APPARATUS AND METHODS FOR FABRICATION OF THIN FILM ELECTRONIC DEVICES AND CIRCUITS
    10.
    发明申请
    APPARATUS AND METHODS FOR FABRICATION OF THIN FILM ELECTRONIC DEVICES AND CIRCUITS 审中-公开
    薄膜电子器件和电路的制造方法和装置

    公开(公告)号:US20080171422A1

    公开(公告)日:2008-07-17

    申请号:US11622209

    申请日:2007-01-11

    IPC分类号: H01L21/20 H01L21/36

    CPC分类号: H01L51/001 Y02E10/549

    摘要: Methods and systems for forming layered electronic devices on a flexible, elongated substrate are described. The layered electronic devices include at least one electronically or optically active layer. Deposition of one more layers of the electronic devices occurs as the flexible substrate is moved through one or more deposition stations. At each deposition station the substrate is aligned with an aperture mask having apertures arranged in a pattern. The aperture mask and the substrate are brought into proximity over a portion of a circumference of a rotating drum. A layer of the layered electronic devices is formed by deposition of material through the apertures of the aperture mask. At each deposition station, registration between at least two layers of the layered electronic devices is maintained.

    摘要翻译: 描述了在柔性细长衬底上形成分层电子器件的方法和系统。 分层电子器件包括至少一个电子或光学有源层。 当柔性基板移动通过一个或多个沉积站时,会发生一层电子设备的沉积。 在每个沉积站处,基板与具有以图案布置的孔的孔径掩模对准。 孔径掩模和基底在旋转鼓的圆周的一部分附近。 层状电子器件的层通过孔径掩模的孔隙沉积材料形成。 在每个沉积站处,保持至少两层分层电子器件之间的对准。