SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS
    7.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS 审中-公开
    半导体发光装置和发光装置

    公开(公告)号:US20130020554A1

    公开(公告)日:2013-01-24

    申请号:US13553998

    申请日:2012-07-20

    IPC分类号: H01L27/15

    摘要: There is provided a semiconductor light emitting device and a light emitting apparatus. The semiconductor light emitting device includes a light emitting diode (LED) part disposed on one region of a light transmissive substrate and including a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer; and a Zener diode part disposed on the other region of the light transmissive substrate and including a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer.

    摘要翻译: 提供了一种半导体发光器件和发光设备。 半导体发光器件包括:发光二极管(LED)部,其设置在透光基板的一个区域上,并且包括第一导电型半导体层,有源层和第二导电型半导体层; 以及齐纳二极管部,其设置在所述透光性基板的另一区域上,并且包括第一导电型半导体层,有源层和第二导电型半导体层。

    Method of manufacturing vertical light emitting diode
    8.
    发明授权
    Method of manufacturing vertical light emitting diode 有权
    制造垂直发光二极管的方法

    公开(公告)号:US07838315B2

    公开(公告)日:2010-11-23

    申请号:US12155277

    申请日:2008-06-02

    IPC分类号: H01L21/00

    摘要: Provided is a method of manufacturing a vertical LED, the method including the steps of: preparing a sapphire substrate; forming a light emitting structure in which an n-type nitride semiconductor layer, an active layer, and a p-type nitride semiconductor layer are sequentially laminated on the sapphire substrate; forming a p-electrode on the p-type nitride semiconductor layer; forming a structure support layer on the p-electrode; removing the sapphire substrate through an LLO (laser lift-off) process; isolating the light emitting structure into unit LED elements through an ISO (isolation) process; and forming an n-electrode on each of the n-type nitride semiconductor layers of the isolated light emitting structures.

    摘要翻译: 提供一种制造垂直LED的方法,该方法包括以下步骤:制备蓝宝石衬底; 形成其中n型氮化物半导体层,有源层和p型氮化物半导体层依次层压在蓝宝石衬底上的发光结构; 在p型氮化物半导体层上形成p电极; 在p电极上形成结构支撑层; 通过LLO(激光剥离)工艺去除蓝宝石衬底; 通过ISO(隔离)工艺将发光结构隔离成单元LED元件; 以及在隔离的发光结构的n型氮化物半导体层的每一个上形成n电极。

    Method of manufacturing vertical light emitting diode
    9.
    发明申请
    Method of manufacturing vertical light emitting diode 有权
    制造垂直发光二极管的方法

    公开(公告)号:US20090137075A1

    公开(公告)日:2009-05-28

    申请号:US12155277

    申请日:2008-06-02

    IPC分类号: H01L33/00

    摘要: Provided is a method of manufacturing a vertical LED, the method including the steps of: preparing a sapphire substrate; forming a light emitting structure in which an n-type nitride semiconductor layer, an active layer, and a p-type nitride semiconductor layer are sequentially laminated on the sapphire substrate; forming a p-electrode on the p-type nitride semiconductor layer; forming a structure support layer on the p-electrode; removing the sapphire substrate through an LLO (laser lift-off) process; isolating the light emitting structure into unit LED elements through an ISO (isolation) process; and forming an n-electrode on each of the n-type nitride semiconductor layers of the isolated light emitting structures.

    摘要翻译: 提供一种制造垂直LED的方法,该方法包括以下步骤:制备蓝宝石衬底; 形成其中n型氮化物半导体层,有源层和p型氮化物半导体层依次层压在蓝宝石衬底上的发光结构; 在p型氮化物半导体层上形成p电极; 在p电极上形成结构支撑层; 通过LLO(激光剥离)工艺去除蓝宝石衬底; 通过ISO(隔离)工艺将发光结构隔离成单元LED元件; 以及在隔离的发光结构的n型氮化物半导体层的每一个上形成n电极。

    Nitride semiconductor single crystal substrate, and methods of fabricating the same and a vertical nitride semiconductor light emitting diode using the same
    10.
    发明授权
    Nitride semiconductor single crystal substrate, and methods of fabricating the same and a vertical nitride semiconductor light emitting diode using the same 有权
    氮化物半导体单晶衬底及其制造方法以及使用其的垂直氮化物半导体发光二极管

    公开(公告)号:US07859086B2

    公开(公告)日:2010-12-28

    申请号:US11723065

    申请日:2007-03-16

    IPC分类号: H01L33/00 H01L29/04 H01L29/12

    摘要: A nitride semiconductor single crystal substrate, a manufacturing method thereof and a method for manufacturing a vertical nitride semiconductor device using the same. According to an aspect of the invention, in the nitride semiconductor single crystal substrate, upper and lower regions are divided along a thickness direction, the nitride single crystal substrate having a thickness of at least 100 μm. Here, the upper region has a doping concentration that is five times or greater than that of the lower region. Preferably, a top surface of the substrate in the upper region has Ga polarity. Also, according to a specific embodiment of the invention, the lower region is intentionally un-doped and the upper region is n-doped. Preferably, each of the upper and lower regions has a doping concentration substantially identical in a thickness direction.

    摘要翻译: 氮化物半导体单晶衬底,其制造方法和使用其的垂直氮化物半导体器件的制造方法。 根据本发明的一个方面,在氮化物半导体单晶衬底中,沿着厚度方向分割上部和下部区域,所述氮化物单晶衬底的厚度至少为100μm。 这里,上部区域的掺杂浓度为下部区域的5倍以上。 优选地,上部区域中的基板的顶表面具有Ga极性。 此外,根据本发明的具体实施例,下部区域有意地未掺杂,并且上部区域是n掺杂的。 优选地,上部区域和下部区域中的每一个具有在厚度方向上基本相同的掺杂浓度。