公开(公告)号：US09000584B2

公开(公告)日：2015-04-07

申请号：US13338820

申请日：2011-12-28

申请人： Jing-Cheng Lin ,  Jui-Pin Hung ,  Nai-Wei Liu ,  Yi-Chao Mao ,  Wan-Ting Shih ,  Tsan-Hua Tung

发明人： Jing-Cheng Lin ,  Jui-Pin Hung ,  Nai-Wei Liu ,  Yi-Chao Mao ,  Wan-Ting Shih ,  Tsan-Hua Tung

IPC分类号： H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

CPC分类号： H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L24/03 ,  H01L24/19 ,  H01L24/20 ,  H01L24/82 ,  H01L2224/0231 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/821 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00

摘要： The mechanisms of forming a molding compound on a semiconductor device substrate to enable fan-out structures in wafer-level packaging (WLP) are provided. The mechanisms involve covering portions of surfaces of an insulating layer surrounding a contact pad. The mechanisms improve reliability of the package and process control of the packaging process. The mechanisms also reduce the risk of interfacial delamination, and excessive outgassing of the insulating layer during subsequent processing. The mechanisms further improve planarization end-point. By utilizing a protective layer between the contact pad and the insulating layer, copper out-diffusion can be reduced and the adhesion between the contact pad and the insulating layer may also be improved.

摘要翻译： 提供了在半导体器件基板上形成模制化合物以使得晶片级封装（WLP）中的扇出结构能够实现的机制。 这些机构涉及覆盖围绕接触垫的绝缘层的表面的部分。 这些机制提高了包装的可靠性和包装过程的过程控制。 这些机理还降低了界面分层的风险，并且在后续处理过程中绝缘层过度消除气泡。 这些机制进一步改善了平面化终点。 通过利用接触焊盘和绝缘层之间的保护层，可以减少铜外扩散，并且还可以提高接触焊盘和绝缘层之间的粘附。

公开(公告)号：US09117682B2

公开(公告)日：2015-08-25

申请号：US13270850

申请日：2011-10-11

申请人： Jing-Cheng Lin ,  Jui-Pin Hung ,  Yi-Hang Lin ,  Tsan-Hua Tung

发明人： Jing-Cheng Lin ,  Jui-Pin Hung ,  Yi-Hang Lin ,  Tsan-Hua Tung

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L23/538 ,  H01L23/498

CPC分类号： H01L21/78 ,  H01L21/31051 ,  H01L21/561 ,  H01L21/565 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/19 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/0237 ,  H01L2224/02379 ,  H01L2224/03002 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05552 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/11002 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/96 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/07025 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00

摘要： Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.

摘要翻译： 公开了封装半导体器件的方法及其结构。 在一个实施例中，一种封装半导体器件的方法包括提供载体晶片，提供多个管芯，以及在载体晶片上形成管芯洞穴材料。 在模具洞穴材料中形成多个模具洞穴。 将多个模具中的至少一个放置在模具洞穴材料中的多个模具洞穴的每一个中。 形成多个封装，所述多个封装中的每个封装形成在所述多个管芯中的相应的至少一个管芯上。

公开(公告)号：US20130087916A1

公开(公告)日：2013-04-11

申请号：US13270850

申请日：2011-10-11

申请人： Jing-Cheng Lin ,  Jui-Pin Hung ,  Yi-Hang Lin ,  Tsan-Hua Tung

发明人： Jing-Cheng Lin ,  Jui-Pin Hung ,  Yi-Hang Lin ,  Tsan-Hua Tung

IPC分类号： H01L23/498 ,  H01L21/60 ,  H01L21/50

CPC分类号： H01L21/78 ,  H01L21/31051 ,  H01L21/561 ,  H01L21/565 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/19 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/0237 ,  H01L2224/02379 ,  H01L2224/03002 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05552 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/11002 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/96 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/07025 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00

摘要： Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.

公开(公告)号：US20120153520A1

公开(公告)日：2012-06-21

申请号：US13101676

申请日：2011-05-05

申请人： Dean-Mo LIU ,  Tsan-Hua Tung ,  Hongwei Cheng

发明人： Dean-Mo LIU ,  Tsan-Hua Tung ,  Hongwei Cheng

IPC分类号： B01J13/02 ,  C08B37/08

CPC分类号： A61K9/1075 ,  A61K47/36

摘要： The invention discloses the synthesis of a new-type chitosan-based hybrid macromolecule and a method for producing or using the macromolecule. This macromolecule comprises an amphiphatic chitosan and a silicon-based coupling agent that is anchored by a chemical bonding. The method for producing the hybrid macromolecule can be easily operated under ambient environment. The produced macromolecule can be self-assembled in an aqueous environment to form a nanocarrier, and has the ability to efficiently encapsulate drugs for a subsequent sustained release purpose. This self-assembled hybrid nanocarrier demonstrated features of excellent biocompatibility, drug loading ability and cellular uptake efficiency.

摘要翻译： 本发明公开了新型壳聚糖类杂合大分子的合成及其制备方法。 该大分子包含通过化学键合锚定的两亲性壳聚糖和硅基偶联剂。 混合高分子的制造方法可以容易地在周围环境下进行。 所制备的大分子可以在水性环境中自组装形成纳米载体，并具有有效地包封药物用于随后的缓释目的的能力。 这种自组装的混合纳米载体表现出优异的生物相容性，药物负载能力和细胞摄取效率的特征。