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公开(公告)号：US08834077B2
公开(公告)日：2014-09-16
申请号：US13003293
申请日：2009-06-23
申请人： Tae Sik Yoon , Soon Jin Cho , Seung Hyun Cho , Jae Joon Lee
发明人： Tae Sik Yoon , Soon Jin Cho , Seung Hyun Cho , Jae Joon Lee
CPC分类号： B22F7/062 , B22F2005/001 , B22F2998/00 , B23B51/02 , B23B2251/426 , B23P15/32 , C22C38/08 , Y10T408/03 , Y10T408/78 , Y10T408/907 , Y10T408/9097 , B22F2207/20 , B22F5/06 , B22F5/10
摘要： A method of fabricating a micro drill, which includes a drill part for machining a hole and a shank part fixed to a motor, the drill part and the shank part being made of different materials. The method includes the steps of forming a drill part-forming powder compact having a recess in one end thereof, and forming a shank part-forming powder compact having a protrusion, the protrusion intended to be fitted into the recess of the drill part-forming powder compact, forming an assembly of the drill part-forming powder compact and the shank part-forming powder compact, with the protrusion fitted into the recess, and simultaneously sintering the assembly of the drill part-forming powder compact and the shank part-forming powder compact.
摘要翻译： 一种微钻的制造方法，其特征在于，包括用于加工孔的钻头部和固定于马达的柄部，所述钻头部和所述柄部由不同的材料构成。 该方法包括以下步骤：在其一端形成具有凹部的钻头成形粉末压块，并且形成具有突出部的柄部形成用粉末压块，所述突起旨在嵌入到钻头成形用凹部 粉末压块，形成钻头成形粉末压块和柄部分成型粉末压块的组件，突起嵌入凹槽中，同时烧结钻头成形粉末压块和柄部分成型的组件 粉末紧凑。
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公开(公告)号：US20110182684A1
公开(公告)日：2011-07-28
申请号：US13003293
申请日：2009-06-23
申请人： Tae Sik Yoon , Soon Jin Cho , Seung Hyun Cho , Jae Joon Lee
发明人： Tae Sik Yoon , Soon Jin Cho , Seung Hyun Cho , Jae Joon Lee
CPC分类号： B22F7/062 , B22F2005/001 , B22F2998/00 , B23B51/02 , B23B2251/426 , B23P15/32 , C22C38/08 , Y10T408/03 , Y10T408/78 , Y10T408/907 , Y10T408/9097 , B22F2207/20 , B22F5/06 , B22F5/10
摘要： A method of fabricating a micro drill, which includes a drill part for machining a hole and a shank part fixed to a motor, the drill part and the shank part being made of different materials. The method includes the steps of forming a drill part-forming powder compact having a recess in one end thereof, and forming a shank part-forming powder compact having a protrusion, the protrusion intended to be fitted into the recess of the drill part-forming powder compact, forming an assembly of the drill part-forming powder compact and the shank part-forming powder compact, with the protrusion fitted into the recess, and simultaneously sintering the assembly of the drill part-forming powder compact and the shank part-forming powder compact.
摘要翻译： 一种微钻的制造方法，其特征在于，包括用于加工孔的钻头部和固定于马达的柄部，所述钻头部和所述柄部由不同的材料构成。 该方法包括以下步骤：在其一端形成具有凹部的钻头成形粉末压块，并且形成具有突出部的柄部形成用粉末压块，所述突起旨在嵌入到钻头成形用凹部 粉末压块，形成钻头成形粉末压块和柄部分成型粉末压块的组件，突起嵌入凹槽中，同时烧结钻头成形粉末压块和柄部分成型的组件 粉末紧凑。
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公开(公告)号：US20110115121A1
公开(公告)日：2011-05-19
申请号：US12926864
申请日：2010-12-14
申请人： Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
发明人： Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
CPC分类号： H05K1/056 , B82Y10/00 , H01L21/486 , H01L21/4871 , H01L23/3677 , H01L23/373 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K7/20481 , H05K2201/026 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T428/24917
摘要： A method of manufacturing a heat radiation substrate having a metal core, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.
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公开(公告)号：US08061025B2
公开(公告)日：2011-11-22
申请号：US12926864
申请日：2010-12-14
申请人： Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
发明人： Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
CPC分类号： H05K1/056 , B82Y10/00 , H01L21/486 , H01L21/4871 , H01L23/3677 , H01L23/373 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K7/20481 , H05K2201/026 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T428/24917
摘要： A method of manufacturing a heat radiation substrate having a metal core, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.
摘要翻译： 一种制造具有金属芯的散热基板的方法，包括在模具中注入成型的碳纳米管和金属的混合粉末以制造具有通孔的金属芯; 用绝缘树脂模制包括通孔的整个金属芯，以制造金属芯基板; 处理设置在通孔中的绝缘树脂以形成连接孔; 在形成有连接孔的金属芯基板上形成电路图案。
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5.发明申请公开(公告)号：US20090297801A1
公开(公告)日：2009-12-03
申请号：US12003490
申请日：2007-12-26
申请人： Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
发明人： Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
CPC分类号： H05K1/056 , B82Y10/00 , H01L21/486 , H01L21/4871 , H01L23/3677 , H01L23/373 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K7/20481 , H05K2201/026 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T428/24917
摘要： Disclosed herein is a method of manufacturing a heat radiation substrate, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.
摘要翻译： 本发明公开了一种制造散热基板的方法，包括：在模具中注入碳纳米管和金属的混合粉末以制造具有通孔的金属芯; 用绝缘树脂模制包括通孔的整个金属芯，以制造金属芯基板; 处理设置在通孔中的绝缘树脂以形成连接孔; 在形成有连接孔的金属芯基板上形成电路图案。
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6.发明授权公开(公告)号：US07875340B2
公开(公告)日：2011-01-25
申请号：US12003490
申请日：2007-12-26
申请人： Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
发明人： Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
IPC分类号： H05K1/00
CPC分类号： H05K1/056 , B82Y10/00 , H01L21/486 , H01L21/4871 , H01L23/3677 , H01L23/373 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K7/20481 , H05K2201/026 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T428/24917
摘要： Disclosed herein is a method of manufacturing a heat radiation substrate, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.
摘要翻译： 本发明公开了一种制造散热基板的方法，包括：在模具中注入碳纳米管和金属的混合粉末以制造具有通孔的金属芯; 用绝缘树脂模制包括通孔的整个金属芯，以制造金属芯基板; 处理设置在通孔中的绝缘树脂以形成连接孔; 在形成有连接孔的金属芯基板上形成电路图案。
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公开(公告)号：US08558360B2
公开(公告)日：2013-10-15
申请号：US12926137
申请日：2010-10-27
申请人： Ey Yong Kim , Young Hwan Shin , Soon Jin Cho , Jong Yong Kim , Jin Seok Lee
发明人： Ey Yong Kim , Young Hwan Shin , Soon Jin Cho , Jong Yong Kim , Jin Seok Lee
IPC分类号： H01L21/02
CPC分类号： H01L21/563 , H01L23/3128 , H01L23/49816 , H01L24/16 , H01L24/31 , H01L24/81 , H01L2224/16225 , H01L2224/26175 , H01L2224/27013 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81192 , H01L2224/81801 , H01L2224/83051 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2924/19041 , H01L2924/00012 , H01L2924/00
摘要： There is provided a flip chip package including an electronic device, a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is mounted, and a connection pad disposed outside the mounting region, a resin layer formed on the board and including a trench formed by removing a part of the resin layer, and a dam member provided on the trench and preventing the leakage of an underfill between the mounting region and the connection pad. Since the dam member, formed on the processed resin layer, can prevent the leakage of the underfill, a package defect rate can be lowered, and connection reliability can be improved.
摘要翻译： 提供了一种倒装芯片封装，包括电子器件，包括设置在其上安装有电子器件的板的安装区域内的导电焊盘的基板和设置在安装区域外部的连接焊盘，形成在其上的树脂层 并且包括通过去除树脂层的一部分而形成的沟槽，以及设置在沟槽上的防止构件，并防止在安装区域和连接衬垫之间的底部填充物的泄漏。 由于形成在加工树脂层上的阻挡部件能够防止底部填充物的泄漏，因此能够降低包装缺陷率，可以提高连接可靠性。
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8.发明授权公开(公告)号：US08445790B2
公开(公告)日：2013-05-21
申请号：US12320284
申请日：2009-01-22
申请人： Seok Kyu Lee , Soon Oh Jung , Jong Kuk Hong , Soon Jin Cho
发明人： Seok Kyu Lee , Soon Oh Jung , Jong Kuk Hong , Soon Jin Cho
IPC分类号： H05K1/11
CPC分类号： H05K3/00 , H05K1/113 , H05K3/0052 , H05K3/007 , H05K3/4007 , H05K3/426 , H05K3/4682 , H05K2201/0367 , H05K2201/09563 , H05K2201/096 , H05K2203/0156 , H05K2203/054 , H05K2203/1572
摘要： Disclosed herein is a coreless substrate having filled via pads and a method of manufacturing the same. Insulating layers are formed on both sides of a build-up layer, and via-pads are embedded in the insulating layers such that the via-pads are flush with the insulating layers. The via pads are not separated from a substrate, and thus reliability of the pads is increased. Flatness of bumps is increased, and thus bonding of flip chips becomes easy.
摘要翻译： 本文公开了具有填充通孔焊盘的无芯基板及其制造方法。 绝缘层形成在堆积层的两侧，并且通孔焊盘嵌入在绝缘层中，使得通孔焊盘与绝缘层齐平。 通孔焊盘不与衬底分离，因此焊盘的可靠性增加。 凸起的平坦度增加，因此倒装芯片的结合变得容易。
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公开(公告)号：US20110097553A1
公开(公告)日：2011-04-28
申请号：US12631624
申请日：2009-12-04
申请人： Jong Kuk Hong , Soon Jin Cho , Sun Uk Hwang
发明人： Jong Kuk Hong , Soon Jin Cho , Sun Uk Hwang
CPC分类号： H05K3/0032 , H05K1/036 , H05K1/0366 , H05K3/045 , H05K3/107 , H05K2201/0209 , H05K2201/029 , Y10T428/2462
摘要： Disclosed is a trench substrate, which includes a first insulating layer having trenches formed therein, a second insulating layer disposed on a lower surface of the first insulating layer and having laser processability inferior to that of the first insulating layer, and a negative pattern formed in the trenches, and in which the second insulating layer having laser processability inferior to that of the first insulating layer functions as a stopper, so that the trenches having the same shape are formed in the first insulating layer, thus enabling the formation of a fine and uniform circuit pattern. A method of fabricating the trench substrate is also provided.
摘要翻译： 公开了一种沟槽衬底，其包括其中形成有沟槽的第一绝缘层，设置在第一绝缘层的下表面上并且具有劣于第一绝缘层的激光加工性的第二绝缘层，以及形成在 沟槽，其中具有劣于第一绝缘层的激光加工性的第二绝缘层用作止动件，使得具有相同形状的沟槽形成在第一绝缘层中，从而能够形成微细的和 均匀的电路图案。 还提供了制造沟槽衬底的方法。
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公开(公告)号：US06400021B1
公开(公告)日：2002-06-04
申请号：US09604040
申请日：2000-06-27
申请人： Soon Jin Cho
发明人： Soon Jin Cho
IPC分类号： H01L2348
CPC分类号： H01L24/10 , H01L23/3107 , H01L24/13 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05557 , H01L2224/05558 , H01L2224/05572 , H01L2224/05647 , H01L2224/13 , H01L2224/13022 , H01L2224/13099 , H01L2924/0002 , H01L2924/01004 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01327 , H01L2924/014 , H01L2924/351 , H01L2224/05552 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要： Disclosed is a wafer level package and a method for fabricating the wafer level package, in which the contact area between the ball land and the solder ball is enlarged, so that the adhesion force between them is highly strengthened. The wafer level package has a semiconductor chip having a lower dielectric layer formed at a bond pad forming surface thereof. The lower dielectric layer includes vias and grooves, and the bond pads are exposed through the vias. A metal pattern interconnecting the bond pads and the grooves with each other is deposited on the lower dielectric layer. An upper dielectric layer is applied on the lower dielectric layer. The upper dielectric layer has a ball land through which the metal pattern deposited on a surface of the grooves is exposed. A solder ball is mounted on the ball land.
摘要翻译： 公开了一种用于制造晶片级封装的晶片级封装和方法，其中，焊盘和焊球之间的接触面积增大，使得它们之间的粘附力得到高度的增强。 晶片级封装具有在其接合焊盘形成表面形成有下介电层的半导体芯片。 下介电层包括通孔和沟槽，并且接合焊盘通过通孔露出。 将接合焊盘和沟槽彼此互连的金属图案沉积在下介电层上。 在下电介质层上施加上电介质层。 上电介质层具有暴露出凹槽表面上沉积的金属图案的球台。 焊球安装在球面上。
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