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    Novel Adenine Compound
    2.
    发明申请
    Novel Adenine Compound 审中-公开
    新型腺嘌呤复合物

    公开(公告)号：US20090118263A1

    公开(公告)日：2009-05-07

    申请号：US12067649

    申请日：2006-09-20

    申请人： Kazuki Hashimoto ,  Tomoaki Nakamura ,  Kei Nakamura ,  Ayumu Kurimoto ,  Yoshiaki Isobe

    发明人： Kazuki Hashimoto ,  Tomoaki Nakamura ,  Kei Nakamura ,  Ayumu Kurimoto ,  Yoshiaki Isobe

    IPC分类号： A61K31/551 ,  C07D473/00 ,  A61K31/522 ,  C07D413/02 ,  A61K31/5386 ,  A61P37/08 ,  A61P35/00 ,  A61P37/02 ,  A61K31/5377 ,  A61K31/496 ,  C07D243/08

    CPC分类号： C07D473/16 ,  C07D473/18 ,  C07D519/00

    摘要： An adenine compound represented by the formula (1): (1) [wherein A1 and A2 each independently represents an (un)substituted aromatic carbocycle or (un)substituted aromatic heterocycle; L1, L2, and L3 each independently represents alkylene or a single bond, provided that any methylene or methine group in L2 or L3 may be bonded to the nitrogen atom adjacent to L2 and L3 to form a 4- to 7-membered saturated nitrogenous heterocycle; L4 represents alkylene or a single bond; R1 represents (un)substituted alkyl, (un)substituted aryl, etc.; R2 represents hydrogen or (un)substituted alkyl; R3 represents (un)substituted alkyl, etc.; and X represents oxygen, etc.] or a pharmaceutically acceptable salt of the compound. The compound and salt are useful as a medicine.

    摘要翻译： 由式（1）表示的腺嘌呤化合物：（1）[其中，A1和A2各自独立地表示（un）取代的芳族碳环或（un）取代的芳族杂环; L1，L2和L3各自独立地表示亚烷基或单键，条件是L2或L3中的任何亚甲基或次甲基可以键合到与L2和L3相邻的氮原子上以形成4-至7-元饱和含氮杂环 ; L4表示亚烷基或单键; R1表示（un）取代的烷基，（un）取代的芳基等; R2代表氢或（未）取代的烷基; R3表示（un）取代的烷基等; X表示氧等]或化合物的药学上可接受的盐。 化合物和盐可用作药物。

    NOVEL ADENINE COMPOUND
    3.
    发明申请
    NOVEL ADENINE COMPOUND 审中-公开
    新颖的化合物

    公开(公告)号：US20090105212A1

    公开(公告)日：2009-04-23

    申请号：US12067651

    申请日：2006-09-22

    申请人： Yoshiaki Isobe ,  Ayumu Kurimoto ,  Kazuki Hashimoto ,  Tomoaki Nakamura ,  Kei Nakamura

    发明人： Yoshiaki Isobe ,  Ayumu Kurimoto ,  Kazuki Hashimoto ,  Tomoaki Nakamura ,  Kei Nakamura

    IPC分类号： A61K31/522 ,  C07D473/34 ,  A61P31/18

    CPC分类号： C07D473/18

    摘要： A novel adenine compound represented by the formula (1): wherein A represents an (un)substituted aromatic carbocycle or (un)substituted aromatic heterocycle; L1, L2, and L3 each independently represents linear or branched alkylene, etc.; R1 represents (un)substituted alkyl, (un)substituted aryl, etc.; R2 represents hydrogen or (un) substituted alkyl; R3 represents (un)substituted alkyl, etc., provided that R3 may be bonded to L2 or L3 to form a nitrogenous saturated heterocycle; and X represents oxygen, etc.; or a pharmaceutically acceptable salt of the compound. The compound and salt are useful as a medicine.

    摘要翻译： 由式（1）表示的新型腺嘌呤化合物：其中A表示（un）取代的芳族碳环或（un）取代的芳族杂环; L1，L2和L3各自独立地表示直链或支链亚烷基等; R1表示（un）取代的烷基，（un）取代的芳基等; R2代表氢或（未）取代的烷基; R3表示（un）取代的烷基等，条件是R3可以键合到L2或L3以形成含氮饱和杂环; X表示氧等。 或该化合物的药学上可接受的盐。 化合物和盐可用作药物。

    Novel Adenine Compound
    4.
    发明申请
    Novel Adenine Compound 审中-公开
    新型腺嘌呤复合物

    公开(公告)号：US20080269240A1

    公开(公告)日：2008-10-30

    申请号：US12067446

    申请日：2006-09-21

    申请人： Kazuki Hashimoto ,  Tomoaki Nakamura ,  Kei Nakamura ,  Shingo Tojo ,  Ayumu Kurimoto ,  Yoshiaki Isobe ,  Hiroki Wada ,  Roger Bonnert

    发明人： Kazuki Hashimoto ,  Tomoaki Nakamura ,  Kei Nakamura ,  Shingo Tojo ,  Ayumu Kurimoto ,  Yoshiaki Isobe ,  Hiroki Wada ,  Roger Bonnert

    IPC分类号： A61K31/522 ,  C07D473/18 ,  A61P31/12

    CPC分类号： C07D473/18

    摘要： An adenine compound useful as a medicine represented by the following formula (1): [wherein R1 is halogen atom, optionally substituted alkyl group, optionally substituted aryl group, etc.; X is oxygen atom, sulfur atom, a single bond, etc.; A1 is optionally substituted and optionally saturated 4 to 8 membered heterocyclic group containing 1 to 2 hetero atoms selected from 1 to 3 nitrogen atoms, 0 to 1 oxygen atom, and 0 to 1 sulfur atom; A2 is optionally substituted 6 to 10 cyclic aromatic hydrocarbon group or optionally substituted 5 to 10 membered heterocyclic aromatic group; L1 and L2 are independently, substituted straight or branched alkylene or a single bond, etc.; L3 is optionally substituted straight or branched alkylene, etc.; R2 is hydrogen atom, optionally substituted alkyl group.] or its pharmaceutically acceptable salt.

    摘要翻译： 用作下式（1）表示的药物的腺嘌呤化合物：其中R 1是卤素原子，任选取代的烷基，任选取代的芳基等; X是氧原子，硫原子，单键等; 任选被取代的和任选饱和的含有1至2个选自1至3个氮原子，0至1个氧原子和0至1个硫原子的杂原子的4至8元杂环基; 任选取代的6至10个环状芳族烃基或任选取代的5至10元杂环芳基; L 1和L 2独立地为取代的直链或支链亚烷基或单键等; L 3是任选取代的直链或支链亚烷基等; R 2是氢原子，任选取代的烷基。]或其药学上可接受的盐。

    Optical sensor module
    6.
    发明授权
    Optical sensor module 失效
    光学传感器模块

    公开(公告)号：US08452138B2

    公开(公告)日：2013-05-28

    申请号：US13361230

    申请日：2012-01-30

    申请人： Ryusuke Naito ,  Emiko Tani ,  Masayuki Hodono ,  Yusuke Shimizu ,  Kei Nakamura

    发明人： Ryusuke Naito ,  Emiko Tani ,  Masayuki Hodono ,  Yusuke Shimizu ,  Kei Nakamura

    IPC分类号： G02B6/10 ,  G02B6/42

    CPC分类号： G02B6/423

    摘要： An optical sensor module is provided in which an engagement portion of a board unit is fitted in a groove of an optical waveguide unit and, even with the single engagement portion, the board unit is stably supported. An optical sensor module includes an optical waveguide unit, and a board unit mounted with an optical element and coupled to the optical waveguide unit. The optical waveguide unit includes a single edge extension portion axially extending along one side edge of an over-cladding layer, a board unit engagement groove provided in the single edge extension portion, and a projection provided on a side wall of the vertical groove and kept in abutment against an engagement portion of the board unit. The board unit includes an engagement portion fitted in the vertical groove, which abuts against the projection within the vertical groove.

    摘要翻译： 提供一种光传感器模块，其中板单元的接合部分装配在光波导单元的凹槽中，并且即使具有单个接合部分，板单元也被稳定地支撑。 光传感器模块包括光波导单元和安装有光学元件并耦合到光波导单元的板单元。 光波导单元包括沿着上包层的一个侧边缘轴向延伸的单个边缘延伸部分，设置在单个边缘延伸部分中的基板单元接合槽，以及设置在垂直槽的侧壁上并保持的突起 与基板单元的接合部抵接。 板单元包括装配在垂直槽中的接合部分，其垂直于垂直槽内的突起。

    Mounted structure of circuit board and multi-layer circuit board therefor
    8.
    发明授权
    Mounted structure of circuit board and multi-layer circuit board therefor 失效
    电路板和多层电路板的安装结构

    公开(公告)号：US06310391B1

    公开(公告)日：2001-10-30

    申请号：US09334631

    申请日：1999-06-17

    申请人： Megumu Nagasawa ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Kei Nakamura

    发明人： Megumu Nagasawa ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Kei Nakamura

    IPC分类号： H01L23053

    CPC分类号： H05K3/462 ,  H01L23/142 ,  H01L23/3677 ,  H01L23/5385 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H05K1/0206 ,  H05K1/0207 ,  H05K3/28 ,  H05K3/4038 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0305 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2224/0401

    摘要： The present invention provides a mounted structure of circuit board which can be prepared by a simple method and exhibits a good heat dissipation from chip and undergoes relaxed heat stress and a multi-layer circuit board to be incorporated in the mounted structure. A novel mounted structure of circuit board is provided comprising a core material embedded in an insulating layer, said core material having a metal layer with a heat conductivity of not less than 100 W/m·K provided on at least one side of an Ni—Fe alloy foil, said insulating layer comprising a wire conductor provided and a semiconductor element mounted on at least one side thereof, characterized in that a solder metal member for heat conduction is provided interposed between said semiconductor element and said core material so that said semiconductor element and said core material are connected to each other. The mounted structure of circuit board comprises a 6-layer circuit board 2 having a laminate of three sheets of double-sided circuit boards 1 and a chip 13 connected to a circuit 5 on the uppermost layer. The core material 3 embedded in the intraboard insulating layer 4 in various double-sided circuit board 1 comprises a copper layer 3a having a heat conductivity of 393 W/·K provided on at least one side of an Ni—Fe alloy foil 25. The chip 13 and the underlying core material 3 are connected to each other with a solder metal member 10. The core material 3 on the horizontally adjacent double-sided circuit boards 1 are similarly connected to each other with the solder metal member 10.

    摘要翻译： 本发明提供了一种电路板的安装结构，其可以通过简单的方法制备，并且显示出来自芯片的良好散热并经受松弛的热应力，并且将多层电路板并入安装的结构中。 提供一种电路板的新型安装结构，其包括嵌入绝缘层中的芯材，所述芯材具有设置在Ni-Fe合金的至少一侧上的导热率不小于100W / mK的金属层 箔，所述绝缘层包括设置的导线导体和安装在其至少一侧上的半导体元件，其特征在于，设置用于导热的焊料金属构件插入在所述半导体元件和所述芯材之间，使得所述半导体元件和所述 芯材彼此连接。 电路板的安装结构包括具有三片双面电路板1和连接到最上层电路5的芯片13的叠层的6层电路板2。 在各种双面电路板1中嵌入在内部绝缘层4中的芯材3包括设置在Ni-Fe合金箔25的至少一侧上的导热率为393W / K.的铜层3a。 芯片13和下面的芯材3通过焊料金属部件10彼此连接。水平相邻的双面电路板1上的芯材3类似地用焊料金属部件10彼此连接。

    Printed circuit board and magnetic head driving device including the same
    10.
    发明授权
    Printed circuit board and magnetic head driving device including the same 有权
    印刷电路板和包括其的磁头驱动装置

    公开(公告)号：US08330054B2

    公开(公告)日：2012-12-11

    申请号：US12771500

    申请日：2010-04-30

    申请人： Mitsuru Honjo ,  Daisuke Yamauchi ,  Kei Nakamura

    发明人： Mitsuru Honjo ,  Daisuke Yamauchi ,  Kei Nakamura

    IPC分类号： H05K1/16

    CPC分类号： G11B5/4846 ,  G11B5/484 ,  H05K1/0245 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/10674 ,  H05K2201/2009

    摘要： A plurality of wiring traces are formed on a base insulating layer, and a metal layer is formed on the opposite surface of the base insulating layer. Two adjacent wiring traces constitute a transmission line pair. The width of the wiring trace is set to not more than 250 μm, and the distance between the adjacent wiring traces is set to not less than 8 μm. The thickness of the base insulating layer is selected to cause differential impedance of the transmission line pair to be not less than 10 Ω and not more than 50 Ω.

    摘要翻译： 在基底绝缘层上形成多个布线迹线，并且在基底绝缘层的相对表面上形成金属层。 两个相邻的布线迹线构成传输线对。 布线迹线的宽度设定为不大于250μm，并且相邻布线迹线之间的距离设定为不小于8μm。 选择基极绝缘层的厚度使传输线对的差分阻抗不小于10Ω; 不超过50个