公开(公告)号：US06706739B2

公开(公告)日：2004-03-16

申请号：US10191941

申请日：2002-07-09

申请人： Kak-Shan Shia ,  Shin-Ru Shih ,  Chung-Ming Chang ,  Jyh-Haur Chern ,  Wen-Tai Li ,  Shu-Jen Chen ,  Ming-Chu Hsu

发明人： Kak-Shan Shia ,  Shin-Ru Shih ,  Chung-Ming Chang ,  Jyh-Haur Chern ,  Wen-Tai Li ,  Shu-Jen Chen ,  Ming-Chu Hsu

IPC分类号： A61K3144

CPC分类号： C07D233/32 ,  C07D401/04 ,  C07D401/14 ,  C07D405/12 ,  C07D417/12

摘要： A compound having the formula: in which R1, R2, R3, T, W, m, x, and y are defined as in the specification. Also disclosed is a method of treating enterovirus infection by using a compound described above.

摘要翻译： 具有下式的化合物：其中R 1，R 2，R 3，T，W，m，x和y如说明书中所定义。 还公开了使用上述化合物治疗肠道病毒感染的方法。

公开(公告)号：US20130004939A1

公开(公告)日：2013-01-03

申请号：US13135280

申请日：2011-06-30

申请人： Chung-Ming Chang ,  Chiuan-Chian Chiou

发明人： Chung-Ming Chang ,  Chiuan-Chian Chiou

IPC分类号： C12Q1/70

CPC分类号： G01N33/54313 ,  G01N33/56983 ,  G01N2333/11

摘要： Fetuin-beads, a manufacturing method thereof and a method of concentrating and detecting influenza virus by the fetuin-beads are disclosed. The method of concentrating and detecting an influenza virus by the fetuin-beads comprises the steps of preparing fetuin-beads; mixing the fetuin-beads and a solution capable of providing salt ions to obtain a fetuin-bead solution; mixing the fetuin-bead solution and a sample comprising the influenza virus to concentrate the influenza virus onto the fetuin-beads to obtain a plurality of fetuin bead-influenza virus combinations; and collecting the fetuin bead-influenza virus combinations and using a virus testing method to detect the influenza virus on the fetuin bead-influenza virus combinations. Therefore, an easy and fast method to detect the influenza virus with timeliness and high accuracy is provided.

摘要翻译： 公开了胎儿球珠，其制造方法和胎球蛋白珠集中和检测流感病毒的方法。 通过胎球蛋白珠浓缩和检测流感病毒的方法包括制备胎球蛋白珠的步骤; 混合胎球蛋白珠和能够提供盐离子以获得胎球蛋白珠溶液的溶液; 将胎球蛋白珠溶液和包含流感病毒的样品混合以将流感病毒浓缩到胎球蛋白珠上以获得多种胎球蛋白珠流感病毒组合; 并收集胎球蛋白珠流感病毒组合，并使用病毒检测方法检测胎牛血清流感病毒组合中的流感病毒。 因此，提供了一种以及时和高精度检测流感病毒的简便快捷的方法。

公开(公告)号：US20070019405A1

公开(公告)日：2007-01-25

申请号：US11184953

申请日：2005-07-20

申请人： Chung-Ming Chang ,  Tung-Tsai Chang

发明人： Chung-Ming Chang ,  Tung-Tsai Chang

IPC分类号： F21V21/00

CPC分类号： F21L13/06 ,  F21Y2115/10

摘要： A portable long-running lighting device having a manual power generator of the present invention can generate electricity effectively and also can radiate for a long time. The portable long-running lighting device includes a manual power generator module, an electricity storage module, an LED (light-emitting diode) module and a housing. The manual power generator module includes an electricity generator, a transmission mechanism and a base. The electricity storage module is coupled to an electricity generator of the manual power generator module. The LED module includes a plurality of light-emitting diodes and a circuit. The circuit further includes a power saving circuit coupled between the electricity storage module and the light-emitting diodes. With a three-stage discharge mode, a discharge speed of the electricity storage module can be stabilized, so as to achieve an electricity saving effect.

摘要翻译： 具有本发明的手动发电机的便携式长跑照明装置可以有效地发电，并且也可长时间地辐射。 便携式长跑照明装置包括手动发电机模块，蓄电模块，LED（发光二极管）模块和壳体。 手动发电机模块包括发电机，变速机构和基座。 电力存储模块耦合到手动发电机模块的发电机。 LED模块包括多个发光二极管和电路。 电路还包括耦合在蓄电模块和发光二极管之间的节电电路。 通过三级放电模式，能够使蓄电模块的放电速度稳定，从而实现节电效果。

公开(公告)号：US06567270B2

公开(公告)日：2003-05-20

申请号：US09988094

申请日：2001-11-19

申请人： Wen-Lo Shieh ,  Ning Huang ,  Hui-Pin Chen ,  Hua-Wen Chiang ,  Chung-Ming Chang ,  Feng-Chang Tu ,  Fu-Yu Huang ,  Hsuan-Jui Chang ,  Chia-Chieh Hu ,  Wen-Long Leu

发明人： Wen-Lo Shieh ,  Ning Huang ,  Hui-Pin Chen ,  Hua-Wen Chiang ,  Chung-Ming Chang ,  Feng-Chang Tu ,  Fu-Yu Huang ,  Hsuan-Jui Chang ,  Chia-Chieh Hu ,  Wen-Long Leu

IPC分类号： H05K720

CPC分类号： H01L23/055 ,  H01L23/4093 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/00

摘要： A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.

摘要翻译： 具有冷却装置的半导体芯片封装包括适于覆盖至少半导体芯片的散热器，其特征在于，所述散热器具有倒置的U形横截面，从而在其内底部形成适于覆盖至少半导体 芯片和从所述散热器的周向下边缘向下延伸的多个销，每个所述销形成有颈部，扩大的头部和将所述颈部和所述扩大的头部分离成两部分的开口狭槽，由此包装 可以快速地从半导体芯片中去除热量，滤除噪声并降低电感。

公开(公告)号：US06499648B2

公开(公告)日：2002-12-31

申请号：US09988097

申请日：2001-11-19

申请人： Wen-Lo Shieh ,  Ning Huang ,  Hui-Pin Chen ,  Hua-Wen Chiang ,  Chung-Ming Chang ,  Feng-Chang Tu ,  Fu-Yu Huang ,  Hsuan-Jui Chang ,  Chia-Chieh Hu ,  Wen-Long Leu

发明人： Wen-Lo Shieh ,  Ning Huang ,  Hui-Pin Chen ,  Hua-Wen Chiang ,  Chung-Ming Chang ,  Feng-Chang Tu ,  Fu-Yu Huang ,  Hsuan-Jui Chang ,  Chia-Chieh Hu ,  Wen-Long Leu

IPC分类号： B23K3102

CPC分类号： B23K20/007 ,  B23K3/0623 ,  H01L24/11 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/451 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207

摘要： A device for making metal bumps includes a hard conical tubular member having a vertical conical passage at an upper portion thereof, a bell shaped chamber at a lower portion thereof which is larger than the vertical conical passage in diameter, located under and communicated with the vertical conical passage, and a circular recess which is larger than the bell shaped chamber in diameter, located under and communicated with the bell shaped chamber, thereby forming a capillary tube with a surface.

摘要翻译： 用于制造金属凸块的装置包括：硬锥形管状构件，在其上部具有垂直圆锥形通道，在其下部具有比直立的垂直圆锥形通道更大的钟形腔，位于垂直方向 圆锥形通道，以及直径比钟形室大的圆形凹槽，位于钟形室下面并与钟形腔连通，从而形成具有表面的毛细管。

公开(公告)号：US06358834B1

公开(公告)日：2002-03-19

申请号：US09688123

申请日：2000-10-16

申请人： Wen Lo Shieh ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Hsuan Jui Chang ,  Hui-Pin Chen ,  Ning Huang ,  Feng-Chang Tu ,  Chung-Ming Chang ,  Hua Wen Chiang ,  Chia-Chieh Hu

发明人： Wen Lo Shieh ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Hsuan Jui Chang ,  Hui-Pin Chen ,  Ning Huang ,  Feng-Chang Tu ,  Chung-Ming Chang ,  Hua Wen Chiang ,  Chia-Chieh Hu

IPC分类号： H01L23488

CPC分类号： H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/1225 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05099

摘要： A method of forming metal bumps on a wafer includes the steps of adhering a heat-resistant and steady synthetic tape on the top of the wafer, punching holes through the synthetic tape to form a blind hole on the synthetic tape above the under-bump-metallurgy layer (UBM), filling solder paste into the blind hole by a pusher, melting and then cooling the solder paste into a solder block removing the synthetic tape to expose the solder block, and melting the solder block to form a ball-shaped solder bump.

摘要翻译： 在晶片上形成金属凸块的方法包括以下步骤：将耐热和稳定的合成胶带粘附在晶片的顶部上，通过合成胶带穿孔，在合成胶带上形成盲孔， 冶金层（UBM），通过推动器将焊膏填充到盲孔中，熔化然后将焊膏冷却到焊料块中，去除合成胶带以暴露焊料块，并熔化焊料块以形成球形焊料 磕碰。