专利检索 ap:("Jing-Cheng Lin" OR "Jui-Pin Hung" OR "Nai-Wei Liu" OR "Yi-Chao Mao" OR "Wan-Ting Shih" OR "Tsan-Hua Tung") AND inv:"Yi-Chao Mao" 第 1 页

1.

发明授权
Packaged semiconductor device with a molding compound and a method of forming the same 有权
标题翻译：具有模塑料的封装半导体器件及其形成方法

公开(公告)号：US09000584B2

公开(公告)日：2015-04-07

申请号：US13338820

申请日：2011-12-28

申请人： Jing-Cheng Lin , Jui-Pin Hung , Nai-Wei Liu , Yi-Chao Mao , Wan-Ting Shih , Tsan-Hua Tung

发明人： Jing-Cheng Lin , Jui-Pin Hung , Nai-Wei Liu , Yi-Chao Mao , Wan-Ting Shih , Tsan-Hua Tung

IPC分类号： H01L23/498 , H01L23/31 , H01L23/00 , H01L21/56

CPC分类号： H01L21/56 , H01L21/561 , H01L21/568 , H01L21/78 , H01L23/3114 , H01L23/3128 , H01L24/03 , H01L24/19 , H01L24/20 , H01L24/82 , H01L2224/0231 , H01L2224/04105 , H01L2224/12105 , H01L2224/821 , H01L2924/12042 , H01L2924/181 , H01L2924/00

摘要： The mechanisms of forming a molding compound on a semiconductor device substrate to enable fan-out structures in wafer-level packaging (WLP) are provided. The mechanisms involve covering portions of surfaces of an insulating layer surrounding a contact pad. The mechanisms improve reliability of the package and process control of the packaging process. The mechanisms also reduce the risk of interfacial delamination, and excessive outgassing of the insulating layer during subsequent processing. The mechanisms further improve planarization end-point. By utilizing a protective layer between the contact pad and the insulating layer, copper out-diffusion can be reduced and the adhesion between the contact pad and the insulating layer may also be improved.

摘要翻译： 提供了在半导体器件基板上形成模制化合物以使得晶片级封装（WLP）中的扇出结构能够实现的机制。这些机构涉及覆盖围绕接触垫的绝缘层的表面的部分。这些机制提高了包装的可靠性和包装过程的过程控制。这些机理还降低了界面分层的风险，并且在后续处理过程中绝缘层过度消除气泡。这些机制进一步改善了平面化终点。通过利用接触焊盘和绝缘层之间的保护层，可以减少铜外扩散，并且还可以提高接触焊盘和绝缘层之间的粘附。

2.

发明授权
Packaging methods and structures using a die attach film 有权
标题翻译：使用管芯附着膜的包装方法和结构

公开(公告)号：US09064879B2

公开(公告)日：2015-06-23

申请号：US13228244

申请日：2011-09-08

申请人： Jui-Pin Hung , Jing-Cheng Lin , Nai-Wei Liu , Chin-Chuan Chang , Chen-Hua Yu , Shin-Puu Jeng , Chin-Fu Kao , Yi-Chao Mao , Szu Wei Lu

发明人： Jui-Pin Hung , Jing-Cheng Lin , Nai-Wei Liu , Chin-Chuan Chang , Chen-Hua Yu , Shin-Puu Jeng , Chin-Fu Kao , Yi-Chao Mao , Szu Wei Lu

IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L23/48 , H01L23/52 , H01L29/40 , H01L21/56 , H01L23/14 , H01L23/498 , H01L23/538 , H01L21/683 , H01L23/31 , H01L23/00

CPC分类号： H01L21/561 , H01L21/568 , H01L21/6836 , H01L23/147 , H01L23/3114 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/81 , H01L24/96 , H01L24/97 , H01L2221/68345 , H01L2221/68359 , H01L2221/68377 , H01L2224/0401 , H01L2224/05008 , H01L2224/05022 , H01L2224/05099 , H01L2224/05569 , H01L2224/05572 , H01L2224/05599 , H01L2224/11002 , H01L2224/12105 , H01L2224/13022 , H01L2224/16225 , H01L2224/16227 , H01L2224/73267 , H01L2224/83191 , H01L2224/96 , H01L2224/97 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/18161 , H01L2924/18162 , H01L2924/3511 , H01L2224/11 , H01L2224/81 , H01L2224/05552 , H01L2924/00

摘要： Packaging methods and structures for semiconductor devices that utilize a novel die attach film are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer and forming a die attach film (DAF) that includes a polymer over the carrier wafer. A plurality of dies is attached to the DAF, and the plurality of dies is packaged. At least the carrier wafer is removed from the packaged dies, and the packaged dies are singulated.

摘要翻译： 公开了利用新颖的芯片附着膜的半导体器件的封装方法和结构。在一个实施例中，封装半导体器件的方法包括提供载体晶片并且在载体晶片上形成包括聚合物的管芯附着膜（DAF）。多个模具附接到DAF，并且多个管芯被封装。至少载体晶片从封装的管芯移除，并且封装的管芯被切割。

3.

发明申请
Packaging Methods and Structures Using a Die Attach Film 有权
标题翻译：使用模具附着膜的包装方法和结构

公开(公告)号：US20130062760A1

公开(公告)日：2013-03-14

申请号：US13228244

申请日：2011-09-08

申请人： Jui-Pin Hung , Jing-Cheng Lin , Nai-Wei Liu , Chin-Chuan Chang , Chen-Hua Yu , Shin-Puu Jeng , Chin-Fu Kao , Yi-Chao Mao , Szu Wei Lu

发明人： Jui-Pin Hung , Jing-Cheng Lin , Nai-Wei Liu , Chin-Chuan Chang , Chen-Hua Yu , Shin-Puu Jeng , Chin-Fu Kao , Yi-Chao Mao , Szu Wei Lu

IPC分类号： H01L23/498 , H01L21/60 , H01L21/56

CPC分类号： H01L21/561 , H01L21/568 , H01L21/6836 , H01L23/147 , H01L23/3114 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/81 , H01L24/96 , H01L24/97 , H01L2221/68345 , H01L2221/68359 , H01L2221/68377 , H01L2224/0401 , H01L2224/05008 , H01L2224/05022 , H01L2224/05099 , H01L2224/05569 , H01L2224/05572 , H01L2224/05599 , H01L2224/11002 , H01L2224/12105 , H01L2224/13022 , H01L2224/16225 , H01L2224/16227 , H01L2224/73267 , H01L2224/83191 , H01L2224/96 , H01L2224/97 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/18161 , H01L2924/18162 , H01L2924/3511 , H01L2224/11 , H01L2224/81 , H01L2224/05552 , H01L2924/00

摘要： Packaging methods and structures for semiconductor devices that utilize a novel die attach film are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer and forming a die attach film (DAF) that includes a polymer over the carrier wafer. A plurality of dies is attached to the DAF, and the plurality of dies is packaged. At least the carrier wafer is removed from the packaged dies, and the packaged dies are singulated.

摘要翻译： 公开了利用新颖的芯片附着膜的半导体器件的封装方法和结构。在一个实施例中，封装半导体器件的方法包括提供载体晶片并且在载体晶片上形成包括聚合物的管芯附着膜（DAF）。多个模具附接到DAF，并且多个管芯被封装。至少载体晶片从封装的管芯移除，并且封装的管芯被切割。

4.

发明申请
End Point Detection in Grinding 有权
标题翻译：研磨中的终点检测

公开(公告)号：US20130115854A1

公开(公告)日：2013-05-09

申请号：US13290879

申请日：2011-11-07

申请人： Yi-Chao Mao , Jui-Pin Hung , Jing-Cheng Lin , Shin-Puu Jeng , Chen-Hua Yu

发明人： Yi-Chao Mao , Jui-Pin Hung , Jing-Cheng Lin , Shin-Puu Jeng , Chen-Hua Yu

IPC分类号： B24B49/10

CPC分类号： H01L22/26 , B24B7/228 , B24B37/013 , B24B49/10 , H01L22/12 , H01L23/3114 , H01L2924/0002 , H01L2924/00

摘要： A method for performing grinding includes selecting a target wheel loading for wafer grinding processes, and performing a grinding process on a wafer. With the proceeding of the grinding process, wheel loadings of the grinding process are measured. The grinding process is stopped after the target wheel loading is reached. The method alternatively includes selecting a target reflectivity of wafer grinding processes, and performing a grinding process on a wafer. With a proceeding of the grinding process, reflectivities of a light reflected from a surface of the wafer are measured. The grinding process is stopped after one of the reflectivities reaches the target reflectivity.

摘要翻译： 执行磨削的方法包括：选择用于晶片研磨工艺的目标轮加载，以及对晶片进行研磨处理。随着研磨过程的进行，测量研磨过程的轮载荷。在达到目标轮加载后停止研磨过程。该方法或者包括选择晶片研磨过程的目标反射率，以及对晶片进行研磨处理。随着研磨过程的进行，测量从晶片表面反射的光的反射率。在一个反射率达到目标反射率之后停止研磨过程。

5.

发明授权
End point detection in grinding 有权

公开(公告)号：US09960088B2

公开(公告)日：2018-05-01

申请号：US13290879

申请日：2011-11-07

申请人： Yi-Chao Mao , Jui-Pin Hung , Jing-Cheng Lin , Shin-Puu Jeng , Chen-Hua Yu

发明人： Yi-Chao Mao , Jui-Pin Hung , Jing-Cheng Lin , Shin-Puu Jeng , Chen-Hua Yu

IPC分类号： B24B49/10 , H01L21/66 , B24B37/013 , B24B7/22 , H01L23/31

CPC分类号： H01L22/26 , B24B7/228 , B24B37/013 , B24B49/10 , H01L22/12 , H01L23/3114 , H01L2924/0002 , H01L2924/00

摘要： A method for performing grinding includes selecting a target wheel loading for wafer grinding processes, and performing a grinding process on a wafer. With the proceeding of the grinding process, wheel loadings of the grinding process are measured. The grinding process is stopped after the target wheel loading is reached. The method alternatively includes selecting a target reflectivity of wafer grinding processes, and performing a grinding process on a wafer. With a proceeding of the grinding process, reflectivities of a light reflected from a surface of the wafer are measured. The grinding process is stopped after one of the reflectivities reaches the target reflectivity.