公开(公告)号：US07442552B2

公开(公告)日：2008-10-28

申请号：US11861369

申请日：2007-09-26

申请人： Joseph K. V. Comeau ,  Adele M. Mahoney ,  Jason P. Ritter ,  Gerald J. Scilla ,  Charles H. Wilson

发明人： Joseph K. V. Comeau ,  Adele M. Mahoney ,  Jason P. Ritter ,  Gerald J. Scilla ,  Charles H. Wilson

IPC分类号： G01N31/00

CPC分类号： G01N27/205 ,  Y10T436/16 ,  Y10T436/20

摘要： A test environment and an associated method of testing and analyzing a semiconductor package material containing a molding compound, for stability in a sustained oxygen environment. Test samples are exposed to a pressurized gas containing oxygen, under elevated temperature below the glass transition temperature of the molding compound. Control samples are exposed to a pressurized inert gas under similar or more severe conditions of gas pressure, temperature, and humidity. At least one characteristic common to the test samples and the control samples is measured. A determination is made as to whether there exists at least one significant difference between the at least one measured characteristic of the test samples and the control samples.

摘要翻译： 用于测试和分析含有模塑料的半导体封装材料的测试环境和相关方法，用于在持续的氧气环境中稳定。 在低于模塑料的玻璃化转变温度的高温下，将测试样品暴露于含氧气的加压气体中。 在气体压力，温度和湿度的类似或更严格的条件下，对照样品暴露于加压惰性气体。 测量样品和对照样品的至少一个特征。 确定测试样品的至少一个测量特征与对照样品之间是否存在至少一个显着差异。

公开(公告)号：US20090064763A1

公开(公告)日：2009-03-12

申请号：US12175703

申请日：2008-07-18

申请人： Joseph K. V. Comeau ,  Adele M. Mahoney ,  Jason P. Ritter ,  Gerald J. Scilla ,  Charles H. Wilson

发明人： Joseph K. V. Comeau ,  Adele M. Mahoney ,  Jason P. Ritter ,  Gerald J. Scilla ,  Charles H. Wilson

IPC分类号： G01M19/00

CPC分类号： G01N27/205 ,  Y10T436/16 ,  Y10T436/20

摘要： A test environment and an associated method of testing and analyzing a semiconductor package material containing a molding compound, for stability in a sustained oxygen environment. Test samples are exposed to a pressurized gas containing oxygen, under elevated temperature below the glass transition temperature of the molding compound. Control samples are exposed to a pressurized inert gas under similar or more severe conditions of gas pressure, temperature, and humidity. At least one characteristic common to the test samples and the control samples is measured. A determination is made as to whether there exists at least one significant difference between the at least one measured characteristic of the test samples and the control samples.

摘要翻译： 用于测试和分析含有模塑料的半导体封装材料的测试环境和相关方法，用于在持续的氧气环境中稳定。 在低于模塑料的玻璃化转变温度的高温下，将测试样品暴露于含氧气的加压气体中。 在气体压力，温度和湿度的类似或更严格的条件下，对照样品暴露于加压惰性气体。 测量样品和对照样品的至少一个特征。 确定测试样品的至少一个测量特征与对照样品之间是否存在至少一个显着差异。

公开(公告)号：US07300796B2

公开(公告)日：2007-11-27

申请号：US10658859

申请日：2003-09-09

申请人： Joseph K. V. Comeau ,  Adele M. Mahoney ,  Jason P. Ritter ,  Gerald J. Scilla ,  Charles H. Wilson

发明人： Joseph K. V. Comeau ,  Adele M. Mahoney ,  Jason P. Ritter ,  Gerald J. Scilla ,  Charles H. Wilson

IPC分类号： G01N31/00

CPC分类号： G01N27/205 ,  Y10T436/16 ,  Y10T436/20

摘要： A test environment and an associated method of testing and analyzing a semiconductor package material containing a molding compound, for stability in a sustained oxygen environment. Test samples are exposed to a pressurized gas containing oxygen, under elevated temperature below the glass transition temperature of the molding compound. Control samples are exposed to a pressurized inert gas under similar or more severe conditions of gas pressure, temperature, and humidity. At least one characteristic common to the test samples and the control samples is measured. A determination is made as to whether there exists at least one significant difference between the at least one measured characteristic of the test samples and the control samples.

摘要翻译： 用于测试和分析含有模塑料的半导体封装材料的测试环境和相关方法，用于在持续的氧气环境中稳定。 在低于模塑料的玻璃化转变温度的高温下，将测试样品暴露于含氧气的加压气体中。 在气体压力，温度和湿度的类似或更严格的条件下，对照样品暴露于加压惰性气体。 测量样品和对照样品的至少一个特征。 确定测试样品的至少一个测量特征与对照样品之间是否存在至少一个显着差异。

公开(公告)号：US07405106B2

公开(公告)日：2008-07-29

申请号：US11439016

申请日：2006-05-23

申请人： John J. Maloney ,  Robert M. Smith ,  Charles H. Wilson

发明人： John J. Maloney ,  Robert M. Smith ,  Charles H. Wilson

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K3/341 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A QFN package with improved joint solder thickness for improved second level attachment fatigue life. The copper leadframe of a QFN chip carrier is provided with rounded protrusions in both the chip attach pad region and the surrounding lead regions before second level attachment. The rounded stand-off protrusions are formed from the copper itself of the copper of the leadframe. This may be achieved by punching dimples into one surface of the copper plate of the leadframe before plating to form protrusions on the opposing surface. This method of forming the rounded protrusions simplifies the process of forming stand-offs. The protrusions provide a structure that increases wetting area and allows the use of a larger quantity of solder for increased solder joint thickness and better die paddle solder joint area coverage. As a result of the increased solder joint thickness, second level fatigue life is significantly improved. As a result of the improved die paddle solder joint area coverage, improved thermal performance of the chip carrier is also significantly improved.

摘要翻译： QFN封装，具有改进的焊点厚度，可提高二级附着疲劳寿命。 QFN芯片载体的铜引线框架在第二级附接之前在芯片连接焊盘区域和周围的引线区域中设置有圆形突起。 圆形的突出突起由引线框架的铜的铜本身形成。 这可以通过在电镀之前将凹坑冲压到引线框架的铜板的一个表面中以在相对表面上形成突起来实现。 形成圆形突起的这种方法简化了形成支座的过程。 突起提供了增加润湿面积的结构，并且允许使用更大量的焊料以增加焊接接​​头厚度和更好的焊盘焊接区域覆盖。 由于焊接接头厚度的增加，二级疲劳寿命显着提高。 由于焊盘焊接区域覆盖率的提高，芯片载体的热性能也得到了显着提高。

公开(公告)号：US5360946A

公开(公告)日：1994-11-01

申请号：US761182

申请日：1991-09-17

申请人： Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

发明人： Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01R12/04 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H01R9/09

CPC分类号： H01L24/45 ,  H01L21/481 ,  H01L23/49572 ,  H01L23/49894 ,  H01L24/85 ,  H05K3/363 ,  H01L2224/056 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K2201/10681 ,  H05K2201/10977 ,  H05K2203/176 ,  H05K3/0017 ,  H05K3/3452 ,  Y10T29/49121 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu thermal cycling are substantially reduced or eliminated. More particularly, the invention embodies a number of coatings for use in such products and diverse methods of making and using same.

摘要翻译： 本发明涉及适用于硅载体或其它类型的芯片载体应用的改进的柔性（或TAB）产品，其中例如通过Cu热循环引起的柔性可靠性问题被显着地减少或消除。 更具体地，本发明体现了用于这种产品中的许多涂层以及制造和使用它们的各种方法。

公开(公告)号：US4756616A

公开(公告)日：1988-07-12

申请号：US83147

申请日：1987-08-10

申请人： Byung K. Min ,  Charles H. Wilson

发明人： Byung K. Min ,  Charles H. Wilson

IPC分类号： G03B21/132 ,  G03B23/02

CPC分类号： G03B21/132 ,  Y10S353/05

摘要： An image projection system having a built-in mechanism for changing unframed transparencies comprises a frame, a source of illumination, a projection lens, a stage mounted to the frame for positioning a transparency thereon for view, delivery means for gripping and slidingly moving an unframed transparency along the surface of said stage, a magazine holding a stack of unframed transparencies for insertion into the frame adjacent to said stage, feed means for feeding the uppermost transparency from a stack of transparencies in the inserted magazine, and suitable drive means. A second magazine and second feed means can be included in the system for bedirectional changing of unframed transparencies. An electrical logic circuit interfacing with a control module can be included in the system for control. The mechanism for changing unframed transparencies can be isolated and built in a detached unit for use with a conventional image projector which does not have such a built-in mechanism.

摘要翻译： 具有用于改变非帧形透镜的内置机构的图像投影系统包括框架，照明源，投影透镜，安装到框架上的用于定位其上的透明度的平台，用于夹持和滑动移动未成帧的输送装置 沿着所述台的表面的透明度，保持用于插入到与所述台相邻的框架中的非成像透明胶片堆叠的盒子，用于从插入的盒中的一叠透明胶片馈送最上面的透明体的馈送装置和适当的驱动装置。 系统中可以包括第二个杂志和第二个进纸装置，用于无框架投影片的双向更换。 与控制模块连接的电逻辑电路可以包括在系统中用于控制。 用于更换非成帧透明胶片的机构可以被隔离并且构建在与没有这样的内置机构的常规图像投影仪一起使用的分离的单元中。

公开(公告)号：US08134225B2

公开(公告)日：2012-03-13

申请号：US12164152

申请日：2008-06-30

申请人： John J. Maloney ,  Robert M. Smith ,  Charles H. Wilson

发明人： John J. Maloney ,  Robert M. Smith ,  Charles H. Wilson

IPC分类号： H01L23/495

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K3/341 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A QFN package with improved joint solder thickness for improved second level attachment fatigue life. The copper leadframe of a QFN chip carrier is provided with rounded protrusions in both the chip attach pad region and the surrounding lead regions before second level attachment. The rounded stand-off protrusions are formed from the copper itself of the copper of the leadframe. This may be achieved by punching dimples into one surface of the copper plate of the leadframe before plating to form protrusions on the opposing surface. This method of forming the rounded protrusions simplifies the process of forming stand-offs. The protrusions provide a structure that increases wetting area and allows the use of a larger quantity of solder for increased solder joint thickness and better die paddle solder joint area coverage. As a result of the increased solder joint thickness, second level fatigue life is significantly improved. As a result of the improved die paddle solder joint area coverage, improved thermal performance of the chip carrier is also significantly improved.

摘要翻译： QFN封装，具有改进的焊点厚度，可提高二级附着疲劳寿命。 QFN芯片载体的铜引线框架在第二级附接之前在芯片连接焊盘区域和周围的引线区域中设置有圆形突起。 圆形的突出突起由引线框架的铜的铜本身形成。 这可以通过在电镀之前将凹坑冲压到引线框架的铜板的一个表面中以在相对表面上形成突起来实现。 形成圆形突起的这种方法简化了形成支座的过程。 突起提供了增加润湿面积的结构，并且允许使用更大量的焊料以增加焊接接​​头厚度和更好的焊盘焊接区域覆盖。 由于焊接接头厚度的增加，二级疲劳寿命显着提高。 由于焊盘焊接区域覆盖率的提高，芯片载体的热性能也得到了显着提高。

公开(公告)号：US20080265396A1

公开(公告)日：2008-10-30

申请号：US12164152

申请日：2008-06-30

申请人： John J. Maloney ,  Robert M. Smith ,  Charles H. Wilson

发明人： John J. Maloney ,  Robert M. Smith ,  Charles H. Wilson

IPC分类号： H01L23/48

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K3/341 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A QFN package with improved joint solder thickness for improved second level attachment fatigue life. The copper leadframe of a QFN chip carrier is provided with rounded protrusions in both the chip attach pad region and the surrounding lead regions before second level attachment. The rounded stand-off protrusions are formed from the copper itself of the copper of the leadframe. This may be achieved by punching dimples into one surface of the copper plate of the leadframe before plating to form protrusions on the opposing surface. This method of forming the rounded protrusions simplifies the process of forming stand-offs. The protrusions provide a structure that increases wetting area and allows the use of a larger quantity of solder for increased solder joint thickness and better die paddle solder joint area coverage. As a result of the increased solder joint thickness, second level fatigue life is significantly improved. As a result of the improved die paddle solder joint area coverage, improved thermal performance of the chip carrier is also significantly improved.

摘要翻译： QFN封装，具有改进的焊点厚度，可提高二级附着疲劳寿命。 QFN芯片载体的铜引线框架在第二级附接之前在芯片连接焊盘区域和周围的引线区域中设置有圆形突起。 圆形的突出突起由引线框架的铜的铜本身形成。 这可以通过在电镀之前将凹坑冲压到引线框架的铜板的一个表面中以在相对表面上形成突起来实现。 形成圆形突起的这种方法简化了形成支座的过程。 突起提供了增加润湿面积的结构，并且允许使用更大量的焊料以增加焊接接​​头厚度和更好的焊盘焊接区域覆盖。 由于焊接接头厚度的增加，二级疲劳寿命显着提高。 由于焊盘焊接区域覆盖率的提高，芯片载体的热性能也得到了显着提高。

公开(公告)号：US3995123A

公开(公告)日：1976-11-30

申请号：US432049

申请日：1974-01-09

申请人： Charles H. Wilson

发明人： Charles H. Wilson

IPC分类号： G06F15/02 ,  H04M1/23 ,  H04M1/56 ,  H04M1/50

CPC分类号： H04M1/56 ,  G06F15/02 ,  H04M1/23

摘要： Apparatus and method for providing a standard telephone with localized calculating and read-out capabilities. Miniaturized electronic calculator circuits are integrally mounted within a standard telephone chassis and operatively share use of the telephone keyboard selector buttons with the existing telephone circuits. Input stimuli applied to the push-button selector keys are simultaneously converted into touch-tone dialing information for the telephone circuits and into digital information for the calculator circuits. A plurality of calculator function input keys supplement the shared standard telephone keyboard and provide function information input capability to the calculator circuits. Easily operated switches enable either independent or simultaneous use of the telephone and/or the calculator circuits. A numerical display panel mounted on the face of the telephone chassis provides visual read-out capability for the calculator and for entered telephone numbers.

摘要翻译： 用于向标准电话机提供具有局部计算和读出能力的装置和方法。 小型化电子计算器电路整体地安装在标准电话机箱内，并可操作地共享电话键盘选择按钮与现有电话电路的使用。 施加到按钮选择器键的输入刺激同时转换成用于电话电路的触摸音拨号信息和用于计算器电路的数字信息。 多个计算器功能输入键补充共享标准电话键盘，并向计算器电路提供功能信息输入能力。 易于操作的开关可独立或同时使用电话和/或计算器电路。 安装在电话机底座上的数字显示面板为计算器和输入的电话号码提供视觉读出功能。

公开(公告)号：US20080203546A1

公开(公告)日：2008-08-28

申请号：US12115051

申请日：2008-05-05

申请人： John J. Maloney ,  Robert M. Smith ,  Charles H. Wilson

发明人： John J. Maloney ,  Robert M. Smith ,  Charles H. Wilson

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K3/341 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A QFN package with improved joint solder thickness for improved second level attachment fatigue life. The copper leadframe of a QFN chip carrier is provided with rounded protrusions in both the chip attach pad region and the surrounding lead regions before second level attachment. The rounded stand-off protrusions are formed from the copper itself of the copper of the leadframe. This may be achieved by punching dimples into one surface of the copper plate of the leadframe before plating to form protrusions on the opposing surface. This method of forming the rounded protrusions simplifies the process of forming stand-offs. The protrusions provide a structure that increases wetting area and allows the use of a larger quantity of solder for increased solder joint thickness and better die paddle solder joint area coverage. As a result of the increased solder joint thickness, second level fatigue life is significantly improved. As a result of the improved die paddle solder joint area coverage, improved thermal performance of the chip carrier is also significantly improved.

摘要翻译： QFN封装，具有改进的焊点厚度，可提高二级附着疲劳寿命。 QFN芯片载体的铜引线框架在第二级附接之前在芯片连接焊盘区域和周围的引线区域中设置有圆形突起。 圆形的突出突起由引线框架的铜的铜本身形成。 这可以通过在电镀之前将凹坑冲压到引线框架的铜板的一个表面中以在相对表面上形成突起来实现。 形成圆形突起的这种方法简化了形成支座的过程。 突起提供了增加润湿面积的结构，并且允许使用更大量的焊料以增加焊接接​​头厚度和更好的焊盘焊接区域覆盖。 由于焊接接头厚度的增加，二级疲劳寿命显着提高。 由于焊盘焊接区域覆盖率的提高，芯片载体的热性能也得到了显着提高。