公开(公告)号：US08016007B2

公开(公告)日：2011-09-13

申请号：US12698903

申请日：2010-02-02

申请人： Jalal Ashjaee ,  Douglas W Young ,  Kiet Tran ,  Steve Kuskie

发明人： Jalal Ashjaee ,  Douglas W Young ,  Kiet Tran ,  Steve Kuskie

IPC分类号： B32B37/00

CPC分类号： B32B38/1841 ,  B32B38/1858 ,  B32B2309/02 ,  B32B2457/12 ,  H01L31/188 ,  Y02E10/50 ,  Y10T156/17

摘要： The present inventions generally relate to thin film solar cell fabrication, and more particularly, to techniques for interconnecting solar cells based on Group IBIIIAVIA thin film semiconductors. In a particular embodiment, a system is described that positions solar cells and conductive leads with respect to each other so that application of a conductive adhesive and formation of an assembled solar cell string, followed by curing and cooling of the conductive adhesive, can occur in a repeatable manner.

摘要翻译： 本发明一般涉及薄膜太阳能电池制造，更具体地涉及基于IBIIIAVIA薄膜半导体的用于互连太阳能电池的技术。 在具体实施例中，描述了一种系统，其将太阳能电池和导电引线相对于彼此定位，使得导电粘合剂的应用和组装的太阳能电池串的形成，随后导电粘合剂的固化和冷却可以发生在 一个可重复的方式。

公开(公告)号：US20100200170A1

公开(公告)日：2010-08-12

申请号：US12698903

申请日：2010-02-02

申请人： Jalal Ashjaee ,  Douglas W. Young ,  Kiet Tran ,  Steve Kuskie

发明人： Jalal Ashjaee ,  Douglas W. Young ,  Kiet Tran ,  Steve Kuskie

IPC分类号： B32B37/06 ,  B32B37/08

CPC分类号： B32B38/1841 ,  B32B38/1858 ,  B32B2309/02 ,  B32B2457/12 ,  H01L31/188 ,  Y02E10/50 ,  Y10T156/17

摘要： The present inventions generally relate to thin film solar cell fabrication, and more particularly, to techniques for interconnecting solar cells based on Group IBIIIAVIA thin film semiconductors. In a particular embodiment, a system is described that positions solar cells and conductive leads with respect to each other so that application of a conductive adhesive and formation of an assembled solar cell string, followed by curing and cooling of the conductive adhesive, can occur in a repeatable manner.

摘要翻译： 本发明一般涉及薄膜太阳能电池制造，更具体地涉及基于IBIIIAVIA薄膜半导体的用于互连太阳能电池的技术。 在具体实施例中，描述了一种系统，其将太阳能电池和导电引线相对于彼此定位，使得导电粘合剂的应用和组装的太阳能电池串的形成，随后导电粘合剂的固化和冷却可以发生在 一个可重复的方式。

公开(公告)号：US07059944B2

公开(公告)日：2006-06-13

申请号：US10369118

申请日：2003-02-18

申请人： Jalal Ashjaee ,  Boris Govzman ,  Bernard M. Frey ,  Boguslaw A. Nagorski ,  Douglas W. Young ,  Bulent M. Basol ,  Homayoun Talieh

发明人： Jalal Ashjaee ,  Boris Govzman ,  Bernard M. Frey ,  Boguslaw A. Nagorski ,  Douglas W. Young ,  Bulent M. Basol ,  Homayoun Talieh

IPC分类号： B24B1/00

CPC分类号： H01L21/67745 ,  B24B37/345 ,  G05B19/41865 ,  G05B2219/32272 ,  G05B2219/45031 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67219 ,  H01L21/68707 ,  H01L21/68728 ,  Y02P90/20

摘要： An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.

公开(公告)号：US06604988B2

公开(公告)日：2003-08-12

申请号：US10252149

申请日：2002-09-20

申请人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

发明人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

IPC分类号： B24B2100

CPC分类号： B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/013 ,  B24B37/04 ,  B24B37/205 ,  B24B47/04 ,  B24B49/16

摘要： The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

公开(公告)号：US06468139B1

公开(公告)日：2002-10-22

申请号：US09684059

申请日：2000-10-06

申请人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

发明人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

IPC分类号： B24B2100

CPC分类号： B24B37/205 ,  B24B21/04 ,  B24B37/04 ,  B24B47/04

摘要： The present invention is directed to methods and apparatus for polishing a surface of a semiconductor wafer using a pad or belt moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad or belt provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad or belt as the pad or belt moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having novel wafer loading and unloading methods.

摘要翻译： 本发明涉及使用可沿前后方向移动的垫或带来抛光半导体晶片的表面的方法和装置。 在VLSI和ULSI应用中，非常需要抛光晶片表面以完成平坦度。 抛光垫或带的向前和向后移动为晶片的表面提供了优异的平面性和均匀性。 当抛光晶片表面时，衬垫或带沿正向和反向移动，晶片表面被压靠在抛光垫或带上。 在抛光期间，晶片由具有新颖的晶片装载和卸载方法的晶片壳体支撑。

公开(公告)号：US06464571B2

公开(公告)日：2002-10-15

申请号：US09880730

申请日：2001-06-12

申请人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

发明人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

IPC分类号： B24B2100

CPC分类号： B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/013 ,  B24B37/04 ,  B24B37/205 ,  B24B47/04 ,  B24B49/16

摘要： The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

公开(公告)号：US06932679B2

公开(公告)日：2005-08-23

申请号：US10295197

申请日：2002-11-15

申请人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

发明人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

IPC分类号： B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/04 ,  B24B47/04 ,  B24B49/16 ,  B24B1/00

CPC分类号： B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/013 ,  B24B37/04 ,  B24B37/205 ,  B24B47/04 ,  B24B49/16

摘要： The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

摘要翻译： 本发明包括固定到机构的抛光垫或皮带，该机构允许垫或带以往往的方式即即向前和向后两个方向高速移动。 抛光垫或带在其抛光晶片时恒定的双向运动在晶片表面上提供了优异的平面性和均匀性。 当需要衬垫的新鲜部分时，衬垫移动通过包含辊的驱动系统，使得辊仅接触衬垫的背面，从而最小化除了从抛光抛光的晶片之外的摩擦源 并且使抛光垫的寿命最大化。

公开(公告)号：US06953392B2

公开(公告)日：2005-10-11

申请号：US09795687

申请日：2001-02-27

申请人： Jalal Ashjaee ,  Homayoun Talieh

发明人： Jalal Ashjaee ,  Homayoun Talieh

IPC分类号： C25F7/00 ,  H01L21/00 ,  H01L21/02 ,  H01L21/304 ,  H01L21/687 ,  B24B7/22

CPC分类号： H01L21/67173 ,  H01L21/67207 ,  H01L21/67219 ,  H01L21/6723

摘要： An integrated system for processing a plurality of wafers, having a conductive front surface, is provided. The system includes a plurality of processing subsystems for depositing on or removing metal from the front surfaces of the wafers. Each processing subsystem includes a process chamber and a cleaning chamber. The system also has a wafer handling subsystem for transporting each of the wafers into or out of the appropriate one of the plurality of processing subsystems. The plurality of processing subsystems and wafer handling subsystem form an integrated system.

摘要翻译： 提供了一种用于处理具有导电前表面的多个晶片的集成系统。 该系统包括用于从晶片的前表面沉积或从金属表面去除金属的多个处理子系统。 每个处理子系统包括处理室和清洁室。 该系统还具有晶片处理子系统，用于将每个晶片传送到多个处理子系统中的适当的一个处理子系统中或从其中移出。 多个处理子系统和晶片处理子系统形成集成系统。

公开(公告)号：US20050034994A1

公开(公告)日：2005-02-17

申请号：US10947628

申请日：2004-09-21

申请人： Jalal Ashjaee ,  Boguslaw Nagorski ,  Bulent Basol ,  Homayoun Talieh ,  Cyprian Uzoh

发明人： Jalal Ashjaee ,  Boguslaw Nagorski ,  Bulent Basol ,  Homayoun Talieh ,  Cyprian Uzoh

IPC分类号： C25D7/12 ,  C25F7/00 ,  C25D5/00 ,  B23H3/00

CPC分类号： C25F7/00 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885

摘要： Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the workpiece frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the workpiece frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the workpiece is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the workpiece frontal side surface, in its entirety, is thus permitted.

公开(公告)号：US08497152B2

公开(公告)日：2013-07-30

申请号：US12581787

申请日：2009-10-19

申请人： Jalal Ashjaee

发明人： Jalal Ashjaee

IPC分类号： H01L51/40

CPC分类号： H01L21/67103 ,  C23C18/12 ,  C23C18/1204 ,  C23C18/1283 ,  C23C18/1291 ,  H01L31/0322 ,  Y02E10/541 ,  Y02P70/521

摘要： A deposition method and a system are provided to deposit a CdS buffer layer on a surface of a solar cell absorber layer of a flexible workpiece from a process solution including all chemical components of the CdS buffer layer material. CdS is deposited from the deposition solution while the flexible workpiece is elastically shaped by a series of shaping rollers to retain the process solution on the solar cell absorber layer and while the flexible workpiece is heated by contacting to a heated liquid that the shaping rollers are fully or partially immersed. The flexible workpiece is elastically shaped by pulling a back surface of the flexible workpiece into surface cavity of the shaping rollers using magnetic force.

摘要翻译： 提供沉积方法和系统以从包括CdS缓冲层材料的所有化学成分的处理溶液中在柔性工件的太阳能电池吸收体层的表面上沉积CdS缓冲层。 CdS从沉积溶液沉积，而柔性工件通过一系列成型辊弹性成形，以将工艺溶液保持在太阳能电池吸收层上，同时柔性工件通过与成型辊完全相互接触的加热液体加热 或部分浸没。 柔性工件通过使用磁力将柔性工件的后表面拉到成型辊的表面腔中来弹性成形。