摘要:
Methods of forming air gaps in memory arrays and memory arrays with air gaps thus formed are disclosed. One such method may include forming an isolation region, having a first dielectric, through a charge-storage structure that is over a semiconductor, the isolation region extending into the semiconductor; forming a second dielectric over the isolation region and charge-storage structure; and forming an air gap in the isolation region so that the air gap passes through the charge-storage structure and so that a thickness of the first dielectric is between the air gap and the second dielectric.
摘要:
Methods of forming air gaps in memory arrays and memory arrays with air gaps thus formed are disclosed. One such method may include forming an isolation region, having a first dielectric, through a charge-storage structure that is over a semiconductor, the isolation region extending into the semiconductor; forming a second dielectric over the isolation region and charge-storage structure; and forming an air gap in the isolation region so that the air gap passes through the charge-storage structure and so that a thickness of the first dielectric is between the air gap and the second dielectric.
摘要:
Devices, memory arrays, and methods are disclosed. In an embodiment, one such device has a source/drain zone that has first and second active regions, and an isolation region and a dielectric plug between the first and second active regions. The dielectric plug may extend below upper surfaces of the first and second active regions and may be formed of a dielectric material having a lower removal rate than a dielectric material of the isolation region for a particular isotropic removal chemistry.
摘要:
Devices, memory arrays, and methods are disclosed. In an embodiment, one such device has a source/drain zone that has first and second active regions, and an isolation region and a dielectric plug between the first and second active regions. The dielectric plug may extend below upper surfaces of the first and second active regions and may be formed of a dielectric material having a lower removal rate than a dielectric material of the isolation region for a particular isotropic removal chemistry.
摘要:
3D NAND memory structures and related method are provided. In some embodiments such structures can include a control gate material and a floating gate material disposed between a first insulating layer and a second insulating layer, an interpoly dielectric (IPD) layer disposed between the floating gate material and control gate material such that the IPD layer electrically isolates the control gate material from the floating gate material, and a tunnel dielectric material deposited on the floating gate material opposite the control gate material.
摘要:
3D NAND memory structures and related method are provided. In some embodiments such structures can include a control gate material and a floating gate material disposed between a first insulating layer and a second insulating layer, an interpoly dielectric (IPD) layer disposed between the floating gate material and control gate material such that the IPD layer electrically isolates the control gate material from the floating gate material, and a tunnel dielectric material deposited on the floating gate material opposite the control gate material.
摘要:
Some embodiments include a semiconductor device having a stack structure including a source comprising polysilicon, an etch stop of oxide on the source, a select gate source on the etch stop, a charge storage structure over the select gate source, and a select gate drain over the charge storage structure. The semiconductor device may further include an opening extending vertically into the stack structure to a level adjacent to the source. A channel comprising polysilicon may be formed on a side surface and a bottom surface of the opening. The channel may contact the source at a lower portion of the opening, and may be laterally separated from the charge storage structure by a tunnel oxide. A width of the channel adjacent to the select gate source is greater than a width of the channel adjacent to the select gate drain.
摘要:
Embodiments of the present invention provide for methods of cleaning and disinfecting the vaginal area using electrolyzed water. The electrolyzed water may be applied to both the interior and exterior of the vaginal area. A particularly preferred embodiment provides for the application of Type C water to the vaginal area. Additional preferred embodiments provide for the application of Type B water to the vaginal area followed by the application of Type A water or Type C water to the vaginal area.
摘要:
Embodiments of the present invention provide for a method of cleaning and disinfecting the skin using electrolyzed water. A particularly preferred embodiment provides for the application of Type C water to the skin. Additional preferred embodiments provide for the application of Type B water to the skin followed by the application of Type A water or Type C water to the skin.
摘要:
A computer implemented method for searching an electronic database of product images, said method comprising the steps of: accessing a plurality of digital images of each of a plurality of products; segregating said images by color and product type; calculating the number of pixels for each color in each of said product images; dividing said colors into a plurality of discrete segments within the visible color spectrum; averaging the number of pixels for each color for each said image of a single product; applying a multiplier to blocks that exist within a cohesive quantized color group; normalizing said pixel count based on the percentage of the number of pixels within a predetermined range; storing said histogram into a database wherein each discrete segment has one value within the visual spectrum; and sorting the histograms in order of highest percentage of each color in the profile to lowest.