公开(公告)号：US09123869B2

公开(公告)日：2015-09-01

申请号：US13036829

申请日：2011-02-28

申请人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Cheng Why Tan ,  Gin Ghee Tan

发明人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Cheng Why Tan ,  Gin Ghee Tan

IPC分类号： H01L33/00 ,  H01L23/48 ,  H01L33/48 ,  H01L33/62 ,  H01L23/498

CPC分类号： H01L33/486 ,  H01L23/49844 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2924/01322

摘要： A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.

摘要翻译： 半导体器件包括安装在位于器件的衬底的第一主表面上的第一和第二导电焊盘中的至少一个的发光半导体管芯。 发光半导体管芯具有与第一和第二导电接合焊盘电连接的阳极和阴极。 半导体器件还包括位于衬底的第二主表面上的第一和第二导电连接焊盘。 第一和第二导电接合焊盘通过第一和第二导电边缘互连元件电连接到第一和第二导电连接焊盘。

公开(公告)号：US07919787B2

公开(公告)日：2011-04-05

申请号：US11838301

申请日：2007-08-14

申请人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Cheng Why Tan ,  Gin Ghee Tan

发明人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Cheng Why Tan ,  Gin Ghee Tan

IPC分类号： H01L33/00 ,  H01L23/48

CPC分类号： H01L33/486 ,  H01L23/49844 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2924/01322

摘要： A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive interconnecting elements.

摘要翻译： 半导体器件包括安装在位于器件的衬底的第一主表面上的第一和第二导电焊盘中的至少一个的发光半导体管芯。 发光半导体管芯具有与第一和第二导电接合焊盘电连接的阳极和阴极。 半导体器件还包括位于衬底的第二主表面上的第一和第二导电连接焊盘。 第一和第二导电接合焊盘经由第一和第二导电互连元件电连接到第一和第二导电连接焊盘。

公开(公告)号：US07279355B2

公开(公告)日：2007-10-09

申请号：US10608606

申请日：2003-06-27

申请人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Gin Ghee Tan ,  Cheng Why Tan

发明人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Gin Ghee Tan ,  Cheng Why Tan

IPC分类号： H01I21/00

CPC分类号： H01L24/97 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/49838 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A substantially planar substrate having opposed major surfaces is provided. The substrate includes a through hole that extends between the major surfaces. The through hole is filled with a conductive interconnecting element. A conductive mounting pad and a conductive connecting pad are formed on different ones of the major surfaces in electrical contact with the conductive interconnecting element. The packaging device formed by the method has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

摘要翻译： 提供具有相对的主表面的基本平坦的基板。 基板包括在主表面之间延伸的通孔。 通孔填充有导电互连元件。 导电安装焊盘和导电连接焊盘形成在与导电互连元件电接触的不同主表面上。 通过该方法形成的包装装置的体积仅为半导体管芯的体积的几倍，并且可以由能够承受高温管芯附接工艺的材料制成。 包装装置可以被配置为在半导体器件中使用的唯一的包装装置或者需要高温管芯附接工艺的半导体管芯的基座。

公开(公告)号：US07256486B2

公开(公告)日：2007-08-14

申请号：US10608605

申请日：2003-06-27

申请人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Gin Ghee Tan ,  Cheng Why Tan

发明人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Gin Ghee Tan ,  Cheng Why Tan

IPC分类号： H01L29/22

CPC分类号： H01L24/97 ,  H01L23/49844 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/85444 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： The packaging device includes a substrate, a mounting pad, a connecting pad and an interconnecting element. The substrate is substantially planar and has opposed major surfaces. The mounting pad is conductive and is located on one of the major surfaces. The connecting pad is conductive and is located on the other of the major surfaces. The conductive interconnecting element extends through the substrate and electrically interconnects the mounting pad and the connecting pad. The packaging device has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

摘要翻译： 包装装置包括基板，安装垫，连接垫和互连元件。 基板基本上是平面的并且具有相对的主表面。 安装垫是导电的并且位于主要表面中的一个上。 连接垫是导电的并且位于另一个主表面上。 导电互连元件延伸穿过基板并将安装焊盘和连接焊盘电互连。 包装装置的体积仅为半导体管芯的体积的几倍，并且可以由能够承受高温管芯附着工艺的材料制成。 包装装置可以被配置为在半导体器件中使用的唯一的包装装置或者需要高温管芯附接工艺的半导体管芯的基座。

公开(公告)号：US20110147788A1

公开(公告)日：2011-06-23

申请号：US13036829

申请日：2011-02-28

申请人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Cheng Why Tan ,  Gin Ghee Tan

发明人： Kong Weng Lee ,  Kee Yean Ng ,  Yew Cheong Kuan ,  Cheng Why Tan ,  Gin Ghee Tan

IPC分类号： H01L33/62

CPC分类号： H01L33/486 ,  H01L23/49844 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2924/01322

摘要： A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.

摘要翻译： 半导体器件包括安装在位于器件的衬底的第一主表面上的第一和第二导电焊盘中的至少一个的发光半导体管芯。 发光半导体管芯具有与第一和第二导电接合焊盘电连接的阳极和阴极。 半导体器件还包括位于衬底的第二主表面上的第一和第二导电连接焊盘。 第一和第二导电接合焊盘通过第一和第二导电边缘互连元件电连接到第一和第二导电连接焊盘。

公开(公告)号：US07612386B2

公开(公告)日：2009-11-03

申请号：US11358477

申请日：2006-02-20

申请人： Kee Yean Ng ,  Cheng Why Tan ,  Ji Kin Tham

发明人： Kee Yean Ng ,  Cheng Why Tan ,  Ji Kin Tham

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L23/36 ,  H01L24/48 ,  H01L24/49 ,  H01L33/64 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A circuit element having a heat-conducting body having top and bottom surfaces, and a die having an electronic circuit thereon is disclosed. The die includes first and second contact points for powering the electronic circuit. The die is in thermal contact with the heat-conducting body, the die having a bottom surface that is smaller than the top surface of the heat-conducting body. The first contact point on the die is connected to a first trace bonded to the top surface of the heat-conducting body. An encapsulating cap covers the die. The first trace has a first portion that extends outside of the encapsulating cap and a second portion that is covered by the encapsulating cap. The heat-conducting body is preferably constructed from copper or aluminum and includes a cavity having an opening on the first surface in which the die is mounted. The die preferably includes a light-emitting device.

摘要翻译： 公开了一种具有顶表面和底表面的导热体的电路元件和其上具有电子电路的管芯。 模具包括用于为电子电路供电的第一和第二接触点。 模具与导热体热接触，模头的底表面小于导热体的顶表面。 模具上的第一接触点连接到结合到导热体的顶表面的第一迹线。 封装盖覆盖模具。 第一迹线具有延伸到封装帽外部的第一部分和被封装盖覆盖的第二部分。 导热体优选由铜或铝构成，并且包括在安装模具的第一表面上具有开口的空腔。 模具优选地包括发光装置。

公开(公告)号：US07404652B2

公开(公告)日：2008-07-29

申请号：US11012761

申请日：2004-12-15

申请人： Kee Yean Ng ,  Heng Yow Cheng ,  Yew Cheong Kuan

发明人： Kee Yean Ng ,  Heng Yow Cheng ,  Yew Cheong Kuan

IPC分类号： F21V9/16

CPC分类号： H04N5/2256 ,  F21K9/00 ,  G03B15/03 ,  H01L25/0753 ,  H01L33/504 ,  H01L2224/48091 ,  H01L2924/12041 ,  H04M1/22 ,  Y10S362/80 ,  H01L2924/00014

摘要： A light-emitting diode (“LED”) device includes a plurality of LEDs. Each LED in the plurality of LEDs is adjacent to at least one other of the plurality of LEDs. At least one of the plurality of LEDs has a radiation with a full-width-half-maximum greater than 50 nm.

摘要翻译： 发光二极管（“LED”）器件包括多个LED。 多个LED中的每个LED与多个LED中的至少另一个相邻。 多个LED中的至少一个LED具有大于50nm的全宽半最大值的辐射。

公开(公告)号：US07210817B2

公开(公告)日：2007-05-01

申请号：US10833905

申请日：2004-04-27

申请人： Kian Shin Lee ,  Janet Bee Yin Chua ,  Yew Cheong Kuan ,  Heng Yow Cheng ,  Kee Yean Ng ,  Wen Ya Ou

发明人： Kian Shin Lee ,  Janet Bee Yin Chua ,  Yew Cheong Kuan ,  Heng Yow Cheng ,  Kee Yean Ng ,  Wen Ya Ou

IPC分类号： F21V21/00

CPC分类号： F21K9/00 ,  A61N5/0613 ,  A61N2005/005 ,  A61N2005/0645 ,  A61N2005/0652 ,  H01L2224/48091 ,  H05K1/0203 ,  H05K1/182 ,  H01L2924/00014

摘要： A system and method for a reverse mounted light array. In one method embodiment, the present invention couples a reverse mounted light-generating source with a substrate. Additionally, the present invention couples an electrical portion of the reverse mounted light generating source with a conductive trace coupled to the reverse side of the substrate, wherein the coupling of the conductive trace with the substrate and the reverse mounted light generating source forms a reverse mounted light array.

摘要翻译： 一种用于反向安装的光阵列的系统和方法。 在一个方法实施例中，本发明将反向安装的发光源与基板耦合。 另外，本发明将反向安装的发光源的电气部分耦合到耦合到衬底的相反侧的导电迹线，其中导电迹线与衬底和反向安装的发光源的耦合形成反向安装 光阵列。

公开(公告)号：US06784460B2

公开(公告)日：2004-08-31

申请号：US10268223

申请日：2002-10-10

申请人： Kee Yean Ng ,  Yew Cheong Kuan

发明人： Kee Yean Ng ,  Yew Cheong Kuan

IPC分类号： H01L29267

CPC分类号： H01L33/20

摘要： A LED of flip-chip design comprises a light emitting region and one or more transparent substrates overlying the light emitting region. The light emitting region includes a negatively doped layer, a positively doped layer, and an active p-n junction layer between the negatively doped layer and the positively doped layer. At least one of the substrates has a pyramidal shape determined by (1) the composition of electrically conductive or electrically non-conductive material, (2) the number of side surfaces, (3) the degree of offset of an apex or top surface, and (4) the slope angle of each side surface relative to a bottom surface.

摘要翻译： 倒装芯片设计的LED包括发光区域和覆盖发光区域的一个或多个透明基板。 发光区域包括负掺杂层，正掺杂层和负掺杂层和正掺杂层之间的有源p-n结层。 至少一个基板具有通过（1）导电或非导电材料的组成确定的锥体形状，（2）侧表面的数量，（3）顶点或顶表面的偏移度， 和（4）每个侧面相对于底面的倾斜角。

公开(公告)号：US08089086B2

公开(公告)日：2012-01-03

申请号：US12581755

申请日：2009-10-19

申请人： Siang Ling Oon ,  Chin Nyap Tan ,  Kee Yean Ng

发明人： Siang Ling Oon ,  Chin Nyap Tan ,  Kee Yean Ng

IPC分类号： H01L33/00 ,  F21V29/00

CPC分类号： H01L33/486 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014

摘要： Light sources are disclosed herein. An embodiment of a light sources comprises a substrate having a first surface and a second surface located opposite the first surface. At least one first electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. At least one second electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. A light emitter is affixed to the first surface of the substrate in an area not covered by either of the at least one first electrically conductive layer or the at least one second electrically conductive layer.

摘要翻译： 本文公开了光源。 光源的实施例包括具有第一表面和与第一表面相对定位的第二表面的基底。 至少一个第一导电层固定到基板的第一表面上并且部分地覆盖基板的第一表面。 至少一个第二导电层固定到基板的第一表面上并且部分地覆盖基板的第一表面。 在不被至少一个第一导电层或至少一个第二导电层中的任一个覆盖的区域中，将光发射器固定到衬底的第一表面。