公开(公告)号：US09875992B2

公开(公告)日：2018-01-23

申请号：US14821767

申请日：2015-08-09

Applicant: Junyeong Heo ,  Chajea Jo ,  Taeje Cho

Inventor： Junyeong Heo ,  Chajea Jo ,  Taeje Cho

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/498 ,  H01L23/544 ,  H01L25/065 ,  H01L25/00 ,  H01L23/48

CPC classification number: H01L25/0657 ,  H01L23/3677 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/50 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/0361 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14136 ,  H01L2224/14177 ,  H01L2224/14179 ,  H01L2224/14505 ,  H01L2224/14519 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17177 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32148 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8113 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2924/15311 ,  H01L2924/3512 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/17136 ,  H01L2224/17179

Abstract: An embodiment includes a semiconductor package comprising: a substrate; a first semiconductor chip mounted on the substrate; a second semiconductor chip mounted on a top surface of the first semiconductor chip; a connecting bump disposed between the first and second semiconductor chips to electrically connect the second semiconductor chip to the first semiconductor chip; and a first heat dissipation part disposed on the top surface of the first semiconductor chip between the first and second semiconductor chips and spaced apart from a bottom surface of the second semiconductor chip.