摘要:
A buffer for varying data access speed. Combining the buffer with a memory such as a double data rate synchronous dynamic random access memory, the data transmission rate of a memory system can be enhanced. The buffer is coupled with a control chip set and several memory modules to provide functions of data analysis and assembly to satisfy a two-way data transmission interface and to obtain a higher data transmission rate. The buffer also has the function of isolating the electric connection between two sides. A single signal interface from a memory module can be converted to a complementary source synchronous signal by the buffer, so that a high-speed data transmission can be achieved. A memory system can apply several of such buffers to achieve an even higher data transmission speed.
摘要:
A memory address driver circuit with memory module slots on a computer main board that can be divided into two groups. One group of memory module slots includes the slots whose trace line to a control chipset is smaller than 2500 mils or closest to the control chipset. The other group of memory module slots includes all the remaining slots. The control chipset includes two memory control circuits. The memory control circuit for supporting DDR DRAM is connected to the address leads of the memory module slot closest to the control chipset. However, no terminal resistors are connected to any address leads of the memory module slot. Hence, engineers may have to design one set of terminal resistors only. In addition, the memory control circuit uses one-cycle access command timing to boost system performance.
摘要:
A memory access control method and system is provided for use on a computer system to control the memory access operation by a central processing unit (CPU) to a memory unit in a more efficient manner than the prior art. This memory access control method and system is characterized by, for each read request from the CPU, the prompt transfer of the corresponding internal read-request signal to the memory control unit, right after it is issued and without waiting until the CPU issues the L1 write-back signal of the current read request. If the current read request is a hit to the cache memory, a read-stop signal is promptly issued to stop the current read operation on the memory unit, and then a cache write-back operation is performed to write the cache data back into the memory unit. This method and system can help reduce the period of waiting states by the CPU, thus increasing the overall memory access performance by the CPU and the overall system performance of the computer system.
摘要:
A motherboard with reduced power consumption is disclosed. The motherboard has a memory module slot, a DDR termination array, and a control chip. The DDR termination array couples to the memory module slot and provides a termination resistor that has one terminal coupled to a voltage source. The control chip provides a control signal. When the motherboard enters a power saving mode or before the memory module being inserted in the memory module slot, the control signal gives an indication to the DDR termination array for cutting off the connection between the termination resistor and the memory module slot. A switch and several termination resistors may substitute the DDR termination array as requirements. The control chip provides the control signal to open the switch and therefore cuts off the connections between termination resistors and the voltage source to achieve the power-conserving purpose.
摘要:
An integrated testing method is proposed to perform a test procedure on a number of computer components, concurrently, in a multitasking manner through software simulation. In this method, an initialization procedure is first performed to specify the total number of simulated operations, the FIFO buffer size, the command sequence, and the start time of operation. It is a characteristic feature of this integrated testing method that the test procedure is performed concurrently in a multitasking manner on all the components under test to operate in response to each command from the command sequence. In the event that two or more of the components under test are competing for the same resource, an arbiter is activated to perform arbitration for these competing components.
摘要:
An integrated testing method is proposed to perform a test procedure on a number of computer components, concurrently, in a multitasking manner through software simulation. In this method, an initialization procedure is first performed to specify the total number of simulated operations, the FIFO buffer size, the command sequence, and the start time of operation. It is a characteristic feature of this integrated testing method that the test procedure is performed concurrently in a multitasking manner on all the components under test to operate in response to each command from the command sequence. In the event that two or more of the components under test are competing for the same resource, an arbiter is activated to perform arbitration for these competing components.
摘要:
A software-based simulation system is provided, which can provide the combined functionality of a South Bridge test module and a North Bridge test module based solely on either one of the two modules, i.e., either the South Bridge test module or the North Bridge test module without having to use both. This software-based simulation system is characterized in the use of a PCI master modeling circuit and a PCI slave modeling circuit which are capable of simulating the functionality of the North Bridge chipset in the case that only the South Bridge chipset and no North Bridge chipset is included in the simulation system, and are further capable of simulating the functionality of the South Bridge chipset in the case that only the North Bridge chipset and no South Bridge chipset is included in the simulation system.
摘要:
A package substrate for a multi-package module. The package substrate comprises a substrate having a die region and at least one thermal channel region outwardly extending to an edge of the substrate from the die region. An array of bumps is arranged on the substrate except in the die and thermal channel regions, in which the interval between the bumps is narrower than the width of the thermal channel region. An electronic device with a package substrate is also disclosed.
摘要:
A package substrate for a multi-package module. The package substrate comprises a substrate having a die region and at least one thermal channel region outwardly extending to an edge of the substrate from the die region. An array of bumps is arranged on the substrate except in the die and thermal channel regions, in which the interval between the bumps is narrower than the width of the thermal channel region. An electronic device with a package substrate is also disclosed.
摘要:
A method for reducing power consumption of a computer system in a working state is provided. The computer system comprises a processor, a memory and a chipset, and the processor is connected with the chipset through a processor bus. The method comprises classifying the power saving level of the computer system into a predetermined number of power saving modes, checking at least one power saving mode transition condition to determine whether to automatically raise the power saving mode of the computer system, and raising the power saving mode of the computer system by lowering a first voltage supply level of the chipset and a second voltage supply level of the memory and decreasing a first working frequency of the processor bus and a second working frequency of the memory. The power consumption of the computer system is further reduced in comparison with a normal working state when the power saving mode of the computer system is further raised.