公开(公告)号：US08563417B2

公开(公告)日：2013-10-22

申请号：US13302219

申请日：2011-11-22

申请人： Jun Lu ,  Alex Niu ,  Yueh-Se Ho ,  Ping Hoang ,  Jacky Gong ,  Yan Xun Xue ,  Xiaolian Zhang ,  Ming-Chen Lu

发明人： Jun Lu ,  Alex Niu ,  Yueh-Se Ho ,  Ping Hoang ,  Jacky Gong ,  Yan Xun Xue ,  Xiaolian Zhang ,  Ming-Chen Lu

IPC分类号： H01L21/78

CPC分类号： H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3157 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L2224/03009 ,  H01L2224/0332 ,  H01L2224/0384 ,  H01L2224/03848 ,  H01L2224/03849 ,  H01L2224/04034 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05794 ,  H01L2224/058 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/06135 ,  H01L2224/06164 ,  H01L2224/06181 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40247 ,  H01L2224/73263 ,  H01L2224/84801 ,  H01L2224/94 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/03 ,  H01L2224/053 ,  H01L2924/014 ,  H01L2924/00

摘要： The invention generally relates to a packaging method of an ultra-thin chip, more specifically, the invention relates to a method for packaging the ultra-thin chip with solder ball thermo-compression in wafer level packaging process. The method starts with disposing solder balls on metal pads arranged on the front surface of semiconductor chips that are formed at the front surface of a semiconductor wafer. The solder balls are soften by heating the wafer, a compression plate is applied with a pressure on the top ends of the solder balls thus forming a co-planar top surface at the top ends of the solder balls. A molding compound is deposited on the front surface of the wafer with the top ends of the solder balls exposed. The wafer is then ground from its back surface to reduce its thickness to achieve ultra-thin chip.

摘要翻译： 本发明一般涉及超薄芯片的封装方法，更具体地说，本发明涉及一种用于在晶片级封装工艺中封装具有焊球热压缩的超薄芯片的方法。 该方法开始于将焊球设置在形成在半导体晶片的前表面的半导体芯片的前表面上的金属焊盘上。 通过加热晶片来软化焊球，压力板在焊球的顶端施加压力，从而在焊球的顶端形成共面顶表面。 模具化合物沉积在晶片的前表面上，其中焊球的顶端被暴露。 然后将晶片从其背面研磨以减小其厚度以实现超薄芯片。

公开(公告)号：US20100115099A1

公开(公告)日：2010-05-06

申请号：US12685373

申请日：2010-01-11

申请人： Huailong Gu ,  Jun Li ,  Ting Zou ,  Zhenzhu Lv ,  Xiaolian Zhang

发明人： Huailong Gu ,  Jun Li ,  Ting Zou ,  Zhenzhu Lv ,  Xiaolian Zhang

IPC分类号： G06F15/173 ,  G06F15/16

CPC分类号： H04L12/1881 ,  H04L47/70 ,  H04L47/782 ,  H04L47/806

摘要： A multicast/unicast admission control method, a multicast/unicast admission control device, and a multicast/unicast admission control system are provided. In the method, through centralized resource control of a resource and admission control subsystem (RACS), sharing of multicast/unicast resources is realized. The RACS allocates and authorizes resources to an access node (AN), the AN manages the obtained multicast resources under the authorization, and the resource allocation is adjusted through interaction when the multicast resources of the AN or the resources of the RACS are not sufficient.

摘要翻译： 提供组播/单播准入控制方法，组播/单播接入控制装置，组播/单播接入控制系统。 在该方法中，通过资源和准入控制子系统（RACS）的集中资源控制，实现了组播/单播资源的共享。 RACS向接入节点（AN）分配和授权资源，AN在授权下管理获得的组播资源，当AN的组播资源或RACS的资源不足时，通过交互调整资源分配。

公开(公告)号：US20100103934A1

公开(公告)日：2010-04-29

申请号：US12650150

申请日：2009-12-30

申请人： Jun Li ,  Huailong Gu ,  Ting Zou ,  Zhenzhu Lv ,  Xiaolian Zhang

发明人： Jun Li ,  Huailong Gu ,  Ting Zou ,  Zhenzhu Lv ,  Xiaolian Zhang

IPC分类号： H04L12/56

CPC分类号： H04L12/1877 ,  H04L67/14 ,  H04L67/24

摘要： The embodiment of this invention discloses a method, a system and an apparatus for admission control of multicast or unicast. The method for admission control of multicast comprises: a network device receives a multicast request and executes admission control operation of multicast resources according to the multicast request; when multicast resources are not sufficient, the network device sends an outer resources request to a resources admission control device, and executes multicast operation according to the results of admission control operation returned by the resources admission control device responsive to said outer resources request. The method for admission control of unicast comprises: a resources admission control device receives a unicast resources request and executes admission control operation of unicast resources according to the unicast resources request; when the unicast resources are not sufficient, the resources admission control device sends an outer resources request to a network device; the resources admission control device executes unicast operation according to the results of admission control operation returned by the network device responsive to said outer resources request. The embodiment of this invention guarantees fast handoff of multicast service channel in the case of implementing resources share of multicast services and unicast services, and the implementation is simple.

摘要翻译： 本发明的实施例公开了一种用于多播或单播接纳控制的方法，系统和装置。 组播接入控制方法包括：网络设备接收组播请求，根据组播请求执行组播资源的接纳控制操作; 当组播资源不足时，网络设备向资源许可控制装置发送外部资源请求，根据资源许可控制装置根据所述外部资源请求返回的准入控制操作的结果，执行组播操作。 单播接纳控制方法包括：资源准入控制装置根据单播资源请求，接收单播资源请求，执行单播资源的接纳控制操作; 当单播资源不足时，资源准入控制装置向网络装置发送外部资源请求; 所述资源许可控制装置根据所述外部资源请求，根据所述网络装置返回的接纳控制操作的结果来执行单播操作。 本实施例在实现组播业务和单播业务资源共享的情况下，保证组播业务信道的快速切换，实现简单。

公开(公告)号：US08930451B2

公开(公告)日：2015-01-06

申请号：US12685373

申请日：2010-01-11

申请人： Huailong Gu ,  Jun Li ,  Ting Zou ,  Zhenzhu Lv ,  Xiaolian Zhang

发明人： Huailong Gu ,  Jun Li ,  Ting Zou ,  Zhenzhu Lv ,  Xiaolian Zhang

IPC分类号： G06F15/16 ,  H04L12/18 ,  H04L12/54 ,  H04L12/911 ,  H04L12/927

CPC分类号： H04L12/1881 ,  H04L47/70 ,  H04L47/782 ,  H04L47/806

摘要： A multicast/unicast admission control method, a multicast/unicast admission control device, and a multicast/unicast admission control system are provided. In the method, through centralized resource control of a resource and admission control subsystem (RACS), sharing of multicast/unicast resources is realized. The RACS allocates and authorizes resources to an access node (AN), the AN manages the obtained multicast resources under the authorization, and the resource allocation is adjusted through interaction when the multicast resources of the AN or the resources of the RACS are not sufficient.

摘要翻译： 提供组播/单播准入控制方法，组播/单播接入控制装置，组播/单播接入控制系统。 在该方法中，通过资源和准入控制子系统（RACS）的集中资源控制，实现了组播/单播资源的共享。 RACS向接入节点（AN）分配和授权资源，AN在授权下管理获得的组播资源，当AN的组播资源或RACS的资源不足时，通过交互调整资源分配。

公开(公告)号：US20090160595A1

公开(公告)日：2009-06-25

申请号：US12391251

申请日：2009-02-23

申请人： Tao Feng ,  Xiaolian Zhang ,  Francois Hebert ,  Ming Sun

发明人： Tao Feng ,  Xiaolian Zhang ,  Francois Hebert ,  Ming Sun

IPC分类号： H01F5/00 ,  H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49861 ,  H01F17/0033 ,  H01F2027/2814 ,  H01L21/4832 ,  H01L21/563 ,  H01L23/495 ,  H01L23/4951 ,  H01L23/49548 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor package is disclosed with high inductance rating while exhibiting a reduced foot print. It has a bonded stack of power IC die at bottom, a power inductor at top and a circuit substrate, made of leadframe or printed circuit board, in the middle. The power inductor has a inductor core of closed magnetic loop. The circuit substrate has a first number of bottom half-coil forming conductive elements beneath the inductor core. A second number of top half-coil forming conductive elements, made of bond wires, three dimensionally formed interconnection plates or upper leadframe leads, are located atop the inductor core with both ends of each element connected to respective bottom half-coil forming conductive elements to jointly form an inductive coil enclosing the inductor core. A top encapsulant protectively encases the inductor core, the top half-coil forming conductive elements, the bottom half-coil forming conductive elements and the circuit substrate.

摘要翻译： 公开了一种功率半导体封装，其具有高电感额定值，同时显示出减少的脚印。 底部有一个电源IC芯片，顶部有一个功率电感器和一个由引线框或印刷电路板制成的电路基板。 功率电感器具有闭合磁环的电感芯。 电路衬底具有在电感器芯下方形成导电元件的第一数量的底部半线圈。 由接合线，三维形成的互连板或上引线框引线构成的第二数量的上半线圈形成导电元件位于电感器芯的顶部，每个元件的两端连接到形成导电元件的相应底部半线圈， 共同形成围绕电感器芯的感应线圈。 顶部密封剂保护性地封装电感器芯，顶部半线圈形成导电元件，底部半线圈形成导电元件和电路衬底。