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公开(公告)号:US20240305279A1
公开(公告)日:2024-09-12
申请号:US18460030
申请日:2023-09-01
Applicant: Kioxia Corporation
Inventor: Toshifumi WATANABE , Kiyofumi SAKURAI , Teppei HIGASHITSUJI , Takumi KOSAKI , Eiji KOZUKA
CPC classification number: H03K3/356017 , G11C16/0483 , G11C16/26 , G11C16/30
Abstract: A data latch circuit according to embodiments described herein includes a first circuit and a second circuit. The first circuit has a first transistor with a first conductivity type and a second transistor with a second conductivity type that differs from the first conductivity type being connected in series and stores a first logical value. The second circuit has a third transistor with the first conductivity type and a fourth transistor with the second conductivity type being connected in series and stores a second logical value being an inversion of the first logical value. The data latch circuit enables one of a first voltage and a second voltage that differs from the first voltage to be applied to back gates of the first transistor and the third transistor and enables a third voltage to be applied to sources of the first transistor and the third transistor.
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公开(公告)号:US20250087274A1
公开(公告)日:2025-03-13
申请号:US18960230
申请日:2024-11-26
Applicant: Kioxia Corporation
Inventor: Hiroyuki TAKENAKA , Akihiko CHIBA , Teppei HIGASHITSUJI , Kiyofumi SAKURAI , Hiroaki NAKASA , Youichi MAGOME
Abstract: A semiconductor storage device includes a first semiconductor substrate, a second semiconductor substrate, a first memory cell and a second memory cell provided between the first semiconductor substrate and the second semiconductor substrate, a first word line electrically connected to the first memory cell, a second word line electrically connected to the second memory cell, a first transistor that is provided on the first semiconductor substrate and electrically connected between the first word line and a first wiring through which a voltage is applied to the first word line, and a second transistor that is provided on the semiconductor substrate and electrically connected between the second word line and a second wiring through which a voltage is applied to the second word line.
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公开(公告)号:US20230209829A1
公开(公告)日:2023-06-29
申请号:US18176656
申请日:2023-03-01
Applicant: KIOXIA CORPORATION
Inventor: Toshifumi MINAMI , Atsuhiro SATO , Keisuke YONEHAMA , Yasuyuki BABA , Hiroshi SHINOHARA , Hideyuki KAMATA , Teppei HIGASHITSUJI
CPC classification number: H10B43/27 , H01L29/7926 , H10B41/20 , H10B41/27 , H10B43/00 , H10B43/10 , H10B43/20 , H10B43/35
Abstract: A semiconductor memory device includes a conducting layer and an insulating layer that are disposed above a semiconductor substrate, a plurality of pillars that extend in a direction which crosses a surface of the semiconductor substrate, and a plate that is disposed between the plurality of pillars and extends in the same direction as the pillars. A surface of the plate, which faces the pillars, has convex portions and non-convex portions.
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公开(公告)号:US20240055057A1
公开(公告)日:2024-02-15
申请号:US18177026
申请日:2023-03-01
Applicant: Kioxia Corporation
Inventor: Teppei HIGASHITSUJI , Toshifumi WATANABE
Abstract: A semiconductor memory includes a memory cell, a bit line electrically connected to the memory cell, a sense amplifier including a first latch circuit, a first hookup circuit, a second latch circuit, a first wiring, and a first pre-charge circuit. The sense amplifier is in a first circuit area. The first hookup circuit is in a second circuit area and configured to control connection between the bit line and the sense amplifier. The first wiring is connected between the first latch circuit and the second latch circuit. The first pre-charge circuit includes a first transistor in a third circuit area between the first circuit area and the second circuit area. The first transistor has a first end connected to the first wiring at a first position in the third circuit area and a second end connectable to a terminal supplied with one of a pre-charge voltage and a ground voltage.
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公开(公告)号:US20220246196A1
公开(公告)日:2022-08-04
申请号:US17458067
申请日:2021-08-26
Applicant: KIOXIA CORPORATION
Inventor: Hiroyuki TAKENAKA , Akihiko CHIBA , Teppei HIGASHITSUJI , Kiyofumi SAKURAI , Hiroaki NAKASA , Youichi MAGOME
IPC: G11C11/408 , G11C11/4094 , G11C11/4074 , G11C11/4091 , G11C5/06
Abstract: A semiconductor storage device includes a first semiconductor substrate, a second semiconductor substrate, a first memory cell and a second memory cell provided between the first semiconductor substrate and the second semiconductor substrate, a first word line electrically connected to the first memory cell, a second word line electrically connected to the second memory cell, a first transistor that is provided on the first semiconductor substrate and electrically connected between the first word line and a first wiring through which a voltage is applied to the first word line, and a second transistor that is provided on the semiconductor substrate and electrically connected between the second word line and a second wiring through which a voltage is applied to the second word line.
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公开(公告)号:US20240306393A1
公开(公告)日:2024-09-12
申请号:US18666035
申请日:2024-05-16
Applicant: Kioxia Corporation
Inventor: Toshifumi MINAMI , Atsuhiro SATO , Keisuke YONEHAMA , Yasuyuki BABA , Hiroshi SHINOHARA , Hideyuki KAMATA , Teppei HIGASHITSUJI
CPC classification number: H10B43/27 , H01L29/7926 , H10B41/20 , H10B41/27 , H10B43/00 , H10B43/10 , H10B43/20 , H10B43/35
Abstract: A semiconductor memory device includes a conducting layer and an insulating layer that are disposed above a semiconductor substrate, a plurality of pillars that extend in a direction which crosses a surface of the semiconductor substrate, and a plate that is disposed between the plurality of pillars and extends in the same direction as the pillars. A surface of the plate, which faces the pillars, has convex portions and non-convex portions.
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公开(公告)号:US20240029797A1
公开(公告)日:2024-01-25
申请号:US18480305
申请日:2023-10-03
Applicant: Kioxia Corporation
Inventor: Hiroyuki TAKENAKA , Akihiko CHIBA , Teppei HIGASHITSUJI , Kiyofumi SAKURAI , Hiroaki NAKASA , Youichi MAGOME
CPC classification number: G11C16/14 , G11C5/06 , G11C16/0483 , G11C16/26 , G11C16/16 , G11C16/30 , G11C16/24
Abstract: A semiconductor storage device includes a first semiconductor substrate, a second semiconductor substrate, a first memory cell and a second memory cell provided between the first semiconductor substrate and the second semiconductor substrate, a first word line electrically connected to the first memory cell, a second word line electrically connected to the second memory cell, a first transistor that is provided on the first semiconductor substrate and electrically connected between the first word line and a first wiring through which a voltage is applied to the first word line, and a second transistor that is provided on the semiconductor substrate and electrically connected between the second word line and a second wiring through which a voltage is applied to the second word line.
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公开(公告)号:US20220216232A1
公开(公告)日:2022-07-07
申请号:US17700951
申请日:2022-03-22
Applicant: KIOXIA CORPORATION
Inventor: Toshifumi MINAMI , Atsuhiro SATO , Keisuke YONEHAMA , Yasuyuki BABA , Hiroshi SHINOHARA , Hideyuki KAMATA , Teppei HIGASHITSUJI
IPC: H01L27/11582 , H01L27/11565 , H01L27/1157 , H01L27/11578 , H01L27/11551 , H01L29/792 , H01L27/11563 , H01L27/11556
Abstract: A semiconductor memory device includes a conducting layer and an insulating layer that are disposed above a semiconductor substrate, a plurality of pillars that extend in a direction which crosses a surface of the semiconductor substrate, and a plate that is disposed between the plurality of pillars and extends in the same direction as the pillars. A surface of the plate, which faces the pillars, has convex portions and non-convex portions.
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