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15 条记录 (耗时 0.024 秒)

    Light-emitting diode incorporating gradient index element
    1.
    发明授权
    Light-emitting diode incorporating gradient index element 有权

    公开(公告)号：US07102177B2

    公开(公告)日：2006-09-05

    申请号：US10649094

    申请日：2003-08-26

    申请人： Kee Siang Goh ,  Yee Loong Chin ,  Boon Kheng Lee ,  Cheng Why Tan

    发明人： Kee Siang Goh ,  Yee Loong Chin ,  Boon Kheng Lee ,  Cheng Why Tan

    IPC分类号： H01L33/00

    CPC分类号： H01L33/58

    摘要： The light-emitting device includes a light source and a gradient index (GRIN) element. The GRIN element has a cylindrical refractive index profile in which the refractive index varies radially and is substantially constant axially. The GRIN element includes a first end surface opposite a second end surface and is characterized by a length-to-pitch ratio. The GRIN element is arranged with the first end surface adjacent the light source to receive light from the light source, and emits the light from the second end surface in a radiation pattern dependent on the length-to-pitch ratio. Since the radiation pattern depends on the length-to-pitch ratio of the GRIN element, LEDs with different radiation patterns can be made simply by using GRIN elements of appropriate lengths.

    Flat-top reflection-based optical encoders
    2.
    发明授权
    Flat-top reflection-based optical encoders 有权
    平顶反射式光学编码器

    公开(公告)号：US07495583B2

    公开(公告)日：2009-02-24

    申请号：US11404110

    申请日：2006-04-14

    申请人： Teong Swee Tan ,  Premkumar S. Ramachandr ,  Yee Loong Chin ,  Cheng Why Tan ,  Weng Fei Wong

    发明人： Teong Swee Tan ,  Premkumar S. Ramachandr ,  Yee Loong Chin ,  Cheng Why Tan ,  Weng Fei Wong

    IPC分类号： H03M1/22

    CPC分类号： G01D5/34715

    摘要： A reflection-based optical encoding apparatus for the detection of position and/or motion of a mechanical device includes an encoding medium having at least a first reflective portion, and an encoder housing having a light-emitting source and a light-detecting sensor embedded within, the encoder housing being placed in proximity to the encoding medium such that a functional light path can be established from the light-emitting source to the light-detecting sensor via the first reflective portion of the encoding medium. The encoder housing includes a first flat facet positioned between the light-emitting source and the encoding medium, the first flat facet having a first angle relative to a common geometric plane such that light passing from the light-emitting source to the encoding medium is refracted along a first angled path in a manner that the refracted light strikes a desired location of the encoding medium.

    摘要翻译： 用于检测机械装置的位置和/或运动的基于反射的光编码装置包括具有至少第一反射部分的编码介质和具有嵌入在其内的发光源和光检测传感器的编码器壳体 编码器壳体被放置在编码介质附近，使得可以通过编码介质的第一反射部分从发光源到光检测传感器建立功能光路。 编码器壳体包括位于发光源和编码介质之间的第一平面，第一平面相对于共同的几何平面具有第一角度，使得从发光源通向编码介质的光被折射 沿着第一有角度的路径以折射光照射到编码介质的期望位置的方式。

    Reflective encoder with interchangable lens on emitter-detector module
    3.
    发明授权
    Reflective encoder with interchangable lens on emitter-detector module 有权
    反射式编码器，具有发射极检测器模块上的可互换镜头

    公开(公告)号：US07490771B2

    公开(公告)日：2009-02-17

    申请号：US11370133

    申请日：2006-03-06

    申请人： Cheng Why Tan ,  Yee Loong Chin

    发明人： Cheng Why Tan ,  Yee Loong Chin

    IPC分类号： G06K7/10 ,  G01D5/34

    CPC分类号： G06K7/10831

    摘要： An encoder having a code strip and an emitter-detector module is disclosed. The code strip includes alternating reflective and opaque stripes. The emitter-detector module includes a housing, a lens insert, a light source and a photodetector. Light from the light source illuminates the code strip, and light reflected from the code strip is incident on the photodetector. The lens insert includes a lens that processes light generated by the light source either before the light reaches the code strip or after the light is reflected from the code strip. The lens insert mates with the housing to position the lens at a predetermined point relative to the light source or the photodetector. The housing will accept a plurality of lens inserts, each lens insert having a different lens from the others of the lens inserts.

    摘要翻译： 公开了具有码带和发射极检测器模块的编码器。 代码条包括交替的反射和不透明条纹。 发射极检测器模块包括壳体，透镜插入件，光源和光电检测器。 来自光源的光照亮编码条，并且从代码条反射的光入射到光电检测器上。 透镜插入件包括在光到达代码条之前或在光从代码条反射之后处理由光源产生的光的透镜。 透镜插入件与壳体配合，以将透镜定位在相对于光源或光电检测器的预定点。 该壳体将接收多个透镜插入件，每个透镜插入件具有与透镜插入物中的其它透镜插入件不同的透镜。

    Semiconductor device with a light emitting semiconductor die
    7.
    发明授权
    Semiconductor device with a light emitting semiconductor die 有权
    具有发光半导体管芯的半导体器件

    公开(公告)号：US09123869B2

    公开(公告)日：2015-09-01

    申请号：US13036829

    申请日：2011-02-28

    申请人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Cheng Why Tan ,  Gin Ghee Tan

    发明人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Cheng Why Tan ,  Gin Ghee Tan

    IPC分类号： H01L33/00 ,  H01L23/48 ,  H01L33/48 ,  H01L33/62 ,  H01L23/498

    CPC分类号： H01L33/486 ,  H01L23/49844 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2924/01322

    摘要： A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.

    摘要翻译： 半导体器件包括安装在位于器件的衬底的第一主表面上的第一和第二导电焊盘中的至少一个的发光半导体管芯。 发光半导体管芯具有与第一和第二导电接合焊盘电连接的阳极和阴极。 半导体器件还包括位于衬底的第二主表面上的第一和第二导电连接焊盘。 第一和第二导电接合焊盘通过第一和第二导电边缘互连元件电连接到第一和第二导电连接焊盘。

    Method of interconnecting an electronic device
    8.
    发明授权
    Method of interconnecting an electronic device 有权
    互连电子设备的方法

    公开(公告)号：US06242280B1

    公开(公告)日：2001-06-05

    申请号：US09343329

    申请日：1999-06-30

    申请人： Huck Khim Koay ,  Cheng Why Tan ,  Chee Keong Chong ,  Gurbir Singh ,  Sundar A L Natarajan Yoganandan ,  Seong Choon Lim

    发明人： Huck Khim Koay ,  Cheng Why Tan ,  Chee Keong Chong ,  Gurbir Singh ,  Sundar A L Natarajan Yoganandan ,  Seong Choon Lim

    IPC分类号： H01L2144

    CPC分类号： H01L33/62 ,  H01L24/11 ,  H01L25/0753 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14

    摘要： A method of interconnecting bond pads on a semiconductor die to leads of a package is disclosed. The method includes placing a connector over each bond pad and its corresponding lead. The connector is one of a plurality of ganged connectors. The method also includes electrically connecting the connector to the bond pad and the lead and singularizing the connector from the plurality of ganged connectors. Such a method of interconnection has the advantage of simultaneously interconnecting multiple bond pads to leads. In a preferred embodiment, light-emitting diodes (LEDs) are manufactured using the method. A PCB is etched to produced lead pairs of the LEDs. A semiconductor die is attached to a first lead of each lead pair. Ganged interconnects are aligned with and tagged onto the dies and the second leads of the lead pairs, thereby electrically connecting them. After tagging, the interconnects are singularized. An encapsulant is applied on each die and interconnect. Each die, interconnect and lead pair are then separated to form individual LEDs.

    摘要翻译： 公开了一种将半导体管芯上的接合焊盘与封装引线互连的方法。 该方法包括将连接器放置在每个接合焊盘及其对应的引线上。 连接器是多个联动连接器之一。 该方法还包括将连接器电连接到接合焊盘和引线，并将连接器从多个组合的连接器中单独化。 这种互连方法具有将多个接合焊盘同时互连到引线的优点。 在优选实施例中，使用该方法制造发光二极管（LED）。 蚀刻PCB以产生LED的引线对。 半导体管芯连接到每个引线对的第一引线。 组合的互连件与管芯和引线对的第二引线对准并被标记，从而将它们电连接。 标记后，互连是单数化的。 在每个管芯和互连上施加密封剂。 然后将每个管芯，互连和引线对分开以形成单独的LED。

    SEMICONDUCTOR DEVICE WITH A LIGHT EMITTING SEMICONDUCTOR DIE
    10.
    发明申请
    SEMICONDUCTOR DEVICE WITH A LIGHT EMITTING SEMICONDUCTOR DIE 有权
    具有发光半导体芯片的半导体器件

    公开(公告)号：US20110147788A1

    公开(公告)日：2011-06-23

    申请号：US13036829

    申请日：2011-02-28

    申请人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Cheng Why Tan ,  Gin Ghee Tan

    发明人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Cheng Why Tan ,  Gin Ghee Tan

    IPC分类号： H01L33/62

    CPC分类号： H01L33/486 ,  H01L23/49844 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2924/01322

    摘要： A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.

    摘要翻译： 半导体器件包括安装在位于器件的衬底的第一主表面上的第一和第二导电焊盘中的至少一个的发光半导体管芯。 发光半导体管芯具有与第一和第二导电接合焊盘电连接的阳极和阴极。 半导体器件还包括位于衬底的第二主表面上的第一和第二导电连接焊盘。 第一和第二导电接合焊盘通过第一和第二导电边缘互连元件电连接到第一和第二导电连接焊盘。