利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

65 条记录 (耗时 0.051 秒)

    Multilayer securing structure and method thereof for the protection of cryptographic keys and code
    4.
    发明授权
    Multilayer securing structure and method thereof for the protection of cryptographic keys and code 有权
    多层安全结构及其方法，用于保护加密密钥和密码

    公开(公告)号：US08938627B2

    公开(公告)日：2015-01-20

    申请号：US13382814

    申请日：2010-04-13

    申请人： Stefano S. Oggioni ,  Vincenzo Condorelli ,  Claudius Feger

    发明人： Stefano S. Oggioni ,  Vincenzo Condorelli ,  Claudius Feger

    IPC分类号： G06F21/00 ,  G06F21/87

    CPC分类号： G06F21/87 ,  G06F2221/2107 ,  G06F2221/2131 ,  H01L23/576 ,  H01L2224/16225 ,  Y10S257/922

    摘要： An arrangement for the protection of cryptographic keys and codes from being compromised by external tampering, wherein the arrangement is utilized within a multilayered securing structure. More particularly, there is provided a multilayered securing structure for the protection of cryptographic keys and codes, which may be subject to potential tampering when employed in computers and/or telecommunication systems. A method is provided for producing such multilayered securing structures within a modular substrate with the intent to protect cryptographic keys and codes which are employed in computers and/or telecommunication systems from the dangers of potential tampering or unauthorized access.

    摘要翻译： 用于保护加密密钥和代码免受外部篡改损害的布置，其中该布置在多层固定结构内使用。 更具体地，提供了一种用于保护加密密钥和代码的多层固定结构，当在计算机和/或电信系统中使用密钥和密码时，可能会受到潜在的篡改。 提供了一种用于在模块化基板内制造这种多层固定结构的方法，其目的是保护在计算机和/或电信系统中使用的加密密钥和代码免受潜在篡改或未授权访问的危险。

    Assembly Method For Reworkable Chip Stacking With Conductive Film
    9.
    发明申请
    Assembly Method For Reworkable Chip Stacking With Conductive Film 审中-公开
    带导电膜的可重复芯片堆叠的装配方法

    公开(公告)号：US20090181476A1

    公开(公告)日：2009-07-16

    申请号：US11972129

    申请日：2008-01-10

    申请人： Stephen L. Buchwalter ,  Bing Dang ,  Claudius Feger ,  Peter A. Gruber ,  John Knickerbocker

    发明人： Stephen L. Buchwalter ,  Bing Dang ,  Claudius Feger ,  Peter A. Gruber ,  John Knickerbocker

    IPC分类号： H01L21/02

    CPC分类号： H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06596 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of stacking a chip, including an integrated circuit, onto a substrate including applying an anisotropic conductive film (ACF) or a solder-filled conductive film onto a surface thereof, the surface being configured to electrically couple to the film, placing the chip onto the film, the chip being configured to electrically couple to the film, compressively pressurizing the chip, the film and the surface such that the chip is electrically coupled to the surface via the film,, testing the chip to determine whether the chip is operating normally, reworking the placement of the chip onto the film and repeating the compressive pressurization if the chip is determined to not be operating normally, repeating the testing to determine whether the chip is operating normally, and once the chip is determined to be operating normally, bonding the chip, the film and the surface.

    摘要翻译： 一种将包括集成电路的芯片堆叠在基板上的方法，包括将各向异性导电膜（ACF）或焊料填充导电膜施加到其表面上，该表面被配置为电耦合到膜，将芯片 芯片被配置为电耦合到膜，对芯片，膜和表面进行压缩加压，使得芯片经由膜电耦合到表面，测试芯片以确定芯片是否正在操作 通常，如果芯片被确定为不正常工作，重复测试以确定芯片是否正常工作，并且一旦芯片确定正常工作，则将芯片放置在膜上并重复压缩加压， 粘合芯片，薄膜和表面。