公开(公告)号：US4960488A

公开(公告)日：1990-10-02

申请号：US455799

申请日：1989-12-19

申请人： Kam S. Law ,  Cissy Leung ,  Ching C. Tang ,  Kenneth S. Collins ,  Mei Chang ,  Jerry Y. K. Wong ,  David Nin-Kou Wang

发明人： Kam S. Law ,  Cissy Leung ,  Ching C. Tang ,  Kenneth S. Collins ,  Mei Chang ,  Jerry Y. K. Wong ,  David Nin-Kou Wang

IPC分类号： C23C16/40 ,  C23C16/44 ,  C23C16/455 ,  C23C16/509 ,  C23C16/54 ,  H01L21/314 ,  H01L21/316

CPC分类号： C23C16/45565 ,  C23C16/402 ,  C23C16/44 ,  C23C16/4405 ,  C23C16/455 ,  C23C16/45521 ,  C23C16/5096 ,  C23C16/54 ,  H01J37/32082 ,  H01J37/3244 ,  H01J37/32862 ,  H01L21/31604 ,  Y02C20/30 ,  Y02P70/605 ,  Y10S438/905

摘要： A process for cleaning a reactor chamber both locally adjacent the RF electrodes and also throughout the chamber and the exhaust system to the including components such as the throttle valve. Preferably, a two-step continuous etch sequence is used in which the first step uses relatively high pressure, close electrode spacing and fluorocarbon gas chemistry for etching the electodes locally and the second step uses relatively lower pressure, farther electrode spacing and fluorinated gas chemistry for etching throughout the chamber and exhaust system. The local and extended etch steps may be used separately as well as together.

摘要翻译： 用于清洁反射室的方法，所述反应室局部地邻近RF电极以及整个室和排气系统到包括诸如节流阀的部件。 优选地，使用两步连续蚀刻序列，其中第一步骤使用相对高的压力，紧密的电极间距和碳氟化合物气体化学物质来局部蚀刻电极，并且第二步骤使用相对较低的压力，更远的电极间距和氟化气体化学 蚀刻整个腔室和排气系统。 本地和延长的蚀刻步骤可以单独使用和一起使用。

公开(公告)号：US4657616A

公开(公告)日：1987-04-14

申请号：US735821

申请日：1985-05-17

申请人： David W. Benzing ,  Jeffrey C. Benzing ,  Arthur D. Boren ,  Ching C. Tang

发明人： David W. Benzing ,  Jeffrey C. Benzing ,  Arthur D. Boren ,  Ching C. Tang

IPC分类号： B08B7/00 ,  C03C15/00 ,  C23C16/44 ,  C30B25/08 ,  B44C1/22 ,  C03C25/06

CPC分类号： H01J37/32862 ,  B08B7/00 ,  C03C15/00 ,  C23C16/4405 ,  C30B25/08 ,  Y10S134/902 ,  Y10S156/913

摘要： An apparatus for the in-situ cleaning of Low Pressure Chemical Vapor Deposition tube chambers (32) or Reduced Pressure Epitaxy bell jar chambers (42) having a base member (22) to create a vacuum seal upon engagement with the loading end of the chamber, at least one powered electrode (62) which protrudes from the base member into the chamber, at least on grounded electrode (60) which also protrudes from the base member into the chamber, a means for introducing gas (92) into the chamber, and an electrical network (16) that creates a radio frequency electrical field between the powered electrode and the grounded electrode. A plasma is created in the chamber by the interaction of the gas and the RF field, and the plasma etches unwanted deposits from the inner wall of the chamber. Several different configurations of electrode structures are shown.

摘要翻译： 一种用于原位清洗低压化学气相沉积管室（32）或减压外延钟罩室（42）的装置，其具有基部构件（22），以在与腔室的装载端接合时产生真空密封 至少一个从所述基座部件突出到所述腔室中的至少一个动力电极（62）至少在从所述基座部件突出到所述腔室中的接地电极（60）上，用于将气体（92）引入所述腔室中的装置， 以及在所述电源电极和所述接地电极之间产生射频电场的电网（16）。 通过气体和RF场的相互作用在腔室中产生等离子体，并且等离子体从室的内壁蚀刻不想要的沉积物。 示出了几种不同结构的电极结构。

公开(公告)号：US5626278A

公开(公告)日：1997-05-06

申请号：US562542

申请日：1995-11-20

申请人： Ching C. Tang

发明人： Ching C. Tang

IPC分类号： B23K3/06 ,  B23K35/02 ,  B23K35/14 ,  H05K3/34

CPC分类号： B23K3/0607 ,  B23K35/0222 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/3478 ,  B23K2201/40 ,  H05K2201/10424 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49149

摘要： A solder delivery and array device for soldering electronic components and/or IC chips to printed circuit boards (PCB) or substrates comprises solder performs with predetermined weight, size, shape, and a flexible retaining means with spaced openings according to the layout of pins or leads of the components and/or IC chips. The solder performs are positioned and fixed in the openings through mechanical locking. The devices are located between components and PCB or substrate during the soldering processing. By using these devices, through hole type components and surface mount type parts can be attached onto the PCB through heat reflow soldering at same time without the wave soldering process, and overheating can be avoided during the soldering process especially for the pin grid array component. Another bonus for the application of the device is shorting the required lead time for research and development in new electronic products.

摘要翻译： 用于将电子部件和/或IC芯片焊接到印刷电路板（PCB）或基板的焊料输送和阵列装置包括具有预定重量，尺寸，形状和柔性保持装置的焊料，其具有根据销的布局或间隔开的开口 部件和/或IC芯片的引线。 焊料执行通过机械锁定定位和固定在开口中。 在焊接处理期间，器件位于部件和PCB或基板之间。 通过使用这些器件，通孔型元件和表面贴装型部件可以同时通过热回流焊接连接到PCB上，无需波峰焊接工艺，并且在焊接过程中特别是针脚阵列部件可以避免过热。 应用该设备的另一个优点是缩短了新电子产品研发所需的交付时间。