摘要:
A semiconductor device, memory device, system, and method of using a stacked structure for stably transmitting signals among a plurality of semiconductor layers is disclosed. The device includes at least a first semiconductor chip including a first temperature sensor circuit configured to output first temperature information related to the first semiconductor chip, and at least one through substrate via.
摘要:
A semiconductor device, memory device, system, and method of using a stacked structure for stably transmitting signals among a plurality of semiconductor layers is disclosed. The device includes at least a first semiconductor chip including a first temperature sensor circuit configured to output first temperature information related to the first semiconductor chip, and at least one through substrate via.
摘要:
An internal power generating system for a semiconductor device is disclosed. The device may include a plurality of channels. The system comprises a reference voltage generator configured to generate a reference voltage. The system further comprises a plurality of internal power generators that are allocated to the plurality of channels in one-to-one correspondence and that are configured to commonly use the reference voltage generated by the reference voltage generator. Each internal power generator may be configured to receive a fed back internal power voltage, to compare the fed back internal power voltage to the reference voltage, and to generate an internal power voltage based on the comparison. The system further comprises a plurality of channel state detectors that are allocated to the plurality of channels in one-to-one correspondence, and that are configured to respectively detect operation states of the plurality of channels based on separate respective sets of command signals for each channel. The system additional comprises a plurality of internal power controllers that are allocated to the plurality of channels in one-to-one correspondence, and that are configured to respectively control driving capabilities for the internal power voltages according to the detected operation states.
摘要:
An internal power generating system for a semiconductor device is disclosed. The device may include a plurality of channels. The system comprises a reference voltage generator configured to generate a reference voltage. The system further comprises a plurality of internal power generators that are allocated to the plurality of channels in one-to-one correspondence and that are configured to commonly use the reference voltage generated by the reference voltage generator. Each internal power generator may be configured to receive a fed back internal power voltage, to compare the fed back internal power voltage to the reference voltage, and to generate an internal power voltage based on the comparison. The system further comprises a plurality of channel state detectors that are allocated to the plurality of channels in one-to-one correspondence, and that are configured to respectively detect operation states of the plurality of channels based on separate respective sets of command signals for each channel. The system additional comprises a plurality of internal power controllers that are allocated to the plurality of channels in one-to-one correspondence, and that are configured to respectively control driving capabilities for the internal power voltages according to the detected operation states.
摘要:
Semiconductor devices configured to test connectivity of micro bumps including one or more micro bumps and a boundary scan test block for testing connectivity of the micro bumps by scanning data input to the micro bumps and outputting the scanned data. The semiconductor device may include a first chip including solder balls and at least one or more switches electrically coupled with the respective solder balls, and a second chip stacked on top of the first chip and electrically coupled with the switches in direct access mode, including micro bumps that input/output signals transmitted from/to the solder balls.
摘要:
Provided is a synchronous dynamic random access memory (DRAM) semiconductor device including multiple output buffers, a strobe control unit and multiple strobe buffers. Each of the output buffers is configured to output one bit of data. The strobe control unit is configured to output multiple strobe control signals in response to an externally input signal. The strobe buffers are connected to the output buffers and the strobe control unit, and each of the strobe buffers is configured to output at least one strobe signal. At least some of the strobe buffers are activated in response to the strobe control signals, and the output buffers are activated in response to the strobe signals output by the activated strobe buffers.
摘要:
Provided are a semiconductor chip including a TSV passing through a transistor, and a stack module and a memory card using such a semiconductor chip. The semiconductor chip may include a semiconductor layer that has a first surface and a second surface opposite to each other. A conductive layer may be disposed on the first surface of the semiconductor layer. A TSV may pass through the semiconductor layer and the conductive layer. A side wall insulating layer may surround a side wall of the TSV in order to electrically insulate the semiconductor layer and the conductive layer from the TSV.
摘要:
A redundancy fuse box of a semiconductor memory device which minimizes address line loading by organizing fuse cells into fuse cell groups sharing the same sub-address line. The address signal therefore has to traverse across a shorter distance along the semiconductor device, which contributes to a reduction in cell line loading. The redundancy fuse box includes a plurality of fuse cells, each having a transistor and fuse, to which an address signal of a memory cell is applied. The respective fuse boxes are constructed as one fuse box by being laid out in the same place. The fuse box includes a plurality of fuse cells which receive the same address signal along a common sub-address line and is wired so that outputs of the fuse cells which received the same address signal contribute to different redundancy enable signals.
摘要:
An integrated circuit device such as an integrated circuit memory device, includes a first fuse group such as a first laser fuse group including a plurality of first laser fuses each having a first narrow end, a second opposite end which is wider and a bent central portion. Pitches of the first end of the plurality of first laser fuses are narrow and pitches of the second end are wide. The plurality of first laser fuses are adjacent one another. A second fuse group such as a second laser fuse group includes a plurality of second laser fuses each having a first wide end, a second opposite end which is narrower, and a bent central portion. Pitches of the first end of the plurality of second laser fuses are wide and pitches of the second end are narrow. The second plurality of laser fuses are adjacent one another. The first ends of the laser fuses in the first laser fuse group are adjacent the first ends of laser fuses in the second laser fuse group. The second ends of the laser fuses in the first laser fuse group are adjacent the second ends of the laser fuses in the second laser fuse group. The central portions of the outer laser fuses of the first and second laser fuse groups are not bent, but straight. Accordingly, when a specific laser fuse is blown, neighboring laser fuses need not be damaged, and the density of the laser fuse area may be increased.
摘要:
There is provided a semiconductor memory device which does not require an additional input pad to apply a signal for discriminating between a normal cell and a redundant cell. The semicodnuctor memory device has (claim 1). Therefore, the normal cell array or the redundant cell array is sequentially selected and tested by using the same input pad to which the bank select bit is input, without an additional pad.