05027 , H01L2224/05147 , H01L2224/05166 , H01L2224/05568 , H01L2224/05647 , H01L2924/14 , H01L2924/00 , H01L2924/00014
摘要： An integrated electronic circuit chip having an inductor placed above a protective layer for the metallization levels of the chip, the inductor having a thickness in a direction perpendicular to a surface of a substrate of the chip. The inductor has a reduced electrical resistance and a high quality factor. In addition, an inductor is realized at the same time as the pads for connecting the chip to a supporting board using flip-chip technology.
摘要翻译： 一种集成电子电路芯片，其具有放置在用于芯片的金属化级别的保护层上方的电感器，所述电感器具有在垂直于所述芯片的衬底的表面的方向上的厚度。 电感器具有降低的电阻和高品质因数。 此外，电感器与使用倒装芯片技术将芯片连接到支撑板的焊盘同时实现。
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