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公开(公告)号：US11073487B2
公开(公告)日：2021-07-27
申请号：US15974962
申请日：2018-05-09
Applicant: KLA-Tencor Corporation
Inventor： Alexander Bykanov , Nikolay Artemiev , Joseph A. Di Regolo , Antonio Gellineau , Alexander Kuznetsov , Andrei Veldman , John Hench
IPC: G01N23/02 , G01N23/201 , H01L21/67 , G01N23/205 , G01N23/207 , H01L21/68 , H01L21/687
Abstract: Methods and systems for positioning a specimen and characterizing an x-ray beam incident onto the specimen in a Transmission, Small-Angle X-ray Scatterometry (T-SAXS) metrology system are described herein. A specimen positioning system locates a wafer vertically and actively positions the wafer in six degrees of freedom with respect to the x-ray illumination beam without attenuating the transmitted radiation. In some embodiments, a cylindrically shaped occlusion element is scanned across the illumination beam while the detected intensity of the transmitted flux is measured to precisely locate the beam center. In some other embodiments, a periodic calibration target is employed to precisely locate the beam center. The periodic calibration target includes one or more spatially defined zones having different periodic structures that diffract X-ray illumination light into distinct, measurable diffraction patterns.
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公开(公告)号：US10712145B2
公开(公告)日：2020-07-14
申请号：US15787789
申请日：2017-10-19
Applicant: KLA-Tencor Corporation
Inventor： Boxue Chen , Andrei Veldman , Alexander Kuznetsov , Andrei V. Shchegrov
IPC: G01B11/02 , G01B15/00 , G01N21/95 , G01N21/956 , G01N23/225 , G01N23/201 , H01L21/66 , G01N23/2251
Abstract: Methods and systems for evaluating the geometric characteristics of patterned structures are presented. More specifically, geometric structures generated by one or multiple patterning processes are measured by two or more metrology systems in accordance with a hybrid metrology methodology. A measurement result from one metrology system is communicated to at least one other metrology systems to increase the measurement performance of the receiving system. Similarly, a measurement result from the receiving metrology system is communicated back to the sending metrology system to increase the measurement performance of the sending system. In this manner, measurement results obtained from each metrology system are improved based on measurement results received from other cooperating metrology systems. In some examples, metrology capability is expanded to measure parameters of interest that were previously unmeasurable by each metrology system operating independently. In other examples, measurement sensitivity is improved and parameter correlation is reduced.
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公开(公告)号：US20170016815A1
公开(公告)日：2017-01-19
申请号：US15217549
申请日：2016-07-22
Applicant: KLA-Tencor Corporation
Inventor： Andrei V. Shchegrov , Lawrence D. Rotter , David Y. Wang , Andrei Veldman , Kevin Peterlinz , Gregory Brady , Derrick A. Shaughnessy
CPC classification number: G01N21/211 , G01B11/0616 , G01N21/4738 , G01N21/55 , G01N2021/213 , G03F7/70608 , G03F7/70625 , G03F7/70633
Abstract: The system includes a modulatable illumination source configured to illuminate a surface of a sample disposed on a sample stage, a detector configured to detect illumination emanating from a surface of the sample, illumination optics configured to direct illumination from the modulatable illumination source to the surface of the sample, collection optics configured to direct illumination from the surface of the sample to the detector, and a modulation control system communicatively coupled to the modulatable illumination source, wherein the modulation control system is configured to modulate a drive current of the modulatable illumination source at a selected modulation frequency suitable for generating illumination having a selected coherence feature length. In addition, the present invention includes the time-sequential interleaving of outputs of multiple light sources to generate periodic pulses trains for use in multi-wavelength time-sequential optical metrology.
Abstract translation: 该系统包括被配置为照亮设置在样品台上的样品的表面的可调制照明源，被配置为检测从样品表面发出的照射的检测器，被配置为将来自可调节照明源的照明引导到 所述样品，集合光学器件被配置为将样品的表面的照射引导到所述检测器;以及调制控制系统，其通信地耦合到所述可调节照明源，其中所述调制控制系统被配置为调制所述可调节照明源的驱动电流 选择的调制频率，其适于产生具有选定的相干特征长度的照明。 此外，本发明包括多个光源的输出的时间顺序交错以产生用于多波长时间顺序光学测量的周期性脉冲串。
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公开(公告)号：US10969328B2
公开(公告)日：2021-04-06
申请号：US16284950
申请日：2019-02-25
Applicant: KLA-Tencor Corporation
Inventor： Andrei V. Shchegrov , Lawrence D. Rotter , David Y. Wang , Andrei Veldman , Kevin Peterlinz , Gregory Brady , Derrick A. Shaughnessy
Abstract: The system includes a modulatable illumination source configured to illuminate a surface of a sample disposed on a sample stage, a detector configured to detect illumination emanating from a surface of the sample, illumination optics configured to direct illumination from the modulatable illumination source to the surface of the sample, collection optics configured to direct illumination from the surface of the sample to the detector, and a modulation control system communicatively coupled to the modulatable illumination source, wherein the modulation control system is configured to modulate a drive current of the modulatable illumination source at a selected modulation frequency suitable for generating illumination having a selected coherence feature length. In addition, the present invention includes the time-sequential interleaving of outputs of multiple light sources to generate periodic pulse trains for use in multi-wavelength time-sequential optical metrology.
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公开(公告)号：US10794839B2
公开(公告)日：2020-10-06
申请号：US16283690
申请日：2019-02-22
Applicant: KLA-Tencor Corporation
Inventor： Aaron J. Rosenberg , Jonathan Iloreta , Thaddeus G. Dziura , Antonio Gellineau , Yin Xu , Kaiwen Xu , John Hench , Abhi Gunde , Andrei Veldman , Liequan Lee , Houssam Chouaib
IPC: G01N21/00 , G01N21/95 , H01L27/02 , H01L27/088 , H01L27/108 , G06T17/10 , G06T15/20 , G01N21/956 , H01L27/115 , G06F30/39
Abstract: A semiconductor metrology tool inspects an area of a semiconductor wafer. The inspected area includes a plurality of instances of a 3D semiconductor structure arranged periodically in at least one dimension. A computer system generates a model of a respective instance of the 3D semiconductor structure based on measurements collected during the inspection. The computer system renders an image of the model that shows a 3D shape of the model and provides the image to a device for display.
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Patent Agency Ranking
公开(公告)号：US20190129376A1
公开(公告)日：2019-05-02
申请号：US16232479
申请日：2018-12-26
Applicant: KLA-Tencor Corporation
Inventor： Andrei Veldman
IPC: G05B19/406 , G01N21/21 , G01N21/25 , G03F7/20 , G01B11/06
Abstract: Methods and systems for solving measurement models of complex device structures with reduced computational effort and memory requirements are presented. The computational efficiency of electromagnetic simulation algorithms based on truncated spatial harmonic series is improved for periodic targets that exhibit a fundamental spatial period and one or more approximate periods that are integer fractions of the fundamental spatial period. Spatial harmonics are classified according to each distinct period of the target exhibiting multiple periodicity. A distinct truncation order is selected for each group of spatial harmonics. This approach produces optimal, sparse truncation order sampling patterns, and ensures that only harmonics with significant contributions to the approximation of the target are selected for computation. Metrology systems employing these techniques are configured to measure process parameters and structural and material characteristics associated with different semiconductor fabrication processes.
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7.发明申请公开(公告)号：US20180328868A1
公开(公告)日：2018-11-15
申请号：US15974962
申请日：2018-05-09
Applicant: KLA-Tencor Corporation
Inventor： Alexander Bykanov , Nikolay Artemiev , Joseph A. Di Regolo , Antonio Gellineau , Alexander Kuznetsov , Andrei Veldman , John Hench
IPC: G01N23/201 , H01L21/67 , G01N23/205 , H01L21/68 , G01N23/207 , H01L21/687
CPC classification number: G01N23/201 , G01N23/205 , G01N23/207 , G01N2223/6116 , H01L21/67259 , H01L21/67282 , H01L21/67288 , H01L21/681 , H01L21/68764
Abstract: Methods and systems for positioning a specimen and characterizing an x-ray beam incident onto the specimen in a Transmission, Small-Angle X-ray Scatterometry (T-SAXS) metrology system are described herein. A specimen positioning system locates a wafer vertically and actively positions the wafer in six degrees of freedom with respect to the x-ray illumination beam without attenuating the transmitted radiation. In some embodiments, a cylindrically shaped occlusion element is scanned across the illumination beam while the detected intensity of the transmitted flux is measured to precisely locate the beam center. In some other embodiments, a periodic calibration target is employed to precisely locate the beam center. The periodic calibration target includes one or more spatially defined zones having different periodic structures that diffract X-ray illumination light into distinct, measurable diffraction patterns.
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公开(公告)号：US20180112968A1
公开(公告)日：2018-04-26
申请号：US15787789
申请日：2017-10-19
Applicant: KLA-Tencor Corporation
Inventor： Boxue Chen , Andrei Veldman , Alexander Kuznetsov , Andrei V. Shchegrov
IPC: G01B11/02 , G01B15/00 , G01N21/95 , G01N21/956 , G01N23/225 , G01N23/201
Abstract: Methods and systems for evaluating the geometric characteristics of patterned structures are presented. More specifically, geometric structures generated by one or multiple patterning processes are measured by two or more metrology systems in accordance with a hybrid metrology methodology. A measurement result from one metrology system is communicated to at least one other metrology systems to increase the measurement performance of the receiving system. Similarly, a measurement result from the receiving metrology system is communicated back to the sending metrology system to increase the measurement performance of the sending system. In this manner, measurement results obtained from each metrology system are improved based on measurement results received from other cooperating metrology systems. In some examples, metrology capability is expanded to measure parameters of interest that were previously unmeasurable by each metrology system operating independently. In other examples, measurement sensitivity is improved and parameter correlation is reduced.
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公开(公告)号：US09885962B2
公开(公告)日：2018-02-06
申请号：US14521966
申请日：2014-10-23
Applicant: KLA-Tencor Corporation
Inventor： Andrei Veldman , Michael S. Bakeman , Andrei V. Shchegrov , Walter D. Mieher
CPC classification number: G03F7/70633 , G01N21/9501 , H01L22/12
Abstract: Disclosed are apparatus and methods for determining overlay error in a semiconductor target. For illumination x-rays having at least one angle of incidence (AOI), a correlation model is obtained, and the correlation model correlates overlay error of a target with a modulation intensity parameter for each of one or more diffraction orders (or a continuous diffraction intensity distribution) for x-rays scattered from the target in response to the illumination x-rays. A first target is illuminated with illumination x-rays having the at least one AOI and x-rays that are scattered from the first target in response to the illumination x-rays are collected. An overlay error of the first target is determined based on the modulation intensity parameter of the x-rays collected from the first target for each of the one or more diffraction orders (or the continuous diffraction intensity distribution) and the correlation model.
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公开(公告)号：US11086288B2
公开(公告)日：2021-08-10
申请号：US16232479
申请日：2018-12-26
Applicant: KLA-Tencor Corporation
Inventor： Andrei Veldman
IPC: G05B19/406 , G01B11/06 , G03F7/20 , G01N21/21 , G01N21/25
Abstract: Methods and systems for solving measurement models of complex device structures with reduced computational effort and memory requirements are presented. The computational efficiency of electromagnetic simulation algorithms based on truncated spatial harmonic series is improved for periodic targets that exhibit a fundamental spatial period and one or more approximate periods that are integer fractions of the fundamental spatial period. Spatial harmonics are classified according to each distinct period of the target exhibiting multiple periodicity. A distinct truncation order is selected for each group of spatial harmonics. This approach produces optimal, sparse truncation order sampling patterns, and ensures that only harmonics with significant contributions to the approximation of the target are selected for computation. Metrology systems employing these techniques are configured to measure process parameters and structural and material characteristics associated with different semiconductor fabrication processes.
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