Method of manufacturing vertical light emitting diode
    5.
    发明申请
    Method of manufacturing vertical light emitting diode 有权
    制造垂直发光二极管的方法

    公开(公告)号:US20090137075A1

    公开(公告)日:2009-05-28

    申请号:US12155277

    申请日:2008-06-02

    IPC分类号: H01L33/00

    摘要: Provided is a method of manufacturing a vertical LED, the method including the steps of: preparing a sapphire substrate; forming a light emitting structure in which an n-type nitride semiconductor layer, an active layer, and a p-type nitride semiconductor layer are sequentially laminated on the sapphire substrate; forming a p-electrode on the p-type nitride semiconductor layer; forming a structure support layer on the p-electrode; removing the sapphire substrate through an LLO (laser lift-off) process; isolating the light emitting structure into unit LED elements through an ISO (isolation) process; and forming an n-electrode on each of the n-type nitride semiconductor layers of the isolated light emitting structures.

    摘要翻译: 提供一种制造垂直LED的方法,该方法包括以下步骤:制备蓝宝石衬底; 形成其中n型氮化物半导体层,有源层和p型氮化物半导体层依次层压在蓝宝石衬底上的发光结构; 在p型氮化物半导体层上形成p电极; 在p电极上形成结构支撑层; 通过LLO(激光剥离)工艺去除蓝宝石衬底; 通过ISO(隔离)工艺将发光结构隔离成单元LED元件; 以及在隔离的发光结构的n型氮化物半导体层的每一个上形成n电极。

    Method of manufacturing vertical light emitting diode
    6.
    发明授权
    Method of manufacturing vertical light emitting diode 有权
    制造垂直发光二极管的方法

    公开(公告)号:US07838315B2

    公开(公告)日:2010-11-23

    申请号:US12155277

    申请日:2008-06-02

    IPC分类号: H01L21/00

    摘要: Provided is a method of manufacturing a vertical LED, the method including the steps of: preparing a sapphire substrate; forming a light emitting structure in which an n-type nitride semiconductor layer, an active layer, and a p-type nitride semiconductor layer are sequentially laminated on the sapphire substrate; forming a p-electrode on the p-type nitride semiconductor layer; forming a structure support layer on the p-electrode; removing the sapphire substrate through an LLO (laser lift-off) process; isolating the light emitting structure into unit LED elements through an ISO (isolation) process; and forming an n-electrode on each of the n-type nitride semiconductor layers of the isolated light emitting structures.

    摘要翻译: 提供一种制造垂直LED的方法,该方法包括以下步骤:制备蓝宝石衬底; 形成其中n型氮化物半导体层,有源层和p型氮化物半导体层依次层压在蓝宝石衬底上的发光结构; 在p型氮化物半导体层上形成p电极; 在p电极上形成结构支撑层; 通过LLO(激光剥离)工艺去除蓝宝石衬底; 通过ISO(隔离)工艺将发光结构隔离成单元LED元件; 以及在隔离的发光结构的n型氮化物半导体层的每一个上形成n电极。

    Semiconductor light emitting device and method of manufacturing the same
    10.
    发明授权
    Semiconductor light emitting device and method of manufacturing the same 失效
    半导体发光器件及其制造方法

    公开(公告)号:US07968893B2

    公开(公告)日:2011-06-28

    申请号:US12210472

    申请日:2008-09-15

    CPC分类号: H01L33/40 H01L33/32

    摘要: Disclosed are a semiconductor light emitting device, which can improve characteristics of the semiconductor light emitting device such as a forward voltage characteristic and a turn-on voltage characteristic, increase light emission efficiency by lowering an input voltage, and increase reliability of the semiconductor light emitting device by a low-voltage operation, and a method of manufacturing the same. The semiconductor light emitting device includes: an n-type GaN semiconductor layer; an active layer formed on a gallium face of the n-type GaN semiconductor layer; a p-type semiconductor layer formed on the active layer; and an n-type electrode formed on a nitrogen face of the n-type GaN semiconductor layer and including a lanthanum (La)-nickel (Ni) alloy.

    摘要翻译: 公开了一种半导体发光器件,其能够提高半导体发光器件的特性,例如正向电压特性和导通电压特性,通过降低输入电压来提高发光效率,并提高半导体发光器件的可靠性 器件的低压工作及其制造方法。 半导体发光器件包括:n型GaN半导体层; 形成在所述n型GaN半导体层的镓面上的有源层; 形成在有源层上的p型半导体层; 以及形成在n型GaN半导体层的氮面上并包含镧(La) - 镍(Ni)合金的n型电极。