Memory cell with trench transistor
    1.
    发明授权
    Memory cell with trench transistor 有权
    具有沟槽晶体管的存储单元

    公开(公告)号:US06661053B2

    公开(公告)日:2003-12-09

    申请号:US10022654

    申请日:2001-12-18

    IPC分类号: H01L2976

    摘要: A memory cell includes a storage transistor having the following structure and being dimensioned to shorten program and erase times. A semiconductor body includes a top surface and a trench formed therein having walls joined by a curved bottom. A source zone in the semiconductor body is doped from the top surface. A drain zone in the semiconductor body is doped from the top surface. Junctions of the source and drain zones are beneath each. A gate electrode on the top surface of the semiconductor body is disposed between the source zone and the drain zone in the trench. A dielectric layer isolates the gate electrode from the semiconductor body and acts as a storage medium. Each of the junctions intersects a respective one of the walls at a respective depth from the bottom. A respective spacing across the trench is defined at each depth.

    摘要翻译: 存储单元包括具有以下结构的存储晶体管,其尺寸被设计为缩短编程和擦除时间。 半导体本体包括顶表面和形成在其中的具有由弯曲底部连接的壁的沟槽。 半导体本体中的源区从顶表面掺杂。 半导体本体中的漏极区域从上表面掺杂。 源极和漏极区的接合点在每个下方。 半导体本体的顶表面上的栅电极设置在沟槽中的源区和漏区之间。 电介质层将栅电极与半导体本体隔离并用作存储介质。 每个连接点在与底部相应的深度处与相应的一个壁相交。 在每个深度处限定跨沟槽的相应间隔。

    Charge trapping memory cell
    2.
    发明授权
    Charge trapping memory cell 有权
    电荷捕获存储单元

    公开(公告)号:US07087500B2

    公开(公告)日:2006-08-08

    申请号:US10894348

    申请日:2004-07-19

    IPC分类号: H01L21/76

    摘要: A memory cell includes a channel region between source/drain regions at the top side of a semiconductor body and is provided, transversely with respect to the longitudinal direction, with a bulge formed in the semiconductor material. This results in a uniform distribution of the strength of a radially directed electric field and avoids field strength spikes at lateral edges of the channel region. A storage layer sequence is situated between the channel region and the gate electrode as part of a word line.

    摘要翻译: 存储单元包括在半导体本体的顶侧的源极/漏极区之间的沟道区,并且相对于纵向方向横向地设置有形成在半导体材料中的凸起。 这导致径向电场的强度的均匀分布,并且避免了在通道区​​域的横向边缘处的场强尖峰。 存储层序列位于通道区域和栅电极之间,作为字线的一部分。

    Flash memory cell, flash memory device and manufacturing method thereof
    3.
    发明申请
    Flash memory cell, flash memory device and manufacturing method thereof 有权
    闪存单元,闪存设备及其制造方法

    公开(公告)号:US20050242388A1

    公开(公告)日:2005-11-03

    申请号:US10835390

    申请日:2004-04-30

    摘要: The present invention relates to a flash memory cell comprising a silicon substrate having an active region comprising a channel region and source-/drain-regions, the active region comprising a projecting portion, which projecting portion at least comprising said channel region; a tunneling dielectric layer formed on the surface of said active region; a floating gate formed on the surface of said tunneling dielectric layer for storing electric charges; an inter-gates coupling dielectric layer formed on the surface of said floating gate, and a control gate formed on the surface of said inter-gates coupling dielectric layer, wherein said floating gate is formed to have a groove-like shape for at least partly encompassing said projecting portion of said active region. This invention further relates to a flash memory device comprising such flash memory cells, as well as a manufacturing method thereof.

    摘要翻译: 本发明涉及一种闪存单元,其包括具有包括沟道区和源 - 漏区的有源区的硅衬底,所述有源区包括突出部分,所述突出部分至少包括所述沟道区; 形成在所述有源区的表面上的隧道电介质层; 形成在用于存储电荷的所述隧道介电层的表面上的浮动栅极; 形成在所述浮置栅极的表面上的栅极间耦合电介质层和形成在所述栅极间耦合电介质层的表面上的控制栅极,其中所述浮动栅极形成为具有至少部分地具有沟槽形状 包围所述有源区域的所述突出部分。 本发明还涉及一种包括这种闪存单元的闪速存储器件及其制造方法。

    Flash memory cell, flash memory device and manufacturing method thereof
    4.
    发明授权
    Flash memory cell, flash memory device and manufacturing method thereof 有权
    闪存单元,闪存设备及其制造方法

    公开(公告)号:US07087950B2

    公开(公告)日:2006-08-08

    申请号:US10835390

    申请日:2004-04-30

    IPC分类号: H01L29/76 H01L29/788

    摘要: The present invention relates to a flash memory cell comprising a silicon substrate having an active region comprising a channel region and source-/drain-regions, the active region comprising a projecting portion, which projecting portion at least comprising said channel region; a tunneling dielectric layer formed on the surface of said active region; a floating gate formed on the surface of said tunneling dielectric layer for storing electric charges; an inter-gates coupling dielectric layer formed on the surface of said floating gate, and a control gate formed on the surface of said inter-gates coupling dielectric layer, wherein said floating gate is formed to have a groove-like shape for at least partly encompassing said projecting portion of said active region. This invention further relates to a flash memory device comprising such flash memory cells, as well as a manufacturing method thereof.

    摘要翻译: 本发明涉及一种闪存单元,其包括具有包括沟道区和源 - 漏区的有源区的硅衬底,所述有源区包括突出部分,所述突出部分至少包括所述沟道区; 形成在所述有源区的表面上的隧道电介质层; 形成在用于存储电荷的所述隧道介电层的表面上的浮动栅极; 形成在所述浮置栅极的表面上的栅极间耦合电介质层和形成在所述栅极间耦合电介质层的表面上的控制栅极,其中所述浮动栅极形成为具有至少部分地具有沟槽形状 包围所述有源区域的所述突出部分。 本发明还涉及一种包括这种闪存单元的闪速存储器件及其制造方法。

    Charge trapping memory cell
    5.
    发明申请
    Charge trapping memory cell 有权
    电荷捕获存储单元

    公开(公告)号:US20050045963A1

    公开(公告)日:2005-03-03

    申请号:US10894348

    申请日:2004-07-19

    摘要: A memory cell includes a channel region between source/drain regions at the top side of a semiconductor body and is provided, transversely with respect to the longitudinal direction, with a bulge formed in the semiconductor material. This results in a uniform distribution of the strength of a radially directed electric field and avoids field strength spikes at lateral edges of the channel region. A storage layer sequence is situated between the channel region and the gate electrode as part of a word line.

    摘要翻译: 存储单元包括在半导体本体的顶侧的源/漏区之间的沟道区,并且相对于纵向方向横向地设置有形成在半导体材料中的凸起。 这导致径向电场的强度的均匀分布,并且避免了在通道区​​域的横向边缘处的场强尖峰。 存储层序列位于通道区域和栅电极之间,作为字线的一部分。

    Integrated circuit having a base structure and a nanostructure
    9.
    发明申请
    Integrated circuit having a base structure and a nanostructure 审中-公开
    具有基底结构和纳米结构的集成电路

    公开(公告)号:US20090251968A1

    公开(公告)日:2009-10-08

    申请号:US12099522

    申请日:2008-04-08

    IPC分类号: H01L21/00 G11C16/04

    CPC分类号: H01L27/11578 H01L27/11582

    摘要: In an embodiment, an integrated circuit may include a metallically conductive structure, a base structure having a crystal orientation, the base structure being adjacent to the metallically conductive structure, and a nanostructure disposed on the base structure, the nanostructure having substantially the same crystal orientation as the base structure.

    摘要翻译: 在一个实施例中,集成电路可以包括金属导电结构,具有晶体取向的基底结构,与金属导电结构相邻的基底结构,以及设置在基底结构上的纳米结构,纳米结构具有基本上相同的晶体取向 作为基础结构。