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公开(公告)号:US07301751B2
公开(公告)日:2007-11-27
申请号:US11229756
申请日:2005-09-19
申请人: Jea-Hyuck Lee , Young-Min Lee , Shi-Yun Cho , Shin-Hee Cho , Kyung-Wan Park
发明人: Jea-Hyuck Lee , Young-Min Lee , Shi-Yun Cho , Shin-Hee Cho , Kyung-Wan Park
CPC分类号: H01G4/228 , H01G4/30 , H05K1/162 , H05K3/4641 , H05K2201/0355 , H05K2201/09336 , H05K2201/09763
摘要: An embedded capacitor comprises a first substrate on which a plurality of electrically insulated electrode patterns and a ground pattern are formed, a second substrate separated from the first substrate, a plurality of dielectric layers stacked between the first and second substrates, a plurality of metal layers inserted between the dielectric layers and connected to the electrode patterns of the first substrate, and a plurality of ground layers inserted between the dielectric layers alternately with the metal layers.
摘要翻译: 嵌入式电容器包括:第一基板,其上形成有多个电绝缘电极图案和接地图案;与第一基板分离的第二基板,堆叠在第一和第二基板之间的多个电介质层,多个金属层 插入在电介质层之间并连接到第一衬底的电极图案,以及多个接地层与金属层交替地插入在电介质层之间。
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公开(公告)号:US20060098386A1
公开(公告)日:2006-05-11
申请号:US11229756
申请日:2005-09-19
申请人: Jea-Hyuck Lee , Young-Min Lee , Shi-Yun Cho , Shin-Hee Cho , Kyung-Wan Park
发明人: Jea-Hyuck Lee , Young-Min Lee , Shi-Yun Cho , Shin-Hee Cho , Kyung-Wan Park
IPC分类号: H01G4/30
CPC分类号: H01G4/228 , H01G4/30 , H05K1/162 , H05K3/4641 , H05K2201/0355 , H05K2201/09336 , H05K2201/09763
摘要: An embedded capacitor comprises a first substrate on which a plurality of electrically insulated electrode patterns and a ground pattern are formed, a second substrate separated from the first substrate, a plurality of dielectric layers stacked between the first and second substrates, a plurality of metal layers inserted between the dielectric layers and connected to the electrode patterns of the first substrate, and a plurality of ground layers inserted between the dielectric layers alternately with the metal layers.
摘要翻译: 嵌入式电容器包括:第一基板,其上形成有多个电绝缘电极图案和接地图案;与第一基板分离的第二基板,堆叠在第一和第二基板之间的多个电介质层,多个金属层 插入在电介质层之间并连接到第一衬底的电极图案,以及多个接地层与金属层交替地插入在电介质层之间。
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公开(公告)号:US20060142055A1
公开(公告)日:2006-06-29
申请号:US11114432
申请日:2005-04-26
申请人: Shi-Yun Cho , Young-Min Lee , Jea-Hyuck Lee , Shin-Hee Cho , Kyung-Wan Park
发明人: Shi-Yun Cho , Young-Min Lee , Jea-Hyuck Lee , Shin-Hee Cho , Kyung-Wan Park
CPC分类号: H01L25/162 , H01L23/50 , H01L23/66 , H01L2924/0002 , H01L2924/15192 , H01L2924/15311 , H01L2924/19105 , H05K1/0231 , H05K1/0237 , H05K1/0262 , H05K1/141 , H05K1/147 , H05K2201/10689 , H01L2924/00
摘要: A printed circuit board structure for a mobile terminal including a main printed circuit board including elements required for functions of the mobile terminal and mounted on an upper surface of the main printed circuit board, and an auxiliary printed circuit board laminated on the main printed circuit board including at least one element further required for the functions of the mobile terminal and mounted on an upper surface of the auxiliary printed circuit board.
摘要翻译: 一种用于移动终端的印刷电路板结构,包括主印刷电路板,其包括移动终端的功能所需的元件,并且安装在主印刷电路板的上表面上,以及叠层在主印刷电路板上的辅助印刷电路板 包括移动终端的功能进一步需要并安装在辅助印刷电路板的上表面上的至少一个元件。
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公开(公告)号:US20110157858A1
公开(公告)日:2011-06-30
申请号:US12974673
申请日:2010-12-21
申请人: Ji-Hyun Jung , Byung-Jik Kim , Shi-Yun Cho , Ho-Seong Seo , Kyung-Wan Park , Yeun-Ho Choi , Yu-Su Kim , Seok-Myong Kang
发明人: Ji-Hyun Jung , Byung-Jik Kim , Shi-Yun Cho , Ho-Seong Seo , Kyung-Wan Park , Yeun-Ho Choi , Yu-Su Kim , Seok-Myong Kang
IPC分类号: H05K1/14
CPC分类号: H01L25/0657 , H01L23/3128 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2225/0651 , H01L2225/06513 , H01L2225/06527 , H01L2924/00014 , H01L2924/01322 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: Provided is a System-In-Package (SIP) having embedded circuit boards in which boards are electrically connected and a plurality of chips are embedded in a board in a stacked manner. The SIP includes a first board on a surface of which a first circuit is formed, a second board which is provided on a top surface of the first board in a stacked manner and includes a plurality of chips embedded therein in a stacked manner, and a third board which is provided on a top surface of the second board in a stacked manner and on a surface of which a second circuit is formed.
摘要翻译: 提供了一种具有嵌入式电路板的系统级封装(SIP),其中板电连接,并且多个芯片以堆叠的方式嵌入在板中。 SIP包括在其表面上形成第一电路的第一板,以堆叠方式设置在第一板的顶表面上并且包括以堆叠方式嵌入其中的多个芯片的第二板,以及 第三板,其以层叠的方式设置在第二板的顶表面上,并且在其表面上形成第二电路。
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公开(公告)号:US08552302B2
公开(公告)日:2013-10-08
申请号:US12974763
申请日:2010-12-21
申请人: Kyung-Wan Park , Shi-Yun Cho , Byung-Jik Kim , Ho-Seong Seo , Youn-Ho Choi , Yu-Su Kim , Seok-Myong Kang , Ji-Hyun Jung
发明人: Kyung-Wan Park , Shi-Yun Cho , Byung-Jik Kim , Ho-Seong Seo , Youn-Ho Choi , Yu-Su Kim , Seok-Myong Kang , Ji-Hyun Jung
IPC分类号: H05K1/03
摘要: An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.
摘要翻译: 公开了一种嵌入式电路板,其包括形成有多个空腔的第一覆铜层压板,并且包括嵌入空腔中的具有不同厚度的多个芯片,设置在该空腔中的第二覆铜层压板,以使第一覆铜层压板达到 与芯片; 以及设置在第一和第二覆铜层压板的上表面上的树脂涂覆铜箔。
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公开(公告)号:US20080192449A1
公开(公告)日:2008-08-14
申请号:US12028864
申请日:2008-02-11
申请人: Dong-Churl Kim , Shi-Yun Cho , Hong-Kweun Kim , Kyu-Sub Kwak , Kyung-Wan Park , Seung-Woo Han
发明人: Dong-Churl Kim , Shi-Yun Cho , Hong-Kweun Kim , Kyu-Sub Kwak , Kyung-Wan Park , Seung-Woo Han
IPC分类号: H05K7/00
CPC分类号: H05K9/0022 , H01L23/3121 , H01L23/49811 , H01L23/50 , H01L2224/16225 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/3025 , H05K1/0218 , H05K3/284 , H05K2201/10318 , H05K2203/1316 , H01L2224/0401
摘要: An electric circuit package includes: a printed circuit substrate having an insulating layer and conductive pattern layers formed on an upper surface of the insulating layer; at least one of electronic parts disposed on an upper surface of the printed circuit substrate; at least one of conductive pins electrically connected to an conductive pattern layer providing grounding among the conductive pattern layers; and a molding member formed on the insulating layer in such a manner that the conductive pins and the electric parts are buried in the molding member, wherein each conductive pin has an upper surface exposed to an upper part of the molding member.
摘要翻译: 电路封装包括:印刷电路基板,其具有绝缘层和形成在所述绝缘层的上表面上的导电图案层; 设置在印刷电路基板的上表面上的电子部件中的至少一个; 至少一个导电引脚与导电图案层电连接,在导电图案层之间提供接地; 以及模制构件,其形成在所述绝缘层上,使得所述导电销和所述电气部件被埋在所述模制构件中,其中每个导电销具有暴露于所述模制构件的上部的上表面。
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公开(公告)号:US07213979B2
公开(公告)日:2007-05-08
申请号:US11108979
申请日:2005-04-19
申请人: Kyung-Wan Park
发明人: Kyung-Wan Park
CPC分类号: G02B6/4292 , G02B6/4246
摘要: Disclosed is a latching apparatus for a pluggable optical transceiver module, which is configured to enable the pluggable optical transceiver module to be plugged or unplugged by pulling the pluggable optical transceiver module. The latching apparatus of the pluggable optical transceiver module connected to an optical connector and electrically connected to a cage assembly includes: a module housing, which is extended in a length direction and used to latch and fix the pluggable optical transceiver module to the cage assembly; and a clip-type latch, which is assembled through the outer circumference of the module housing and used to release the module housing from the cage assembly by horizontally and vertically moving with respect to the length direction in response to pulling of the clip-type latch when the module housing is unplugged from the cage assembly.
摘要翻译: 公开了一种用于可插拔光收发器模块的锁定装置,其被配置为使得可插拔光收发器模块能够通过拉动可插拔光收发器模块来插拔电源。 可插拔光收发器模块的连接到光连接器并且电连接到保持架组件的闩锁装置包括:模块壳体,其在长度方向上延伸并用于将可插拔光收发器模块锁定并固定到保持架组件; 以及夹式闩锁,其通过模块壳体的外圆周组装并且用于响应于夹式闩锁的拉动而相对于长度方向水平和垂直移动而将模块壳体从保持架组件释放 当模块外壳从保持架组件拔出时。
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公开(公告)号:US20060093285A1
公开(公告)日:2006-05-04
申请号:US11108979
申请日:2005-04-19
申请人: Kyung-Wan Park
发明人: Kyung-Wan Park
CPC分类号: G02B6/4292 , G02B6/4246
摘要: Disclosed is a latching apparatus for a pluggable optical transceiver module, which is configured to enable the pluggable optical transceiver module to be plugged or unplugged by pulling the pluggable optical transceiver module. The latching apparatus of the pluggable optical transceiver module connected to an optical connector and electrically connected to a cage assembly includes: a module housing, which is extended in a length direction and used to latch and fix the pluggable optical transceiver module to the cage assembly; and a clip-type latch, which is assembled through the outer circumference of the module housing and used to release the module housing from the cage assembly by horizontally and vertically moving with respect to the length direction in response to pulling of the clip-type latch when the module housing is unplugged from the cage assembly.
摘要翻译: 公开了一种用于可插拔光收发器模块的锁定装置,其被配置为使得可插拔光收发器模块能够通过拉动可插拔光收发器模块来插拔电源。 可插拔光收发器模块的连接到光连接器并且电连接到保持架组件的闩锁装置包括:模块壳体,其在长度方向上延伸并用于将可插拔光收发器模块锁定并固定到保持架组件; 以及夹式闩锁,其通过模块壳体的外圆周组装并且用于响应于夹式闩锁的拉动而相对于长度方向水平和垂直移动而将模块壳体从保持架组件释放 当模块外壳从保持架组件拔出时。
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公开(公告)号:US20070152315A1
公开(公告)日:2007-07-05
申请号:US11521038
申请日:2006-09-14
申请人: Kyu-Sub Kwak , Kyung-Wan Park , Seung-Woo Han
发明人: Kyu-Sub Kwak , Kyung-Wan Park , Seung-Woo Han
IPC分类号: H01L23/02
CPC分类号: H01L25/0657 , H01L24/45 , H01L2224/05554 , H01L2224/16 , H01L2224/32145 , H01L2224/45139 , H01L2224/45144 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2924/01079 , H01L2924/10158 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A multi-die package and a method of fabrication is discloses. The multi-die package includes a package substrate, a first semiconductor die bonded directly on the package substrate and connected electrically with the package substrate, and a second semiconductor die having a groove providing a receiving space, bonded directly on the package substrate so that the first semiconductor die is covered by the groove, and connected electrically with the package substrate.
摘要翻译: 公开了一种多管芯封装及其制造方法。 多管芯封装包括封装基板,直接结合在封装基板上并与封装基板电连接的第一半导体管芯,以及具有提供容纳空间的沟槽的第二半导体管芯,其直接粘合在封装基板上, 第一半导体管芯被沟槽覆盖,并与封装基板电连接。
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