公开(公告)号：US08021967B2

公开(公告)日：2011-09-20

申请号：US11264759

申请日：2005-10-31

申请人： Jijie Zhou ,  Michael Bronikowski ,  Flavio Noca ,  Elijah B. Sansom

发明人： Jijie Zhou ,  Michael Bronikowski ,  Flavio Noca ,  Elijah B. Sansom

IPC分类号： H01L21/20 ,  H01L21/36

CPC分类号： B01L3/502792 ,  B01F13/0086 ,  B01L3/5023 ,  B01L2200/0621 ,  B01L2300/0681 ,  B01L2300/0825 ,  B01L2300/089 ,  B01L2300/0896 ,  B01L2400/0406 ,  B01L2400/0448 ,  B01L2400/0688 ,  B82Y30/00

摘要： A fluid transport method and fluid transport device are disclosed. Nanoscale fibers disposed in a patterned configuration allow transport of a fluid in absence of an external power source. The device may include two or more fluid transport components having different fluid transport efficiencies. The components may be separated by additional fluid transport components, to control fluid flow.

摘要翻译： 公开了一种流体输送方法和流体输送装置。 以图案化构造布置的纳米级纤维允许在不存在外部电源的情况下输送流体。 该装置可以包括具有不同流体输送效率的两个或多个流体输送部件。 这些部件可以通过附加的流体输送部件分离，以控制流体流动。

公开(公告)号：US07491628B2

公开(公告)日：2009-02-17

申请号：US11124523

申请日：2005-05-05

申请人： Flavio Noca ,  Elijah B. Sansom ,  Jijie Zhou ,  Morteza Gharib

发明人： Flavio Noca ,  Elijah B. Sansom ,  Jijie Zhou ,  Morteza Gharib

IPC分类号： H01L21/20 ,  H01L21/36

CPC分类号： B82B3/00 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  H01J9/025 ,  H01J2201/30469 ,  H01J2329/00 ,  Y10S977/742

摘要： A method of assembling large numbers of nanoscale structures in pre-determined ways using fluids or capillary lithography to control the patterning and arrangement of the individual nanoscale objects and nanostructures formed in accordance with the inventive method are provided. In summary, the current method uses the controlled dispersion and evaporation of fluids to form controlled patterns of nanoscale objects or features anchored on a substrate, such as nanoscale fibers like carbon nanotubes.

摘要翻译： 提供了一种使用流体或毛细管光刻法以预定方式组装大量纳米尺度结构以控制根据本发明方法形成的单个纳米尺度物体和纳米结构的图案化和排列的方法。 总之，当前的方法使用受控的流体分散和蒸发来形成受控的纳米级物体或锚定在基底上的特征，例如纳米级纤维如碳纳米管。

公开(公告)号：US20070099311A1

公开(公告)日：2007-05-03

申请号：US11264759

申请日：2005-10-31

申请人： Jijie Zhou ,  Michael Bronikowski ,  Flavio Noca ,  Elijah Sansom

发明人： Jijie Zhou ,  Michael Bronikowski ,  Flavio Noca ,  Elijah Sansom

IPC分类号： H01L21/00

CPC分类号： B01L3/502792 ,  B01F13/0086 ,  B01L3/5023 ,  B01L2200/0621 ,  B01L2300/0681 ,  B01L2300/0825 ,  B01L2300/089 ,  B01L2300/0896 ,  B01L2400/0406 ,  B01L2400/0448 ,  B01L2400/0688 ,  B82Y30/00

摘要： A fluid transport method and fluid transport device are disclosed. Nanoscale fibers disposed in a patterned configuration allow transport of a fluid in absence of an external power source. The device may include two or more fluid transport components having different fluid transport efficiencies. The components may be separated by additional fluid transport components, to control fluid flow.

摘要翻译： 公开了一种流体输送方法和流体输送装置。 以图案化构造布置的纳米级纤维允许在不存在外部电源的情况下输送流体。 该装置可以包括具有不同流体输送效率的两个或多个流体输送部件。 这些部件可以通过附加的流体输送部件分离，以控制流体流动。

公开(公告)号：US07163385B2

公开(公告)日：2007-01-16

申请号：US10382721

申请日：2003-03-04

申请人： Morteza Gharib ,  Anna Iwaniec ,  Jijie Zhou ,  Flavio Noca

发明人： Morteza Gharib ,  Anna Iwaniec ,  Jijie Zhou ,  Flavio Noca

IPC分类号： F04B43/08

CPC分类号： F04B43/08

摘要： A hydro-elastic pumping system formed from an elastic tube element having attached end members with different hydroimpedance properties, wherein the elastic element is pinched with certain frequency and duty cycle to form asymmetric forces that pump fluid.

摘要翻译： 一种由弹性管元件形成的液压弹性抽吸系统，该弹性管元件具有不同的阻力性质的附接端部构件，其中弹性元件以一定的频率和占空比被挤压以形成泵送流体的不对称力。

公开(公告)号：US20060088848A1

公开(公告)日：2006-04-27

申请号：US11124523

申请日：2005-05-05

申请人： Flavio Noca ,  Elijah Sansom ,  Jijie Zhou ,  Morteza Gharib

发明人： Flavio Noca ,  Elijah Sansom ,  Jijie Zhou ,  Morteza Gharib

IPC分类号： C12Q1/68 ,  C12M3/00 ,  H01L21/00

CPC分类号： B82B3/00 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  H01J9/025 ,  H01J2201/30469 ,  H01J2329/00 ,  Y10S977/742

摘要： A method of assembling large numbers of nanoscale structures in pre-determined ways using fluids or capillary lithography to control the patterning and arrangement of the individual nanoscale objects and nanostructures formed in accordance with the inventive method are provided. In summary, the current method uses the controlled dispersion and evaporation of fluids to form controlled patterns of nanoscale objects or features anchored on a substrate, such as nanoscale fibers like carbon nanotubes.

公开(公告)号：US20130012016A1

公开(公告)日：2013-01-10

申请号：US13545844

申请日：2012-07-10

申请人： Tong Yan Tee ,  Xueren Zhang ,  Shanzhong Wang ,  Valeriy Nosik ,  Jijie Zhou ,  Sridhar Idapalapati ,  Subodh Mhaisalkar ,  Zhi Yuan Shane Loo

发明人： Tong Yan Tee ,  Xueren Zhang ,  Shanzhong Wang ,  Valeriy Nosik ,  Jijie Zhou ,  Sridhar Idapalapati ,  Subodh Mhaisalkar ,  Zhi Yuan Shane Loo

IPC分类号： H01L21/768 ,  B82Y99/00 ,  B82Y40/00

CPC分类号： H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  Y10S977/742 ,  Y10S977/785 ,  H01L2924/00

摘要： A protection layer is coated or otherwise formed over the interconnect structure. The interconnect structure includes a metal line (such as top and bottom metal layers connected by a metal via) and a low-K material. The protection layer includes a vertically aligned dielectric or other material dispersed with carbon nanotubes. The protection layer could include one or multiple layers of carbon nanotubes, and the carbon nanotubes could have any suitable dispersion, alignment, and pattern in each layer of the protection layer. Among other things, the carbon nanotubes help to reduce or prevent damage to the interconnect structure, such as by reducing or preventing the collapse of the low-K material or delamination between the metal line and the low-K material.

摘要翻译： 在互连结构上涂覆或以其它方式形成保护层。 互连结构包括金属线（例如通过金属通孔连接的顶部和底部金属层）和低K材料。 保护层包括垂直排列的电介质或分散有碳纳米管的其它材料。 保护层可以包括一层或多层碳纳米管，并且碳纳米管可以在保护层的每个层中具有任何合适的分散体，取向和图案。 除其他之外，碳纳米管有助于减少或防止互连结构的损坏，例如通过减少或防止低K材料的塌陷或金属线与低K材料之间的分层。

公开(公告)号：US20090239338A1

公开(公告)日：2009-09-24

申请号：US11937210

申请日：2007-11-08

申请人： Jijie Zhou ,  Zhong Chen

发明人： Jijie Zhou ,  Zhong Chen

IPC分类号： H01L21/50 ,  H01L21/60

CPC分类号： H01L24/13 ,  B82Y10/00 ,  B82Y30/00 ,  H01L23/53276 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00015 ,  H01L2224/05552

摘要： The present invention relates to a method of forming a wire bond-free conductive interconnect area on a semiconductor substrate. A semiconductor substrate with an electrically conductive protrusion, defining a bond pad, is provided as well as a plurality of carbon nanotubes. The plurality of carbon nanotubes is immobilized on the bond pad by allowing at least one random portion along the length of the carbon nanotubes to attach to the surface of the bond pad. Thus an aggregate of loops of carbon nanotubes is formed on the surface of the bond pad. Thereby a conductive interconnect area is formed on the electrically conductive protrusion without heat treatment.

摘要翻译： 本发明涉及一种在半导体衬底上形成无接线的导电互连区域的方法。 提供了具有限定接合焊盘的导电突起的半导体衬底以及多个碳纳米管。 通过允许沿着碳纳米管的长度的至少一个随机部分附着到接合焊盘的表面，将多个碳纳米管固定在接合焊盘上。 因此，在接合焊盘的表面上形成碳纳米管的集合体。 由此，在不进行热处理的情况下，在导电性突起上形成导电配线区域。

公开(公告)号：US08486824B2

公开(公告)日：2013-07-16

申请号：US13545844

申请日：2012-07-10

申请人： Tong Yan Tee ,  Xueren Zhang ,  Shanzhong Wang ,  Valeriy Nosik ,  Jijie Zhou ,  Sridhar Idapalapati ,  Subodh Mhaisalkar ,  Zhi Yuan Shane Loo

发明人： Tong Yan Tee ,  Xueren Zhang ,  Shanzhong Wang ,  Valeriy Nosik ,  Jijie Zhou ,  Sridhar Idapalapati ,  Subodh Mhaisalkar ,  Zhi Yuan Shane Loo

IPC分类号： H01L21/768 ,  H01L21/56

CPC分类号： H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  Y10S977/742 ,  Y10S977/785 ,  H01L2924/00

摘要： A protection layer is coated or otherwise formed over the interconnect structure. The interconnect structure includes a metal line (such as top and bottom metal layers connected by a metal via) and a low-K material. The protection layer includes a vertically aligned dielectric or other material dispersed with carbon nanotubes. The protection layer could include one or multiple layers of carbon nanotubes, and the carbon nanotubes could have any suitable dispersion, alignment, and pattern in each layer of the protection layer. Among other things, the carbon nanotubes help to reduce or prevent damage to the interconnect structure, such as by reducing or preventing the collapse of the low-K material or delamination between the metal line and the low-K material.

摘要翻译： 在互连结构上涂覆或以其它方式形成保护层。 互连结构包括金属线（例如通过金属通孔连接的顶部和底部金属层）和低K材料。 保护层包括垂直排列的电介质或分散有碳纳米管的其它材料。 保护层可以包括一层或多层碳纳米管，并且碳纳米管可以在保护层的每个层中具有任何合适的分散体，取向和图案。 除其他之外，碳纳米管有助于减少或防止互连结构的损坏，例如通过减少或防止低K材料的塌陷或金属线与低K材料之间的分层。

公开(公告)号：US20070216032A1

公开(公告)日：2007-09-20

申请号：US11715261

申请日：2007-03-07

申请人： Tong Tee ,  Xueren Zhang ,  Shanzhong Wang ,  Valeriy Nosik ,  Jijie Zhou ,  Sridhar Idapalapati ,  Subodh Mhaisalkar ,  Zhi Yuan Loo

发明人： Tong Tee ,  Xueren Zhang ,  Shanzhong Wang ,  Valeriy Nosik ,  Jijie Zhou ,  Sridhar Idapalapati ,  Subodh Mhaisalkar ,  Zhi Yuan Loo

IPC分类号： H01L23/48

CPC分类号： H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  Y10S977/742 ,  Y10S977/785 ,  H01L2924/00

摘要： A protection layer is coated or otherwise formed over the interconnect structure. The interconnect structure includes a metal line (such as top and bottom metal layers connected by a metal via) and a low-K material. The protection layer includes a vertically aligned dielectric or other material dispersed with carbon nanotubes. The protection layer could include one or multiple layers of carbon nanotubes, and the carbon nanotubes could have any suitable dispersion, alignment, and pattern in each layer of the protection layer. Among other things, the carbon nanotubes help to reduce or prevent damage to the interconnect structure, such as by reducing or preventing the collapse of the low-K material or delamination between the metal line and the low-K material.

摘要翻译： 在互连结构上涂覆或以其它方式形成保护层。 互连结构包括金属线（例如通过金属通孔连接的顶部和底部金属层）和低K材料。 保护层包括垂直排列的电介质或分散有碳纳米管的其它材料。 保护层可以包括一层或多层碳纳米管，并且碳纳米管可以在保护层的每个层中具有任何合适的分散体，取向和图案。 除其他之外，碳纳米管有助于减少或防止互连结构的损坏，例如通过减少或防止低K材料的塌陷或金属线与低K材料之间的分层。

公开(公告)号：US08647922B2

公开(公告)日：2014-02-11

申请号：US11937210

申请日：2007-11-08

申请人： Jijie Zhou ,  Zhong Chen

发明人： Jijie Zhou ,  Zhong Chen

IPC分类号： H01L21/50 ,  H01L21/60

CPC分类号： H01L24/13 ,  B82Y10/00 ,  B82Y30/00 ,  H01L23/53276 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00015 ,  H01L2224/05552

摘要： The present invention relates to a method of forming a wire bond-free conductive interconnect area on a semiconductor substrate. A semiconductor substrate with an electrically conductive protrusion, defining a bond pad, is provided as well as a plurality of carbon nanotubes. The plurality of carbon nanotubes is immobilized on the bond pad by allowing at least one random portion along the length of the carbon nanotubes to attach to the surface of the bond pad. Thus an aggregate of loops of carbon nanotubes is formed on the surface of the bond pad. Thereby a conductive interconnect area is formed on the electrically conductive protrusion without heat treatment.

摘要翻译： 本发明涉及一种在半导体衬底上形成无接线导电互连区域的方法。 提供了具有限定接合焊盘的导电突起的半导体衬底以及多个碳纳米管。 通过允许沿着碳纳米管的长度的至少一个随机部分附着到接合焊盘的表面，将多个碳纳米管固定在接合焊盘上。 因此，在接合焊盘的表面上形成碳纳米管的集合体。 由此，在不进行热处理的情况下，在导电性突起上形成导电配线区域。