公开(公告)号：US06820219B1

公开(公告)日：2004-11-16

申请号：US09621750

申请日：2000-07-21

申请人： Hsiang-Chou Huang ,  Jiin Lai ,  Nai-Shung Chang

发明人： Hsiang-Chou Huang ,  Jiin Lai ,  Nai-Shung Chang

IPC分类号： G06F1100

CPC分类号： G06F11/261 ,  G06F11/263

摘要： An integrated testing method is proposed to perform a test procedure on a number of computer components, concurrently, in a multitasking manner through software simulation. In this method, an initialization procedure is first performed to specify the total number of simulated operations, the FIFO buffer size, the command sequence, and the start time of operation. It is a characteristic feature of this integrated testing method that the test procedure is performed concurrently in a multitasking manner on all the components under test to operate in response to each command from the command sequence. In the event that two or more of the components under test are competing for the same resource, an arbiter is activated to perform arbitration for these competing components.

摘要翻译： 提出了一种综合测试方法，通过软件仿真以多任务方式同时对多个计算机组件执行测试程序。 在该方法中，首先执行初始化过程以指定模拟操作的总数，FIFO缓冲器大小，命令序列和操作的开始时间。 这种集成测试方法的一个特征是测试程序以多任务方式并行执行所有被测组件，以响应命令序列中的每个命令进行操作。 在被测试的两个或更多个组件竞争相同资源的情况下，仲裁器被激活以对这些竞争组件执行仲裁。

公开(公告)号：US20050039083A1

公开(公告)日：2005-02-17

申请号：US10954509

申请日：2004-09-29

申请人： Hsiang-Chou Huang ,  Jiin Lai ,  Nai-Shung Chang

发明人： Hsiang-Chou Huang ,  Jiin Lai ,  Nai-Shung Chang

IPC分类号： G06F7/58 ,  G06F11/00 ,  G06F11/26 ,  G06F11/263

CPC分类号： G06F11/261 ,  G06F11/263

摘要： An integrated testing method is proposed to perform a test procedure on a number of computer components, concurrently, in a multitasking manner through software simulation. In this method, an initialization procedure is first performed to specify the total number of simulated operations, the FIFO buffer size, the command sequence, and the start time of operation. It is a characteristic feature of this integrated testing method that the test procedure is performed concurrently in a multitasking manner on all the components under test to operate in response to each command from the command sequence. In the event that two or more of the components under test are competing for the same resource, an arbiter is activated to perform arbitration for these competing components.

摘要翻译： 提出了一种综合测试方法，通过软件仿真以多任务方式同时对多个计算机组件执行测试程序。 在该方法中，首先执行初始化过程以指定模拟操作的总数，FIFO缓冲器大小，命令序列和操作的开始时间。 这种集成测试方法的一个特征是测试程序以多任务方式并行执行所有被测组件，以响应命令序列中的每个命令进行操作。 在被测试的两个或更多个组件竞争相同资源的情况下，仲裁器被激活以对这些竞争组件执行仲裁。

公开(公告)号：US06738880B2

公开(公告)日：2004-05-18

申请号：US09878896

申请日：2001-06-11

申请人： Jiin Lai ,  Chia-Hsin Chen ,  Nai-Shung Chang

发明人： Jiin Lai ,  Chia-Hsin Chen ,  Nai-Shung Chang

IPC分类号： G06F1300

CPC分类号： G11C7/1057 ,  G11C7/1051 ,  G11C7/106 ,  G11C7/1066 ,  G11C7/1078 ,  G11C7/1084 ,  G11C7/1087

摘要： A buffer for varying data access speed. Combining the buffer with a memory such as a double data rate synchronous dynamic random access memory, the data transmission rate of a memory system can be enhanced. The buffer is coupled with a control chip set and several memory modules to provide functions of data analysis and assembly to satisfy a two-way data transmission interface and to obtain a higher data transmission rate. The buffer also has the function of isolating the electric connection between two sides. A single signal interface from a memory module can be converted to a complementary source synchronous signal by the buffer, so that a high-speed data transmission can be achieved. A memory system can apply several of such buffers to achieve an even higher data transmission speed.

摘要翻译： 一种用于改变数据访问速度的缓冲区。 将缓冲器与诸如双倍数据速率同步动态随机存取存储器的存储器组合，可以提高存储器系统的数据传输速率。 缓冲器与控制芯片组和多个存储器模块耦合，以提供数据分析和组装的功能，以满足双向数据传输接口并获得更高的数据传输速率。 缓冲器还具有隔离两侧电气连接的功能。 来自存储器模块的单个信号接口可以由缓冲器转换成互补源同步信号，从而可以实现高速数据传输。 存储器系统可以应用若干这样的缓冲器以实现甚至更高的数据传输速度。

公开(公告)号：US06484281B1

公开(公告)日：2002-11-19

申请号：US09459763

申请日：1999-12-13

申请人： Hsuan-Yi Wang ,  Jiin Lai ,  Nai-Shung Chang

发明人： Hsuan-Yi Wang ,  Jiin Lai ,  Nai-Shung Chang

IPC分类号： G01R3128

CPC分类号： G01R31/318342

摘要： A software-based simulation system is provided, which can provide the combined functionality of a South Bridge test module and a North Bridge test module based solely on either one of the two modules, i.e., either the South Bridge test module or the North Bridge test module without having to use both. This software-based simulation system is characterized in the use of a PCI master modeling circuit and a PCI slave modeling circuit which are capable of simulating the functionality of the North Bridge chipset in the case that only the South Bridge chipset and no North Bridge chipset is included in the simulation system, and are further capable of simulating the functionality of the South Bridge chipset in the case that only the North Bridge chipset and no South Bridge chipset is included in the simulation system.

摘要翻译： 提供了一个基于软件的仿真系统，可以提供南桥测试模块和北桥测试模块的组合功能，该模块仅基于两个模块之一，即南桥测试模块或北桥测试 模块，而不必使用两者。 该基于软件的仿真系统的特征在于使用PCI主建模电路和PCI从属建模电路，其能够模拟北桥芯片组的功能，仅在南桥芯片组和北桥芯片组为 包括在仿真系统中，并且在模拟系统中仅包括北桥芯片组且没有南桥芯片组的情况下，还能够模拟南桥芯片组的功能。

公开(公告)号：US07723843B2

公开(公告)日：2010-05-25

申请号：US12354152

申请日：2009-01-15

申请人： Chih-Hsiung Lin ,  Nai-Shung Chang

发明人： Chih-Hsiung Lin ,  Nai-Shung Chang

IPC分类号： H01L23/34

CPC分类号： H01L23/367 ,  H01L23/3677 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15321

摘要： A package substrate for a multi-package module. The package substrate comprises a substrate having a die region and at least one thermal channel region outwardly extending to an edge of the substrate from the die region. An array of bumps is arranged on the substrate except in the die and thermal channel regions, in which the interval between the bumps is narrower than the width of the thermal channel region. An electronic device with a package substrate is also disclosed.

摘要翻译： 一种用于多封装模块的封装衬底。 封装衬底包括具有管芯区域和从管芯区域向外延伸到衬底的边缘的至少一个热通道区域的衬底。 凸起之间的间隔比热通道区域的宽度窄，在芯片和热通道区域之外的基板上配置有凸块排列。 还公开了一种具有封装基板的电子器件。

公开(公告)号：US07525182B2

公开(公告)日：2009-04-28

申请号：US11243121

申请日：2005-10-04

申请人： Chih-Hsiung Lin ,  Nai-Shung Chang

发明人： Chih-Hsiung Lin ,  Nai-Shung Chang

IPC分类号： H01L23/495

CPC分类号： H01L23/367 ,  H01L23/3677 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15321

摘要： A package substrate for a multi-package module. The package substrate comprises a substrate having a die region and at least one thermal channel region outwardly extending to an edge of the substrate from the die region. An array of bumps is arranged on the substrate except in the die and thermal channel regions, in which the interval between the bumps is narrower than the width of the thermal channel region. An electronic device with a package substrate is also disclosed.

摘要翻译： 一种用于多封装模块的封装衬底。 封装衬底包括具有管芯区域和从管芯区域向外延伸到衬底的边缘的至少一个热通道区域的衬底。 凸起之间的间隔比热通道区域的宽度窄，在芯片和热通道区域之外的基板上配置有凸块排列。 还公开了一种具有封装基板的电子器件。

公开(公告)号：US20070288782A1

公开(公告)日：2007-12-13

申请号：US11423722

申请日：2006-06-13

申请人： Nai-Shung Chang ,  Chia-Hsing Yu

发明人： Nai-Shung Chang ,  Chia-Hsing Yu

IPC分类号： G06F1/00

CPC分类号： G06F1/324 ,  G06F1/3225 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/172

摘要： A method for reducing power consumption of a computer system in a working state is provided. The computer system comprises a processor, a memory and a chipset, and the processor is connected with the chipset through a processor bus. The method comprises classifying the power saving level of the computer system into a predetermined number of power saving modes, checking at least one power saving mode transition condition to determine whether to automatically raise the power saving mode of the computer system, and raising the power saving mode of the computer system by lowering a first voltage supply level of the chipset and a second voltage supply level of the memory and decreasing a first working frequency of the processor bus and a second working frequency of the memory. The power consumption of the computer system is further reduced in comparison with a normal working state when the power saving mode of the computer system is further raised.

摘要翻译： 提供了一种降低处于工作状态的计算机系统的功耗的方法。 计算机系统包括处理器，存储器和芯片组，并且处理器通过处理器总线与芯片组连接。 该方法包括将计算机系统的省电水平分为预定数量的省电模式，检查至少一个省电模式转换条件，以确定是否自动提高计算机系统的省电模式，并提高节电 通过降低芯片组的第一电压供应电平和存储器的第二电压供应电平并降低处理器总线的第一工作频率和存储器的第二工作频率来实现计算机系统的模式。 当计算机系统的省电模式进一步提高时，与正常工作状态相比，计算机系统的功耗进一步降低。

公开(公告)号：US06946731B2

公开(公告)日：2005-09-20

申请号：US10173231

申请日：2002-06-14

申请人： Nai-Shung Chang ,  Shu-Hui Chen ,  Tsai-Sheng Chen ,  Chia-Hsing Yu

发明人： Nai-Shung Chang ,  Shu-Hui Chen ,  Tsai-Sheng Chen ,  Chia-Hsing Yu

IPC分类号： H01L23/34 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/52 ,  H01L29/00 ,  H01L31/00 ,  H05K1/11 ,  H05K1/18

CPC分类号： H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： This invention relates to a layout structure for providing stable power supply to a four-layer motherboard and a main bridge chip substrate. In the invention, on the top signal layer and power path of the bottom solder layer for layout of the main bridge chip and on the power ring, the decoupling capacitors are connected in between the ground bonding pads/solder balls and the power bonding pads/solder balls of the power paths and power rings, so as to provide a stable power supply for the operation of the main bridge chip. In this invention, the ground bonding pad/solder ball connected with each power bonding pad/solder ball can be the closest ground bonding pad/solder ball to the power bonding pad/solder ball. In addition, in the embodiment of the main bridge chip substrate, decoupling capacitors can be disposed at four corners of the power ring or underneath the bonding wires, or can be packaged inside the molding compound.

公开(公告)号：US06944783B2

公开(公告)日：2005-09-13

申请号：US10037896

申请日：2001-10-22

申请人： Chia-Hsing Yu ,  Nai-Shung Chang

发明人： Chia-Hsing Yu ,  Nai-Shung Chang

IPC分类号： G06F1/26

CPC分类号： G06F1/26

摘要： A power controller for a computer system capable of supporting multiple processor types. The power controller receives a voltage identification signal from the microprocessor and a microprocessor selection signal from a motherboard to provide a correct voltage specification signal and terminal voltage to the microprocessor. The invention also provides voltage specification signals and terminal voltages to the motherboard of a computer system that can support a multiple of processor types.

摘要翻译： 一种能够支持多种处理器类型的计算机系统的电源控制器。 功率控制器接收来自微处理器的电压识别信号和来自母板的微处理器选择信号，以向微处理器提供正确的电压指定信号和端电压。 本发明还向可以支持多种处理器类型的计算机系统的主板提供电压指定信号和端电压。

公开(公告)号：US20050033909A1

公开(公告)日：2005-02-10

申请号：US10707106

申请日：2003-11-20

申请人： Nai-Shung Chang ,  Chunhung Chen ,  Wei Lee

发明人： Nai-Shung Chang ,  Chunhung Chen ,  Wei Lee

IPC分类号： G06F12/00 ,  G06F13/16

CPC分类号： G06F13/1684

摘要： A motherboard utilizing a single-channel memory controller to control multiple DRAMs. The motherboard includes a first memory slot, a second memory slot, and a single-channel memory controller. The memory controller is connected to the first memory slot and the second memory slot respectively through a first bus and a second bus.

摘要翻译： 使用单通道存储器控制器来控制多个DRAM的主板。 主板包括第一存储器插槽，第二存储器插槽和单通道存储器控制器。 存储器控制器分别通过第一总线和第二总线连接到第一存储器插槽和第二存储器插槽。