摘要:
An assembly includes an optical device including an optical component and a plurality of supporting electrical components, a housing that is configured to house the optical component, a cap that is configured to substantially enclose the optical component in the housing, and a mounting member that is configured to removably electrically and mechanically connect the optical component to a printed board. In some examples, the housing does not house any electrical components of the optical device. The housing is physically separate from the mounting member and is configured to removably mechanically connect to the mounting member. The housing and mounting member define an electrically conductive pathway from the optical component to the printed board. When the cap is mechanically disconnected from the housing, the optical component may be exposed. The cap may also be configured to mechanically and optically connect an optical fiber assembly to the optical component.
摘要:
A system may include circuitry and a magnetoresistive random access memory (MRAM) die including at least one MRAM cell. The circuitry may be configured to detect attempted tampering with the MRAM die and generate a signal based on the detected attempted tampering. The signal may be sufficient to damage or destroy at least one layer of the at least one MRAM cell or a fuse electrically connected to a read line of the at least one MRAM cell.
摘要:
A system to control access to at least one protected device, the system comprising a test access port operable to mate with an external key device and an internal key device that is operable to receive synchronized cipher words during an idle state of the test access port from a removable external key device. The internal key device is also operable to receive test signals via the external key device and to input the received test signals to the protected device based on the synchronized cipher words. The protected device and the internal key device are one of located within a closed chassis, located under a protective security coating, located within a multi-chip-module, located within a closed integrated circuit package, and combinations thereof.
摘要:
Contents of a memory are encrypted using an encryption key that is generated based on a random number and a memory location at which the contents are stored. Each of a plurality of locations of a memory can be associated with a respective unique pointer value, and an encryption key may be generated based on the unique pointer value and the random number. In some examples, the random number is unique to a power-up cycle of a system comprising the memory or is generated based on a time at which the data to be stored by the memory at the selected memory location is written to the memory.
摘要:
A tamper-indicating assembly includes a container formed by a plurality of walls and a door mechanically coupled to at least one of the walls via a hinge. At least one cable extends at least partially through the hinge between the door and the at least one wall. The cable transmits a signal, and the assembly can identify potential tamper events related to opening and closing of the door based on changes in properties of the transmitted signal. Techniques for forming the assembly are also described.
摘要:
An external key device including a test access port connector adapted to mate with a test access port, a test equipment connector adapted to communicatively couple to test equipment, and an external encryption chip adapted to communicate signals through the test access port to an internal encryption chip. The internal encryption chip at least one of decrypts at least one test data input from the external encryption chip based on a password shared by the external encryption chip and the internal encryption chip and encrypts at least one test data output from a protected device. The external encryption chip at least one of decrypts at least one test data output from the protected device based on the shared password and encrypts at least one test data input generated by the test equipment.
摘要:
An anti-tamper enclosure system comprises an optical medium; at least one photosensitive sensor configured to measure at least one characteristic of a light wave transmitted in the optical medium; at least one logic circuit coupled to the at least one photosensitive sensor, the at least one logic circuit configured to initiate security measures when the at least one characteristic of the light wave changes; an enclosure coupled to the optical medium and configured to enclose the optical medium, the at least one photosensitive sensor, and the at least one logic circuit; and a plurality of attachment posts configured to be coupled to a printed circuit board, wherein at least one of the plurality of attachment posts is also coupled to the optical medium.
摘要:
A passive optical anti-tamper system including one or more light pipes, one or more light detectors and an alarm. The light pipes each include an input end and an output end and are located within a chassis with the one or more light detectors. The one or more light detectors are optically coupled to the output ends of the one or more light pipes. The alarm is operable to transmit a tamper-event-warning signal if an increased light level is detected by at least one detector.
摘要:
A method of recognizing a tamper event is provided. The method uses an optical medium having a unique signature, and transmits at least one light wave into the optical medium. The light wave is altered by the unique signature of the optical medium and at least one property of the light wave is measured. Access to at least a portion of a system is conditioned based on the at least one property of the light wave.
摘要:
In some examples, an integrated circuit system includes a plurality of integrated circuit layers. At least one of the integrated circuit layers includes an integrated circuit die, which may not include any through-silicon vias that provide a pathway to an adjacent integrated circuit layer, and an interposer portion, which includes electrically conductive through-vias. The interposer portion may facilitate communication of the integrated circuit die with other integrated circuit layers of the integrated circuit system. In some examples, the stacked integrated circuit system may include more than one integrated circuit die, which may be in the same integrated circuit layer as at least one other integrated circuit die, or may be in a different integrated circuit layer.