摘要:
A semiconductor memory device includes a cell array and a refresh controller coupled to the cell array. The refresh controller is configured to insert at least one insertion refresh address in a first refresh address sequence based on address information about the cell array to generate a second refresh address sequence and to apply the second refresh address sequence to the cell array, such that selected cells may be refreshed more frequently without increasing an overall refresh rate.
摘要:
A semiconductor memory device having improved refresh characteristics includes a memory array including a plurality of memory cells; a test unit configured to test refresh characteristics of the memory array and generate a first fail address signal; a storage unit configured to store the first fail address signal; and a refresh unit configured to perform a refresh operation on the memory array, wherein the refresh unit is configured to receive the first fail address signal from the storage unit, perform the refresh operation on a first memory cell that does not correspond to the first fail address signal according to a first period, and perform the refresh operation on a second memory cell that corresponds to the first fail address signal according to a second period that is shorter than the first period.
摘要:
A semiconductor memory device having improved refresh characteristics includes a memory array including a plurality of memory cells; a test unit configured to test refresh characteristics of the memory array and generate a first fail address signal; a storage unit configured to store the first fail address signal; and a refresh unit configured to perform a refresh operation on the memory array, wherein the refresh unit is configured to receive the first fail address signal from the storage unit, perform the refresh operation on a first memory cell that does not correspond to the first fail address signal according to a first period, and perform the refresh operation on a second memory cell that corresponds to the first fail address signal according to a second period that is shorter than the first period.
摘要:
A semiconductor memory device includes a cell array and a refresh controller coupled to the cell array. The refresh controller is configured to insert at least one insertion refresh address in a first refresh address sequence based on address information about the cell array to generate a second refresh address sequence and to apply the second refresh address sequence to the cell array, such that selected cells may be refreshed more frequently without increasing an overall refresh rate.
摘要:
Semiconductor devices configured to test connectivity of micro bumps including one or more micro bumps and a boundary scan test block for testing connectivity of the micro bumps by scanning data input to the micro bumps and outputting the scanned data. The semiconductor device may include a first chip including solder balls and at least one or more switches electrically coupled with the respective solder balls, and a second chip stacked on top of the first chip and electrically coupled with the switches in direct access mode, including micro bumps that input/output signals transmitted from/to the solder balls.
摘要:
A semiconductor device, memory device, system, and method of using a stacked structure for stably transmitting signals among a plurality of semiconductor layers is disclosed. The device includes at least a first semiconductor chip including a first temperature sensor circuit configured to output first temperature information related to the first semiconductor chip, and at least one through substrate via.
摘要:
The input buffer is driven by a data input/output supply voltage. The input buffer generates an output signal from an input signal that swings between the data input/output supply voltage and a data input/output ground voltage.
摘要:
Provided are a charge transfer switch circuit for selectively controlling body bias voltage of a charge transfer device, and a boosted voltage generating circuit having the same. The charge transfer switch circuit may include a capacitor whose voltage is boosted based on first and second control signals, a first transistor connected between a supply voltage and the capacitor and having a gate receiving a precharge signal, a second transistor connected between a first node and a second node and having a gate connected to a terminal of the capacitor, a third transistor connected between the first node and a bulk voltage of the second transistor and having a gate receiving the first control signal, and a fourth transistor connected between the bulk voltage of the second transistor and a ground voltage and having a gate receiving the second control signal.
摘要:
A semiconductor device, memory device, system, and method of using a stacked structure for stably transmitting signals among a plurality of semiconductor layers is disclosed. The device includes at least a first semiconductor chip including a first temperature sensor circuit configured to output first temperature information related to the first semiconductor chip, and at least one through substrate via.
摘要:
An internal power generating system for a semiconductor device is disclosed. The device may include a plurality of channels. The system comprises a reference voltage generator configured to generate a reference voltage. The system further comprises a plurality of internal power generators that are allocated to the plurality of channels in one-to-one correspondence and that are configured to commonly use the reference voltage generated by the reference voltage generator. Each internal power generator may be configured to receive a fed back internal power voltage, to compare the fed back internal power voltage to the reference voltage, and to generate an internal power voltage based on the comparison. The system further comprises a plurality of channel state detectors that are allocated to the plurality of channels in one-to-one correspondence, and that are configured to respectively detect operation states of the plurality of channels based on separate respective sets of command signals for each channel. The system additional comprises a plurality of internal power controllers that are allocated to the plurality of channels in one-to-one correspondence, and that are configured to respectively control driving capabilities for the internal power voltages according to the detected operation states.