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    Methods and equipment for depositing hydrophilic coatings, and deposition technologies for thin films
    1.
    发明申请
    Methods and equipment for depositing hydrophilic coatings, and deposition technologies for thin films 有权
    用于沉积亲水涂层的方法和设备，以及用于薄膜的沉积技术

    公开(公告)号：US20060118408A1

    公开(公告)日：2006-06-08

    申请号：US11129820

    申请日：2005-05-16

    申请人： Kari Myli ,  Gary Pfaff ,  James Brownlee ,  John German ,  Annette Krisko ,  Klaus Hartig

    发明人： Kari Myli ,  Gary Pfaff ,  James Brownlee ,  John German ,  Annette Krisko ,  Klaus Hartig

    IPC分类号： C23C14/32 ,  C23C14/00

    CPC分类号： C23C14/568 ,  C03C17/002 ,  C03C17/22 ,  C03C17/34 ,  C03C2217/71 ,  C03C2218/154 ,  C03C2218/36 ,  C03C2218/365 ,  C23C14/352

    摘要： The invention provides certain embodiments that involve sputtering techniques for applying a mixed oxide film comprising silica and titania. In these embodiments, the techniques involve sputtering at least two targets in a common chamber (e.g., in a shared gaseous atmosphere). A first of these targets includes silicon, while a second of the targets includes titanium. Further, the invention provides embodiments involving a substrate bearing a hydrophilic coating, which can be deposited by sputtering or any other suitable thin film deposition technique. The invention also provides techniques and apparatuses useful for depositing a wide variety of coating types. For example, the invention provides thin film deposition technologies in which sputtering apparatuses or other thin film deposition apparatuses are employed.

    摘要翻译： 本发明提供了涉及用于施加包含二氧化硅和二氧化钛的混合氧化物膜的溅射技术的某些实施方案。 在这些实施例中，这些技术涉及在公共室中（例如，在共享气体气氛中）溅射至少两个靶。 这些目标中的第一个包括硅，而第二个目标包括钛。 此外，本发明提供了涉及具有亲水涂层的基底的实施例，其可以通过溅射或任何其它合适的薄膜沉积技术进行沉积。 本发明还提供了用于沉积各种涂层类型的技术和装置。 例如，本发明提供了使用溅射装置或其它薄膜沉积装置的薄膜沉积技术。

    Methods and equipment for depositing hydrophilic coatings, and deposition technologies for thin films
    2.
    发明授权
    Methods and equipment for depositing hydrophilic coatings, and deposition technologies for thin films 有权
    用于沉积亲水涂层的方法和设备，以及用于薄膜的沉积技术

    公开(公告)号：US08092660B2

    公开(公告)日：2012-01-10

    申请号：US11129820

    申请日：2005-05-16

    申请人： Kari Myli ,  Gary Pfaff ,  James Brownlee ,  John German ,  Annette Krisko ,  Klaus Hartig

    发明人： Kari Myli ,  Gary Pfaff ,  James Brownlee ,  John German ,  Annette Krisko ,  Klaus Hartig

    IPC分类号： C23C14/00

    CPC分类号： C23C14/568 ,  C03C17/002 ,  C03C17/22 ,  C03C17/34 ,  C03C2217/71 ,  C03C2218/154 ,  C03C2218/36 ,  C03C2218/365 ,  C23C14/352

    摘要： The invention provides certain embodiments that involve sputtering techniques for applying a mixed oxide film comprising silica and titania. In these embodiments, the techniques involve sputtering at least two targets in a common chamber (e.g., in a shared gaseous atmosphere). A first of these targets includes silicon, while a second of the targets includes titanium. Further, the invention provides embodiments involving a substrate bearing a hydrophilic coating, which can be deposited by sputtering or any other suitable thin film deposition technique. The invention also provides techniques and apparatuses useful for depositing a wide variety of coating types. For example, the invention provides thin film deposition technologies in which sputtering apparatuses or other thin film deposition apparatuses are employed.

    摘要翻译： 本发明提供了涉及用于施加包含二氧化硅和二氧化钛的混合氧化物膜的溅射技术的某些实施方案。 在这些实施例中，这些技术涉及在公共室中（例如，在共享气体气氛中）溅射至少两个靶。 这些目标中的第一个包括硅，而第二个目标包括钛。 此外，本发明提供了涉及具有亲水涂层的基底的实施例，其可以通过溅射或任何其它合适的薄膜沉积技术进行沉积。 本发明还提供了用于沉积各种涂层类型的技术和装置。 例如，本发明提供了使用溅射装置或其它薄膜沉积装置的薄膜沉积技术。

    Hydrophilic coatings, methods for depositing hydrophilic coatings, and improved deposition technology for thin films
    3.
    发明申请
    Hydrophilic coatings, methods for depositing hydrophilic coatings, and improved deposition technology for thin films 有权
    亲水性涂料，沉积亲水性涂料的方法和改进的薄膜沉积技术

    公开(公告)号：US20060121315A1

    公开(公告)日：2006-06-08

    申请号：US11293032

    申请日：2005-12-02

    申请人： Kari Myli ,  Gary Pfaff ,  James Brownlee ,  John German ,  Annette Krisko ,  Klaus Hartig

    发明人： Kari Myli ,  Gary Pfaff ,  James Brownlee ,  John German ,  Annette Krisko ,  Klaus Hartig

    IPC分类号： B32B18/00 ,  B32B19/00

    CPC分类号： C23C14/08 ,  C03C17/36 ,  C03C17/366 ,  C03C2217/71 ,  C03C2217/75 ,  C03C2217/78 ,  C03C2218/154 ,  C03C2218/365 ,  C23C14/3464 ,  Y10T428/252 ,  Y10T428/266

    摘要： The invention provides certain embodiments that involve sputtering techniques for applying a mixed oxide film comprising silica and titania. In these embodiments, the techniques involve sputtering at least two targets in a common chamber (e.g., in a shared gaseous atmosphere). A first of these targets includes silicon, while a second of the targets includes titanium. Further, the invention provides embodiments involving a substrate bearing a hydrophilic coating, which can be deposited by sputtering or any other suitable thin film deposition technique. The invention also provides techniques and apparatuses useful for depositing a wide variety of coating types. For example, the invention provides thin film deposition technologies in which sputtering apparatuses or other thin film deposition apparatuses are employed.

    摘要翻译： 本发明提供了涉及用于施加包含二氧化硅和二氧化钛的混合氧化物膜的溅射技术的某些实施方案。 在这些实施例中，这些技术涉及在公共室中（例如，在共享气体气氛中）溅射至少两个靶。 这些目标中的第一个包括硅，而第二个目标包括钛。 此外，本发明提供了涉及具有亲水涂层的基底的实施例，其可以通过溅射或任何其它合适的薄膜沉积技术进行沉积。 本发明还提供了用于沉积各种涂层类型的技术和装置。 例如，本发明提供了使用溅射装置或其它薄膜沉积装置的薄膜沉积技术。

    Hydrophilic coatings, methods for depositing hydrophilic coatings, and improved deposition technology for thin films
    4.
    发明授权
    Hydrophilic coatings, methods for depositing hydrophilic coatings, and improved deposition technology for thin films 有权
    亲水性涂料，沉积亲水性涂料的方法和改进的薄膜沉积技术

    公开(公告)号：US07923114B2

    公开(公告)日：2011-04-12

    申请号：US11293032

    申请日：2005-12-02

    申请人： Kari Myli ,  Gary Pfaff ,  James Brownlee ,  John German ,  Annette Krisko ,  Klaus Hartig

    发明人： Kari Myli ,  Gary Pfaff ,  James Brownlee ,  John German ,  Annette Krisko ,  Klaus Hartig

    IPC分类号： B32B9/00

    CPC分类号： C23C14/08 ,  C03C17/36 ,  C03C17/366 ,  C03C2217/71 ,  C03C2217/75 ,  C03C2217/78 ,  C03C2218/154 ,  C03C2218/365 ,  C23C14/3464 ,  Y10T428/252 ,  Y10T428/266

    摘要： The invention provides certain embodiments that involve sputtering techniques for applying a mixed oxide film comprising silica and titania. In these embodiments, the techniques involve sputtering at least two targets in a common chamber (e.g., in a shared gaseous atmosphere). A first of these targets includes silicon, while a second of the targets includes titanium. Further, the invention provides embodiments involving a substrate bearing a hydrophilic coating, which can be deposited by sputtering or any other suitable thin film deposition technique. The invention also provides techniques and apparatuses useful for depositing a wide variety of coating types. For example, the invention provides thin film deposition technologies in which sputtering apparatuses or other thin film deposition apparatuses are employed.

    摘要翻译： 本发明提供了涉及用于施加包含二氧化硅和二氧化钛的混合氧化物膜的溅射技术的某些实施方案。 在这些实施例中，这些技术涉及在公共室中（例如，在共享气体气氛中）溅射至少两个靶。 这些目标中的第一个包括硅，而第二个目标包括钛。 此外，本发明提供了涉及具有亲水涂层的基底的实施例，其可以通过溅射或任何其它合适的薄膜沉积技术进行沉积。 本发明还提供了用于沉积各种涂层类型的技术和装置。 例如，本发明提供了使用溅射装置或其它薄膜沉积装置的薄膜沉积技术。

    Methods and apparatuses for directing an ion beam source
    5.
    发明申请
    Methods and apparatuses for directing an ion beam source 审中-公开
    用于引导离子束源的方法和装置

    公开(公告)号：US20080073557A1

    公开(公告)日：2008-03-27

    申请号：US11493703

    申请日：2006-07-26

    申请人： John German ,  Klaus Hartig ,  John E. Madocks

    发明人： John German ,  Klaus Hartig ,  John E. Madocks

    IPC分类号： H01J27/00

    CPC分类号： H01J27/143 ,  C23C14/221 ,  C23C14/225 ,  C23C14/562 ,  C23C14/564 ,  H01J37/08 ,  H01J2237/061 ,  H01J2237/083 ,  H01J2237/3151

    摘要： A method and apparatus for directing an ion beam toward a surface of a substrate is disclosed. Certain embodiments of the invention relate generally to ion beam sources adapted to direct ion beams toward a surface of a substrate at an oblique angle of incidence relative to the surface. Certain embodiments of the invention are adapted to direct two ion beam portions toward a substrate surface, the ion beam portions having substantially equal throw distances. Preferred embodiments of the invention may be useful in etching applications, where the angle of incidence and throw distance of two ion beam portions are well suited for etching the surface of a substrate.

    摘要翻译： 公开了一种用于将离子束朝向衬底的表面引导的方法和装置。 本发明的某些实施例一般涉及适于将离子束以相对于表面的入射角倾斜地朝向衬底表面的离子束源。 本发明的某些实施例适于将两个离子束部分引向衬底表面，离子束部分具有基本相等的投射距离。 本发明的优选实施例可用于蚀刻应用，其中两个离子束部分的入射角和投射距离非常适合蚀刻衬底的表面。

    Method and apparatus for cylindrical magnetron sputtering using multiple electron drift paths
    6.
    发明申请
    Method and apparatus for cylindrical magnetron sputtering using multiple electron drift paths 审中-公开
    使用多个电子漂移路径的圆柱形磁控溅射的方法和装置

    公开(公告)号：US20070080056A1

    公开(公告)日：2007-04-12

    申请号：US11245651

    申请日：2005-10-07

    申请人： John German ,  Klaus Hartig

    发明人： John German ,  Klaus Hartig

    IPC分类号： C23C14/32 ,  C23C14/00

    CPC分类号： C23C14/3407 ,  C23C14/35 ,  H01J37/3405 ,  H01J37/342 ,  H01J37/3461

    摘要： A cylindrical cathode target assembly for use in sputtering target material onto a substrate comprises a generally cylindrical target, means for rotating the target about its axis during a sputtering operation, a magnetic array carried within the target for generation of a plasma-containing field including a plurality of electron drift paths adjacent an outer surface of the target, and a device for supporting the magnetic array independently of rotation of the target. In certain embodiments of the invention, the magnetic array may include a plurality of magnetic elements arranged to form a plurality of electron drift paths spaced along a substantial length of the target to promote generally uniform film deposition and uniform target utilization along its length.

    摘要翻译： 用于将目标材料溅射到衬底上的圆柱形阴极靶组件包括大致圆柱形的靶，用于在溅射操作期间使靶围绕其轴旋转的装置，用于产生包含等离子体的场的靶内的磁阵列 与靶的外表面相邻的多个电子漂移路径，以及用于独立于靶的旋转而支撑磁阵列的装置。 在本发明的某些实施例中，磁性阵列可以包括多个磁性元件，其被布置成形成沿靶的相当长度间隔开的多个电子漂移路径，以促进大体均匀的膜沉积并沿着其长度均匀的靶材利用。

    Enhanced virtual anode
    10.
    发明授权
    Enhanced virtual anode 有权
    增强虚拟阳极

    公开(公告)号：US07850828B2

    公开(公告)日：2010-12-14

    申请号：US11532371

    申请日：2006-09-15

    申请人： John German

    发明人： John German

    IPC分类号： C23C14/35

    CPC分类号： H01J37/3438 ,  H01J37/3244 ,  H01J37/34 ,  H01J37/3405

    摘要： The apparatus and method involve using a gas manifold for introducing gas into a deposition chamber. Certain embodiments involve using a binary manifold for uniform distribution of the gas with good response time. During sputtering operations, provision of an anode using the gas manifold enables such anode to be entirely protected from sputtered dielectric material during the deposition process. As such, conduction paths are initially established and maintained between electrons within the chamber and the anode. This results in improved maintenance of stable plasma and consistent coating in the deposition chamber. The conduction paths are enhanced in comparison to conventional systems due to increased collisions between the electrons and gas flowing out of the manifold outlets. Also, ionization of the gas flowing from the manifold outlets is enhanced, resulting in enhanced deposition output from the system. A magnet can also be located within the manifold so as to further increase collisions between the electrons and gas flowing out of the manifold outputs.

    摘要翻译： 该装置和方法包括使用气体歧管将气体引入沉积室。 某些实施例涉及使用二元歧管来均匀分布气体，具有良好的响应时间。 在溅射操作期间，使用气体歧管提供阳极使得在沉积过程中能够使阳极完全被保护而不被溅射介电材料保护。 因此，传导路径最初建立并保持在室内的电子和阳极之间。 这样可以改善沉积室中稳定的等离子体和一致涂层的维护。 与常规系统相比，由于电流和流出歧管出口的气体之间的碰撞增加，传导路径得到增强。 此外，从歧管出口流出的气体的电离增强，导致来自系统的增强的沉积输出。 磁体也可以位于歧管内，以便进一步增加从歧管输出流出的电子和气体之间的碰撞。