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    PLASMA PROCESSING SYSTEM AND PLASMA TREATMENT PROCESS
    1.
    发明申请
    PLASMA PROCESSING SYSTEM AND PLASMA TREATMENT PROCESS 审中-公开
    等离子体处理系统和等离子体处理工艺

    公开(公告)号：US20060163201A1

    公开(公告)日：2006-07-27

    申请号：US11278483

    申请日：2006-04-03

    申请人： James Getty ,  Louis Fierro

    发明人： James Getty ,  Louis Fierro

    IPC分类号： C23F1/00 ,  H05H1/24 ,  C23C16/00

    CPC分类号： H01J37/32541 ,  H01J37/32009 ,  H01J37/32082 ,  H01J37/32568 ,  H05H1/46 ,  H05H2001/466 ,  H05K3/26 ,  H05K2203/095

    摘要： A plasma treatment system for treating multiple substrates with a plasma. The treatment chamber of the plasma treatment system includes at least one pair of electrodes, typically vertically oriented, between which a substrate is positioned for plasma treatment. Each electrode includes a perforated panel that permits horizontal process gas and plasma flow, which improves plasma uniformity. A process recipe is defined that is effective for removing thin polymer areas, such as flash or chad, attached to and projecting from a polymer substrate.

    摘要翻译： 一种用等离子体处理多个基板的等离子体处理系统。 等离子体处理系统的处理室包括至少一对电极，通常垂直取向，在其间定位用于等离子体处理的基板。 每个电极包括允许水平处理气体和等离子体流动的穿孔板，这改善了等离子体均匀性。 定义了一种方法配方，用于去除附着到聚合物基材上并从聚合物基底突出的薄聚合物区域，如闪光或乍得。

    Apparatus and method for controlled decomposition oxidation of gaseous pollutants
    5.
    发明申请
    Apparatus and method for controlled decomposition oxidation of gaseous pollutants 有权
    气体污染物的控制分解氧化装置及方法

    公开(公告)号：US20070041879A1

    公开(公告)日：2007-02-22

    申请号：US11586069

    申请日：2006-10-25

    申请人： Robert Moore ,  James Getty ,  Ravil Safiullin

    发明人： Robert Moore ,  James Getty ,  Ravil Safiullin

    IPC分类号： F01N3/10

    CPC分类号： B01D47/14 ,  B01D47/06 ,  B01D53/68 ,  B01D53/75 ,  B01D2258/0216 ,  F23G7/061 ,  F23G7/065 ,  F23J15/022 ,  F23J15/04 ,  F23J2215/30 ,  F23J2217/105 ,  F23J2219/40

    摘要： An apparatus is provided for treating pollutants in a gaseous stream. The apparatus comprises tubular inlets for mixing a gas stream with other oxidative and inert gases for mixture and flame production within a reaction chamber. The reaction chamber is heated by heating elements and has an interior wall with orifices through which heated air enters into the central reaction chamber. The oxidized gases are treated also for particles removal by flowing through a packed bed. The packed bed is cooled and its upper portion with air inlets to enhance condensation and particle growth in the bed. The treated gas stream is also scrubbed in a continuous regenerative scrubber comprising at least two vertically separated beds in which one bed can be regenerated while the other is operative so that the flow may be continuously passed through the bed.

    摘要翻译： 提供了一种用于处理气流中的污染物的装置。 该装置包括管状入口，用于将气流与其他氧化惰性气体和惰性气体混合，以在反应室内混合和产生火焰。 反应室被加热元件加热并具有带有孔的内壁，加热的空气通过该孔进入中央反应室。 氧化气体也可通过流经填充床进行颗粒去除处理。 填充床被冷却，其上部具有空气入口以增强床中的冷凝和颗粒生长。 经处理的气流还在连续的再生洗涤器中洗涤，其包括至少两个垂直分离的床，其中一个床可以再生，而另一个床可操作，使得流可以连续地通过床。

    Plasma process for removing excess molding material from a substrate
    6.
    发明申请
    Plasma process for removing excess molding material from a substrate 有权
    用于从基底去除多余成型材料的等离子体工艺

    公开(公告)号：US20060131790A1

    公开(公告)日：2006-06-22

    申请号：US11021341

    申请日：2004-12-22

    申请人： James Getty ,  Jiangang Zhao

    发明人： James Getty ,  Jiangang Zhao

    IPC分类号： B23K26/38 ,  H01S3/00 ,  C23F1/00 ,  B29C35/08

    CPC分类号： H01L21/56 ,  B29C59/14 ,  H01L2924/0002 ,  H05K3/288 ,  H01L2924/00

    摘要： A method for removing thin layers of a two-component molding material from areas on a substrate. The method includes using a plasma formed using a first gas mixture for removing one component of the molding material and a plasma formed using a different second gas mixture for removing the other component of the molding material. For filled epoxies commonly used as molding materials, the first gas mixture may be an oxygen-rich mixture of an oxygen-containing gas species and a fluorine-containing gas species, and the second gas mixture may be a fluorine-rich mixture of the same gases.

    摘要翻译： 一种从基板上的区域去除双组分成型材料薄层的方法。 该方法包括使用使用第一气体混合物形成的等离子体，以除去模制材料的一个组分，以及使用不同的第二气体混合物形成的等离子体，以除去模制材料的其它组分。 对于通常用作成型材料的填充环氧树脂，第一气体混合物可以是含氧气体物质和含氟气体物质的富氧混合物，并且第二气体混合物可以是其富含氟的混合物 气体。

    ULTRA HIGH SPEED UNIFORM PLASMA PROCESSING SYSTEM
    8.
    发明申请
    ULTRA HIGH SPEED UNIFORM PLASMA PROCESSING SYSTEM 有权
    超高分子等离子体加工系统

    公开(公告)号：US20060011299A1

    公开(公告)日：2006-01-19

    申请号：US10710457

    申请日：2004-07-13

    申请人： Robert Condrashoff ,  James Fazio ,  James Getty ,  James Tyler

    发明人： Robert Condrashoff ,  James Fazio ,  James Getty ,  James Tyler

    IPC分类号： C23F1/00

    CPC分类号： H01J37/32834 ,  H01J37/32633

    摘要： An apparatus for processing a substrate with a plasma. The apparatus includes first and second electrodes positioned with a spaced apart relationship. A separating ring has a vacuum-tight engagement with confronting surfaces of the first electrode and the second electrode to define an evacuatable processing region therebetween. Communicating with the processing region is a process gas port for introducing a process gas to the processing region. The processing region may be evacuated through a vacuum port defined in one of the first and second electrodes to a pressure suitable for exciting a plasma from the process gas in the processing region when the first and second electrodes are powered.

    摘要翻译： 一种用等离子体处理衬底的装置。 该装置包括以间隔开的关系定位的第一和第二电极。 分离环与第一电极和第二电极的相对表面具有真空密封接合，以在它们之间限定可抽空的处理区域。 与处理区域通信是用于将处理气体引入到处理区域的处理气体端口。 处理区域可以通过在第一和第二电极中的一个中限定的真空端口抽真空至适于在第一和第二电极通电时从处理区域中的处理气体激发等离子体的压力。

    METHODS FOR REMOVING EXTRANEOUS AMOUNTS OF MOLDING MATERIAL FROM A SUBSTRATE
    9.
    发明申请
    METHODS FOR REMOVING EXTRANEOUS AMOUNTS OF MOLDING MATERIAL FROM A SUBSTRATE 审中-公开
    从基板上移除成型材料的特殊材料的方法

    公开(公告)号：US20060201910A1

    公开(公告)日：2006-09-14

    申请号：US11420840

    申请日：2006-05-30

    申请人： James Getty ,  Jiangang Zhao

    发明人： James Getty ,  Jiangang Zhao

    IPC分类号： C03C15/00

    CPC分类号： B29C59/14 ,  H01L21/56 ,  H01L2924/0002 ,  H05K3/288 ,  H01L2924/00

    摘要： Methods for removing thin layers of extraneous multi-component molding material from one or more areas on a substrate. The methods include exposing the substrate to a plasma effective to remove a non-particulate component of the molding material from each area. The methods further include exposing the substrate to a non-plasma process effective to remove a particulate component of the molding material from the area.

    摘要翻译： 从衬底上的一个或多个区域去除外部多组分成型材料薄层的方法。 所述方法包括将基板暴露于有效地从每个区域去除模制材料的非颗粒组分的等离子体。 所述方法还包括将衬底暴露于有效地从该区域去除模制材料的颗粒组分的非等离子体工艺。