摘要:
An antireflection film composition, wherein an etching speed is fast, thus, when used as a resist lower layer, a film loss of a resist pattern and deformation of the pattern during etching can be minimized, and because of a high crosslinking density, a dense film can be formed after thermal crosslinking, thus, mixing with an upper layer resist can be prevented and the resist pattern after development is good is provided. The antireflection film composition comprising; at least a polymer having a repeating unit represented by the following general formula (I).
摘要:
A resist lower layer film composition, wherein an etching speed is fast, thus an etching time period can be shortened to minimize a film thickness loss of a resist pattern and a deformation of the pattern during etching, therefore, a pattern can be transferred with high accuracy and an excellent pattern can be formed on a substrate is provided.The resist lower layer film composition comprising at least a polymer having a repeating unit represented by the following general formula (1).
摘要:
An antireflection film composition, wherein an etching speed is fast, thus, when used as a resist lower layer, a film loss of a resist pattern and deformation of the pattern during etching can be minimized, and because of a high crosslinking density, a dense film can be formed after thermal crosslinking, thus, mixing with an upper layer resist can be prevented and the resist pattern after development is good is provided.The antireflection film composition comprising; at least a polymer having a repeating unit represented by the following general formula (1).
摘要:
A resist lower layer film composition, wherein an etching speed is fast, thus an etching time period can be shortened to minimize a film thickness loss of a resist pattern and a deformation of the pattern during etching, therefore, a pattern can be transferred with high accuracy and an excellent pattern can be formed on a substrate is provided.The resist lower layer film composition comprising at least a polymer having a repeating unit represented by the following general formula (1).
摘要:
There is disclosed a resist underlayer film composition of a multilayer resist film used in lithography including (A) a fullerene derivative having a carboxyl group protected by a thermally labile group and (B) an organic solvent. There can be a resist underlayer film composition of a multilayer resist film used in lithography for forming a resist underlayer in which generation of wiggling in substrate etching can be highly suppressed and the poisoning problem in forming an upper layer pattern using a chemically amplified resist can be avoided, a process for forming the resist underlayer film, a patterning process and a fullerene derivative.
摘要:
Silacyclohexane compounds of the following formula (I) or (II) along with intermediate compounds therefor are described ##STR1## wherein R is an organic residue, one of ##STR2## represents a trans-1-sila-1,4-cyclohexylene group or trans-4-sila-1,4-cyclohexylene group having a substituent of H, F, Cl or CH.sub.3, and the other represents a trans-1,4-cyclohexylene group, or such a trans-1-sila-1,4-cyclohexylene group or trans-4-sila-1,4-cyclohexylene group as defined above, n is 0 or 1, L.sub.1 represents H or F, L.sub.2 represents H, F or Cl, and Z represents CN, F, Cl or an organic residue, and ##STR3## The processes for preparing the compounds (I) and (II) are also described along with liquid crystal compositions comprising the compounds and the liquid crystal devices comprising the compositions.
摘要:
A silacyclohexane compound represented by the following general formula (I). ##STR1## In this formula, R denotes a linear-chain alkyl group with a carbon number of 1-10, a mono- or di- fluoro-alkyl group with a carbon number of 1-10, a branched-chain alkyl group with a carbon number of 3-8, an alkoxyalkyl group with a carbon number of 2-7, or an alkenyl group with a carbon number of 2-8. ##STR2## denotes trans-1-sila-1,4-cyclohexylene or trans-4-sila-1,4-cyclohexylene group whose silicon at position 1 or position 4 has a substitutional group(s) of H, F, Cl or CH.sub.3. X denotes a CN, F, Cl, CF.sub.3, CF.sub.2 Cl, CHFCl, OCF.sub.3, OCHF.sub.2, OCF.sub.2 Cl, OCHFCl, R or OR group (R is the same as defined in the general formula (I)). Y.sub.2 and Z denote H or F, independently to each other. Y.sub.1 denotes H, F or Cl.
摘要:
A liquid crystal composition comprising a silacyclohexane compound represented by the following formula (I): ##STR1## wherein R and R' denote an alkyl group, a mono- or di-fluoroalkyl group, an alkoxyalkyl group or an alkenyl group; at least one of ##STR2## denotes a silacyclohexylene group whose silicon at positions 1 or 4 has a substitutional group of H, F, Cl of CH.sub.3, and the other denotes a silacyclohexylene group whose silicon at positions 1 or 4 has a substitutional group of H, F, Cl or CH.sub.3 or a cyclohexylene group; and 0-2 of the substitutional groups X on the aromatic rings denote F and the remaining X's denote H.
摘要:
A silacyclohexane compound represented by the following general formula (I). ##STR1## In this formula, R denotes hydrogen, a linear-chain alkyl group with a carbon number of 1-10, a branched-chain alkyl group with a carbon number of 3-8, an alkoxyalkyl group with a carbon number of 2-7, a fluoroalkyl group with a carbon number of 1-10 in which one or two hydrogen atoms are substituted by florine atom(s), or an alkenyl group with a carbon number of 2-8. For the groups ##STR2## at least one of these is a trans-1-sila-1,4-cyclohexylene or trans-4-sila-1,4-cyclohexylene group whose silicon at position 1 or position 4 has a substitutional group(s) of H, F, Cl or CH.sub.3, and the other denotes a trans-1,4-cyclohexylene group. X denotes a CN, F, Cl, CF.sub.3, CF.sub.2 Cl, CHFCl, OCF.sub.3, OCHF.sub.2, OCF.sub.2 Cl, OCHFCl, R or OR group (R is the same as defined earlier). Y denotes H or F. Z denotes H or F.
摘要:
There is disclosed a resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formulae (1-1) and/or (1-2), and one or more kinds of compounds, represented by the following general formulae (2-1) and/or (2-2), and/or equivalent bodies thereof. There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, (namely, an underlayer film having optimum n-value and k-value as an antireflective film), excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.