THIN FILM TRANSISTOR, THIN FILM TRANSISTOR ARRAY PANEL, AND METHOD OF MANUFACTURING A THIN FILM TRANSISTOR ARRAY PANEL
    5.
    发明申请
    THIN FILM TRANSISTOR, THIN FILM TRANSISTOR ARRAY PANEL, AND METHOD OF MANUFACTURING A THIN FILM TRANSISTOR ARRAY PANEL 有权
    薄膜晶体管,薄膜晶体管阵列,以及制造薄膜晶体管阵列的方法

    公开(公告)号:US20130277666A1

    公开(公告)日:2013-10-24

    申请号:US13612590

    申请日:2012-09-12

    CPC分类号: H01L27/1225

    摘要: A thin film transistor array panel according to an exemplary embodiment of the invention includes: a substrate; a gate line positioned on the substrate and including a gate electrode; a gate insulating layer positioned on the gate line; an oxide semiconductor layer positioned on the substrate; a source electrode and a drain electrode positioned on the oxide semiconductor layer; a first insulating layer positioned on the source electrode and the drain electrode and including a first contact hole; a data line positioned on the first insulating layer and intersecting the gate line; and a pixel electrode over the first insulating layer. The source electrode and the drain electrode each comprise a metal oxide. The data line is electrically connected to the source electrode through the first contact hole.

    摘要翻译: 根据本发明的示例性实施例的薄膜晶体管阵列面板包括:基板; 位于所述基板上并包括栅电极的栅极线; 位于栅极线上的栅极绝缘层; 位于所述基板上的氧化物半导体层; 位于所述氧化物半导体层上的源电极和漏极; 位于所述源电极和所述漏极上并且包括第一接触孔的第一绝缘层; 位于所述第一绝缘层上且与所述栅极线相交的数据线; 以及在所述第一绝缘层上方的像素电极。 源电极和漏极各自包含金属氧化物。 数据线通过第一接触孔与源电极电连接。

    THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING TRENCH, METAL WIRE, AND THIN FILM TRANSISTOR ARRAY PANEL
    6.
    发明申请
    THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING TRENCH, METAL WIRE, AND THIN FILM TRANSISTOR ARRAY PANEL 有权
    薄膜晶体管和制造TRENCH,金属线和薄膜晶体管阵列的方法

    公开(公告)号:US20130183822A1

    公开(公告)日:2013-07-18

    申请号:US13480242

    申请日:2012-05-24

    IPC分类号: H01L21/28

    摘要: The present invention relates to a method for forming a trench that can remove residual particles in a trench using a metal mask, a method for forming a metal wire, and a method for manufacturing a thin film transistor array panel. The method for forming a trench includes: forming a first insulating layer on a substrate; forming a first metal layer on the first insulating layer; forming an opening by patterning the first metal layer; forming a trench by dry-etching the first insulating layer using the patterned first metal layer as a mask; and wet-etching the substrate. The dry-etching is performed using a main etching gas and a first auxiliary etching gas, and the first auxiliary etching gas includes argon.

    摘要翻译: 本发明涉及使用金属掩模形成沟槽中的残留颗粒的形成方法,金属线形成方法以及薄膜晶体管阵列板的制造方法。 形成沟槽的方法包括:在衬底上形成第一绝缘层; 在所述第一绝缘层上形成第一金属层; 通过图案化第一金属层形成开口; 通过使用图案化的第一金属层作为掩模对第一绝缘层进行干蚀刻来形成沟槽; 并湿法蚀刻基板。 使用主蚀刻气体和第一辅助蚀刻气体进行干蚀刻,并且第一辅助蚀刻气体包括氩。