MICROMECHANICAL STRUCTURE
    1.
    发明申请
    MICROMECHANICAL STRUCTURE 审中-公开
    微观结构

    公开(公告)号:US20140116134A1

    公开(公告)日:2014-05-01

    申请号:US14061970

    申请日:2013-10-24

    CPC classification number: G01C19/5712

    Abstract: Micromechanical structure, in particular a yaw rate sensor having a substrate including a main plane of extent for detecting a first yaw rate about a first direction perpendicular to the main plane, a second yaw rate about a second direction parallel to the main plane, and a third yaw rate about a third direction parallel to the main plane and perpendicular to the second direction, includes a rotational oscillating element driven to rotational oscillation about a rotational axis parallel to the first direction. The micromechanical structure includes a yaw rate sensor configuration for detecting the first yaw rate that is completely surrounded by the rotational oscillating element in a plane parallel to the main plane. The micromechanical structure includes at least one first connection of the yaw rate sensor configuration on the rotational oscillating element, and at least one second connection of the yaw rate sensor configuration on the substrate.

    Abstract translation: 微机械结构,特别是具有基板的偏航率传感器,该基板包括用于检测围绕垂直于主平面的第一方向的第一横摆率的扩展主平面,与主平面平行的第二方向的第二横摆率,以及 围绕平行于主平面并垂直于第二方向的第三方向的第三偏转速度包括绕平行于第一方向的旋转轴线旋转振荡的旋转振荡元件。 该微机械结构包括用于检测在与主平面平行的平面中由旋转振动元件完全包围的第一横摆角速度的偏航率传感器构造。 微机械结构包括旋转振动元件上的横摆率传感器构造的至少一个第一连接以及基板上的横摆率传感器构造的至少一个第二连接。

    Method for manufacturing a hybrid integrated component
    4.
    发明授权
    Method for manufacturing a hybrid integrated component 有权
    混合集成部件的制造方法

    公开(公告)号:US09067778B2

    公开(公告)日:2015-06-30

    申请号:US13865825

    申请日:2013-04-18

    Abstract: A manufacturing method for hybrid integrated components having a very high degree of miniaturization is provided, which hybrid integrated components each have at least two MEMS elements each having at least one assigned ASIC element. Two MEMS/ASIC wafer stacks are initially created independently of one another in that two ASIC substrates are processed independently of one another; a semiconductor substrate is mounted on the processed surface of each of the two ASIC substrates, and a micromechanical structure is subsequently created in each of the two semiconductor substrates. The two MEMS/ASIC wafer stacks are mounted on top of each other, MEMS on MEMS. Only subsequently are the components separated.

    Abstract translation: 提供了一种具有非常高的小型化的混合集成部件的制造方法,这些混合集成部件各自具有至少两个具有至少一个分配的ASIC元件的MEMS元件。 最初独立地创建两个MEMS / ASIC晶片堆叠,因为两个ASIC基板彼此独立地被处理; 将半导体衬底安装在两个ASIC衬底中的每一个的处理表面上,随后在两个半导体衬底中的每一个中形成微机械结构。 两个MEMS / ASIC晶片堆叠安装在MEMS之上。 只有随后的组件分离。

    Yaw rate sensor
    7.
    发明授权
    Yaw rate sensor 有权
    偏航率传感器

    公开(公告)号:US08695425B2

    公开(公告)日:2014-04-15

    申请号:US13138102

    申请日:2009-12-03

    Inventor: Johannes Classen

    CPC classification number: G01C19/5747

    Abstract: A yaw rate sensor includes a substrate having a substrate surface, a first movable element, which is disposed above the substrate surface and has a drive frame and a first detection mass, a first electrode, which is disposed at a distance underneath the first detection mass and connected to the substrate surface, and a second electrode which is disposed at a distance above the first detection mass and connected to the substrate surface. The drive frame is connected to the substrate via at least one drive spring, the detection mass is connected to the drive frame via at least one detection spring, and the first movable element is excitable to a drive oscillation parallel to the substrate surface, and the first detection mass is deflectable perpendicular to the substrate surface.

    Abstract translation: 横摆率传感器包括具有基板表面的基板,设置在基板表面上方并具有驱动框架和第一检测块的第一可移动元件,第一电极,设置在第一检测质量下方一定距离处 并连接到所述基板表面,以及第二电极,所述第二电极设置在所述第一检测质量块的上方并连接到所述基板表面。 驱动框架经由至少一个驱动弹簧连接到基板,检测质量块经由至少一个检测弹簧连接到驱动框架,并且第一可移动元件可激发到平行于基板表面的驱动振荡,并且 第一检测质量可垂直于基底表面偏转。

    Micromechanical structure, method for manufacturing a micromechanical structure, and use of a micromechanical structure
    8.
    发明授权
    Micromechanical structure, method for manufacturing a micromechanical structure, and use of a micromechanical structure 有权
    微机械结构,微机械结构的制造方法以及微机械结构的使用

    公开(公告)号:US08530982B2

    公开(公告)日:2013-09-10

    申请号:US12924160

    申请日:2010-09-21

    CPC classification number: G01C19/5783 B81B2201/025 B81C1/00166

    Abstract: A micromechanical structure which includes a substrate having a main plane of extension, and a seismic mass which is movable relative to the substrate. The micromechanical structure includes a fixed electrode which is connected to the substrate, and a counterelectrode which is connected to the seismic mass. The fixed electrode has a first fixed electrode region and a second fixed electrode region which is connected in an electrically conductive manner to the first fixed electrode region. The counterelectrode is partially situated between the first and the second fixed electrode region, perpendicular to the main plane of extension.

    Abstract translation: 一种微机械结构,其包括具有主平面延伸的基板和相对于基板可移动的地震质量。 微机械结构包括连接到基板的固定电极和连接到地震块的反电极。 固定电极具有第一固定电极区域和与导电方式连接到第一固定电极区域的第二固定电极区域。 反电极部分地位于第一和第二固定电极区域之间,垂直于主延伸平面。

    Method for compensating for quadrature
    9.
    发明授权
    Method for compensating for quadrature 有权
    补偿正交的方法

    公开(公告)号:US08479555B2

    公开(公告)日:2013-07-09

    申请号:US12645010

    申请日:2009-12-22

    CPC classification number: G01C19/5755 G01C19/5726

    Abstract: A method for compensating for the quadrature of a micromechanical structure, the micromechanical structure having a substrate having a main extension plane, a seismic mass that is attached by spring elements to the substrate, and first and second compensation electrodes anchored to the substrate; in response to application of a first quadrature voltage between the first compensation electrode and the seismic mass, a first compensation force being produced on the seismic mass and, in response to application of a second quadrature voltage between the second compensation electrode and the seismic mass, a second compensation force being produced on the seismic mass and, in addition, the second quadrature voltage being adjusted as a function of the first quadrature voltage.

    Abstract translation: 一种用于补偿微机械结构的正交的方法,所述微机械结构具有具有主延伸平面的基板,通过弹簧元件附接到所述基板的地震质量以及锚定到所述基板的第一和第二补偿电极; 响应于在第一补偿电极和地震质量之间施加第一正交电压,在地震质量上产生第一补偿力,并且响应于在第二补偿电极和地震块之间施加第二正交电压, 在地震质量上产生第二补偿力,此外,第二正交电压被调整为第一正交电压的函数。

    Micromechanical structure and method for manufacturing a micromechanical structure
    10.
    发明授权
    Micromechanical structure and method for manufacturing a micromechanical structure 有权
    微机械结构的微机械结构和制造方法

    公开(公告)号:US08443671B2

    公开(公告)日:2013-05-21

    申请号:US12924641

    申请日:2010-10-01

    Abstract: A micromechanical structure includes: a substrate; a seismic mass movable relative to the substrate along a first direction parallel to a main plane of extension of the substrate; a first electrode structure is connected to the substrate; and a second electrode structure connected to the substrate. The seismic mass includes a counterelectrode structure having finger electrodes situated between first finger electrodes of the first electrode structure and second finger electrodes of the second electrode structure, along the first direction. The first electrode structure is fastened to the substrate by a first anchoring element in a central region of the micromechanical structure, and the second electrode structure is anchored to the substrate by a second anchoring element situated in the central region.

    Abstract translation: 微机械结构包括:基板; 沿着平行于所述基板的延伸主平面的第一方向相对于所述基板移动的地震质量块; 第一电极结构连接到基板; 以及与基板连接的第二电极结构。 地震质量包括沿着第一方向具有位于第一电极结构的第一指状电极和第二电极结构的第二指状电极之间的指状电极的反电极结构。 第一电极结构通过微机电结构的中心区域中的第一锚定元件紧固到基板,并且第二电极结构通过位于中心区域中的第二锚定元件锚定到基板。

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