摘要:
In a method of manufacturing a stacked-type semiconductor device, firstly, a first semiconductor substrate having a first device formed thereon is covered with an interlayer insulating layer and a planarized polycrystalline silicon layer is formed on the interlayer insulating layer. The first semiconductor substrate and a second semiconductor substrate are joined together by putting the surface of the polycrystalline silicon layer in close contact with the surface of a refractory metal layer formed on the second semiconductor substrate, applying thermal treatment at 700.degree. C. or below and changing the refractory metal layer to silicide.
摘要:
In a method of manufacturing a stacked-type semiconductor device, firstly, a first semiconductor substrate having a first device formed thereon is covered with an interlayer insulating layer and a planarized polycrystalline silicon layer is formed on the interlayer insulating layer. The first semiconductor substrate and a second semiconductor substrate are joined together by putting the surface of the polycrystalline silicon layer in close contact with the surface of a refractory metal layer formed on the second semiconductor substrate, applying thermal treatment at 700.degree. C. or below and changing the refractory metal layer to silicide.
摘要:
A semiconductor device capable of effectively preventing a dielectric breakdown of a gate oxide film without adversely affecting the characteristics of a transistor and a process of manufacturing the same are disclosed. The semiconductor device comprises a SOI film 2 whose upper angular parts are rounded off by sputter etching and a gate oxide film 3 formed on SOI film 2 with an almost uniform thickness. Therefore, electric field concentration in the upper angular parts of SOI film 2 is reduced. Furthermore, the control characteristics of the transistor are enhanced by the uniform gate oxide film 3. As a result, a dielectric breakdown of the gate oxide film is effectively prevented without adversely affecting the characteristics of the transistor. Sputter etching enabling processing at a low temperature is used, so that the upper angular parts of SOI film 2 are rounded off without adversely affecting a semiconductor element formed in the lower layer.
摘要:
A semiconductor device capable of effectively preventing a dielectric breakdown of a gate oxide film without adversely affecting the characteristics of a transistor and a process of manufacturing the same are disclosed. The semiconductor device comprises a SOI film 2 whose upper angular parts are rounded off by sputter etching and a gate oxide film 3 formed on SOI film 2 with an almost uniform thickness. Therefore, electric field concentration in the upper angular parts of SOI film 2 is reduced. Furthermore, the control characteristics of the transistor are enhanced by the uniform gate oxide film 3. As a result, a dielectric breakdown of the gate oxide film is effectively prevented without adversely affecting the characteristics of the transistor. Sputter etching enabling processing at a low temperature is used, so that the upper angular parts of SOI film 2 are rounded off without adversely affecting a semiconductor element formed in the lower layer.
摘要:
A semiconductor device can be manufactured with a high non-defect ratio, making it possible to easily guarantee the KGD (Known-Good-Die) of semiconductor chips, when configuring one packaged semiconductor device on which a plurality of semiconductor chips is mounted. Utilizing each semiconductor chip is made possible without limits on terminal position, pitch, signal arrangement, and so on.Protrusions provided to a semiconductor chip mounted sealing sub-board are attached to a package substrate. A plurality of semiconductor bare chips is disposed in a space formed between the semiconductor chip mounted sealing sub-board and the package substrate, making wiring possible.
摘要:
The present invention relates to a nonvolatile semiconductor memory, and more specifically relates to a nonvolatile semiconductor memory with increased program throughput. The present invention provides a nonvolatile semiconductor memory device with a plurality of block source lines corresponding to the memory blocks, arranged in parallel to the word lines, a plurality of global source lines arranged in perpendicular to the block source lines; and a plurality of switches for selectively connecting corresponding ones of the block source lines and the global source lines.
摘要:
A semiconductor device capable of holding multibit information in one memory cell, and a method of manufacturing the semiconductor device. A trench is formed in a channel portion of an MONOS transistor. Then, a source side portion and a drain side portion in a silicon nitride film of a gate insulating film which interpose the trench are caused to function as first and second electric charge holding portions capable of holding electric charges. In the case in which first electric charges are trapped on the drain side and second electric charges are trapped on the source side, a portion of a gate electrode in the trench functions as a shield. If a fixed potential is given to the gate electrode, the second electric charge holding portion is not influenced by an electric field induced by the first electric charges so that the trapping of the second electric charges is not inhibited.
摘要:
In a semiconductor substrate surface, first and second trenches extending in parallel with each other in a bit line direction are provided. An insulation film for trench isolation is filled in the first and second trenches. A floating gate is provided between the first and second trenches on the semiconductor substrate. A sidewall spacer is provided on a sidewall surface, extending in the bit line direction, of the floating gate.
摘要:
In a nonvolatile semiconductor memory device, a memory cell array includes memory cell transistors and cell select transistors corresponding to the memory cell transistors, respectively. A memory cell SG decoder supplies a potential to a cell select line corresponding to the selected row. The cell select transistor opens and closes a conduction path of a current flowing between a bit line and a source line through the memory cell transistor in accordance with the potential on the cell select line. As a result, an influence by a leak current flowing from the unselected memory cell transistor in a read operation is suppressed.
摘要:
In erasing, electrons are simultaneously injected into floating gates from sources of a plurality of memory cells. Thus, the threshold voltages of the plurality of memory cells are increased. In programming, electrons are emitted from a floating gate of a selected memory cell to a drain. Thus, the threshold voltage of the selected memory cell is reduced.