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1.发明授权Structure with through hole, production method thereof, and liquid discharge head 有权具有通孔的结构，其制造方法和排液头公开(公告)号：US07018020B2
公开(公告)日：2006-03-28
申请号：US10270650
申请日：2002-10-16
申请人： Yukihiro Hayakawa , Genzo Monma , Masato Kamiichi
发明人： Yukihiro Hayakawa , Genzo Monma , Masato Kamiichi
IPC分类号： B41J2/05
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1642 , H01L23/481 , H01L29/0657 , H01L2924/0002 , H01L2924/00
摘要： A structure is constructed having a through hole in a substrate of silicon or the like by a decreased number of steps in production and with improved reliability. A silicon nitride film is formed in contact with an upper surface of a silicon oxide film at least on a portion of the substrate near the edge of a through hole, thereby improving step coverage of the silicon nitride film. The silicon oxide film and silicon nitride film function as a membrane during formation of the through hole by etching from the back side of the substrate.
摘要翻译： 通过生产步骤减少和可靠性提高，构造了在硅等的基板中具有通孔的结构。 至少在通孔的边缘附近的基板的一部分上形成与氧化硅膜的上表面接触的氮化硅膜，从而提高氮化硅膜的台阶覆盖。 氧化硅膜和氮化硅膜在从基板的背面进行蚀刻形成通孔期间用作膜。
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2.发明授权
公开(公告)号：US5376231A
公开(公告)日：1994-12-27
申请号：US871188
申请日：1992-04-20
申请人： Shigeyuki Matsumoto , Yasuhiro Naruse , Genzo Monma , Kei Fujita , Seiji Kamei , Yutaka Akino , Yasuhiro Sekine , Yukihiro Hayakawa
发明人： Shigeyuki Matsumoto , Yasuhiro Naruse , Genzo Monma , Kei Fujita , Seiji Kamei , Yutaka Akino , Yasuhiro Sekine , Yukihiro Hayakawa
IPC分类号： B41J2/14 , B41J2/16 , H01L21/321 , H01L21/3213 , H01L21/306 , B44C1/22 , C23F1/00
CPC分类号： B41J2/1629 , B41J2/14129 , B41J2/1604 , B41J2/1628 , B41J2/1631 , B41J2/164 , B41J2/1642 , H01L21/321 , H01L21/32134 , B41J2202/03 , B41J2202/13
摘要： A method for producing a substrate for a recording head wherein a plurality of electro-thermal converting elements, a plurality of driving functional elements for respectively driving the electro-thermal converting elements and a plurality of wiring electrodes for respectively connecting each of the driving functional elements and each of the electro-thermal converting elements are formed on a supporting member by photolithography comprises forming the wiring electrodes by etching a material layer for the wiring electrodes while etchingwise removing a photoresist for masking the material layer for the wiring electrodes.
摘要翻译： 一种用于制造用于记录头的基板的方法，其中多个电热转换元件，用于分别驱动电热转换元件的多个驱动功能元件和用于分别连接每个驱动功能元件的多个布线电极 并且每个电热转换元件通过光刻形成在支撑构件上，包括通过蚀刻用于布线电极的材料层来形成布线电极，同时蚀刻去除用于掩蔽布线电极的材料层的光致抗蚀剂。
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公开(公告)号：US20050031996A1
公开(公告)日：2005-02-10
申请号：US10910271
申请日：2004-08-04
CPC分类号： H05K1/167 , B41J2/14072 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1642 , B41J2/1643 , B41J2/1646 , H05K1/09 , H05K3/06 , H05K3/067 , H05K2201/0317 , H05K2203/0361
摘要： In order to provide a circuit substrate with a satisfactory step coverage by the protective layer and the anti-cavitation film in an edge portion of wirings and a liquid discharge head utilizing such circuit substrate, the invention provides a method for producing a circuit substrate provided, on an insulating surface of a substrate, with a plurality of elements each including a resistive layer and a pair of electrodes formed with a predetermined spacing on said resistive layer, including a step of forming an aluminum electrode wiring layer on the resistive layer, a step of isolating the electrode wiring layer by dry etching into each element, and a step of forming the electrode wiring into a tapered cross section with an etching solution containing phosphoric acid, nitric acid and a chelating agent capable of forming a complex with the wiring metal.
摘要翻译： 为了通过利用这种电路基板的布线边缘部分中的保护层和防空穴膜提供令人满意的阶梯覆盖的电路基板，本发明提供一种制造电路基板的方法， 在基板的绝缘表面上，多个元件各自包括电阻层和在所述电阻层上以预定间隔形成的一对电极，包括在电阻层上形成铝电极布线层的步骤，步骤 通过干蚀刻将电极配线层隔离成各元件，以及通过含有与配线金属形成络合物的磷酸，硝酸和螯合剂的蚀刻液将电极配线形成为锥形截面的工序。
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公开(公告)号：US07244370B2
公开(公告)日：2007-07-17
申请号：US10910271
申请日：2004-08-04
CPC分类号： H05K1/167 , B41J2/14072 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1642 , B41J2/1643 , B41J2/1646 , H05K1/09 , H05K3/06 , H05K3/067 , H05K2201/0317 , H05K2203/0361
摘要： In order to provide a circuit substrate with a satisfactory step coverage by the protective layer and the anti-cavitation film in an edge portion of wirings and a liquid discharge head utilizing such circuit substrate, the invention provides a method for producing a circuit substrate provided, on an insulating surface of a substrate, with a plurality of elements each including a resistive layer and a pair of electrodes formed with a predetermined spacing on said resistive layer, including a step of forming an aluminum electrode wiring layer on the resistive layer, a step of isolating the electrode wiring layer by dry etching into each element, and a step of forming the electrode wiring into a tapered cross section with an etching solution containing phosphoric acid, nitric acid and a chelating agent capable of forming a complex with the wiring metal.
摘要翻译： 为了通过利用这种电路基板的布线边缘部分中的保护层和防空穴膜提供令人满意的阶梯覆盖的电路基板，本发明提供一种制造电路基板的方法， 在基板的绝缘表面上，多个元件各自包括电阻层和在所述电阻层上以预定间隔形成的一对电极，包括在电阻层上形成铝电极布线层的步骤，步骤 通过干蚀刻将电极配线层隔离成各元件，以及通过含有与配线金属形成络合物的磷酸，硝酸和螯合剂的蚀刻液将电极配线形成为锥形截面的工序。
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公开(公告)号：US20060068570A1
公开(公告)日：2006-03-30
申请号：US11272869
申请日：2005-11-15
申请人： Yukihiro Hayakawa , Genzo Momma , Masato Kamiichi
发明人： Yukihiro Hayakawa , Genzo Momma , Masato Kamiichi
IPC分类号： H01L21/20
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1642 , H01L23/481 , H01L29/0657 , H01L2924/0002 , H01L2924/00
摘要： A structure is constructed having a through hole in a substrate of silicon or the like by a decreased number of steps in production and with improved reliability. A silicon nitride film is formed in contact with an upper surface of a silicon oxide film at least on a portion of the substrate near the edge of a through hole, thereby improving step coverage of the silicon nitride film. The silicon oxide film and silicon nitride film function as a membrane during formation of the through hole by etching from the back side of the substrate.
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公开(公告)号：US20050078152A1
公开(公告)日：2005-04-14
申请号：US10968901
申请日：2004-10-21
IPC分类号： B41J2/05 , H01C17/065 , H01C17/28 , H05K1/16 , H05K3/02
CPC分类号： H01C17/065 , H01C17/281 , H05K1/167 , H05K3/02 , Y10T29/49126
摘要： A circuit board for a liquid discharging apparatus in which coating performance of a protective layer and a cavitation resistive film on a heat generating element is excellent and durability is excellent and a manufacturing method of such a circuit board are provided. A surface portion of a wiring material layer is processed so that an etching speed of the surface portion is made higher than that of the material forming the wiring material layer. It is desirable to execute a process for forming at least one selected from a fluoride, a chloride, and a nitride of the material forming the wiring material layer into the surface portion of the wiring material layer.
摘要翻译： 一种用于液体排放装置的电路板，其中发热元件上的保护层和空穴电阻膜的涂层性能优异且耐久性优异，并且提供了这种电路板的制造方法。 处理布线材料层的表面部分，使得表面部分的蚀刻速度高于形成布线材料层的材料的蚀刻速度。 期望的是，将形成布线材料层的材料的氟化物，氯化物和氮化物中的至少一种形成到布线材料层的表面部分中。
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公开(公告)号：US07270398B2
公开(公告)日：2007-09-18
申请号：US10968901
申请日：2004-10-21
IPC分类号： B41J2/05
CPC分类号： H01C17/065 , H01C17/281 , H05K1/167 , H05K3/02 , Y10T29/49126
摘要： A circuit board for a liquid discharging apparatus in which coating performance of a protective layer and a cavitation resistive film on a heat generating element is excellent and durability is excellent and a manufacturing method of such a circuit board are provided. A surface portion of a wiring material layer is processed so that an etching speed of the surface portion is made higher than that of the material forming the wiring material layer. It is desirable to execute a process for forming at least one selected from a fluoride, a chloride, and a nitride of the material forming the wiring material layer into the surface portion of the wiring material layer.
摘要翻译： 一种用于液体排放装置的电路板，其中发热元件上的保护层和空穴电阻膜的涂层性能优异且耐久性优异，并且提供了这种电路板的制造方法。 处理布线材料层的表面部分，使得表面部分的蚀刻速度高于形成布线材料层的材料的蚀刻速度。 期望的是，将形成布线材料层的材料的氟化物，氯化物和氮化物中的至少一种形成到布线材料层的表面部分中。
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8.发明授权Structure with through hole, production method thereof, and liquid discharge head 有权具有通孔的结构，其制造方法和排液头公开(公告)号：US07270759B2
公开(公告)日：2007-09-18
申请号：US11272869
申请日：2005-11-15
申请人： Yukihiro Hayakawa , Genzo Momma , Masato Kamiichi
发明人： Yukihiro Hayakawa , Genzo Momma , Masato Kamiichi
IPC分类号： B41J2/16
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1642 , H01L23/481 , H01L29/0657 , H01L2924/0002 , H01L2924/00
摘要： A structure is constructed having a through hole in a substrate of silicon or the like by a decreased number of steps in production and with improved reliability. A silicon nitride film is formed in contact with an upper surface of a silicon oxide film at least on a portion of the substrate near the edge of a through hole, thereby improving step coverage of the silicon nitride film. The silicon oxide film and silicon nitride film function as a membrane during formation of the through hole by etching from the back side of the substrate.
摘要翻译： 通过生产步骤减少和可靠性提高，构造了在硅等的基板中具有通孔的结构。 至少在通孔的边缘附近的基板的一部分上形成与氧化硅膜的上表面接触的氮化硅膜，从而提高氮化硅膜的台阶覆盖。 氧化硅膜和氮化硅膜在从基板的背面进行蚀刻形成通孔期间用作膜。
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9.发明授权Manufacturing method of circuit board, circuit board, and liquid discharging apparatus 有权电路板，电路板和液体排放装置的制造方法公开(公告)号：US06838351B2
公开(公告)日：2005-01-04
申请号：US10805191
申请日：2004-03-22
CPC分类号： H01C17/065 , H01C17/281 , H05K1/167 , H05K3/02 , Y10T29/49126
摘要： A circuit board for a liquid discharging apparatus in which coating performance of a protective layer and a cavitation resistive film on a heat generating element is excellent and durability is excellent and a manufacturing method of such a circuit board are provided. A surface portion of a wiring material layer is processed so that an etching speed of the surface portion is made higher than that of the material forming the wiring material layer. It is desirable to execute a process for forming at least one selected from a fluoride, a chloride, and a nitride of the material forming the wiring material layer into the surface portion of the wiring material layer.
摘要翻译： 一种用于液体排放装置的电路板，其中发热元件上的保护层和空穴电阻膜的涂层性能优异且耐久性优异，并且提供了这种电路板的制造方法。 处理布线材料层的表面部分，使得表面部分的蚀刻速度高于形成布线材料层的材料的蚀刻速度。 期望的是，将形成布线材料层的材料的氟化物，氯化物和氮化物中的至少一种形成到布线材料层的表面部分中。
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公开(公告)号：US08842338B2
公开(公告)日：2014-09-23
申请号：US13534197
申请日：2012-06-27
申请人： Yukihiro Hayakawa , Naoyuki Urata , Kanna Iinuma , Kenichi Fujioka , Hiroyuki Abiru , Teruyoshi Yamamoto , Ken Mitsui , Yuu Yamashita
发明人： Yukihiro Hayakawa , Naoyuki Urata , Kanna Iinuma , Kenichi Fujioka , Hiroyuki Abiru , Teruyoshi Yamamoto , Ken Mitsui , Yuu Yamashita
CPC分类号： G06F3/1205 , G06F3/1243 , G06F3/1254 , G06F3/1257 , G06F2206/1514
摘要： In a printer driver, combinations of standard print conditions and standard render data are saved as standard patterns, and combinations of standard print conditions and standard render data used for exceptional settings are saved as print application patterns. The print application patterns and the standard patterns are associated with each other. When printing document data, print condition data and render data are spooled by each page, the standard print conditions and the standard render data are compared, and a most similar standard pattern is detected. The print application pattern corresponding to the detected standard pattern is referred to, and print conditions are generated by combining standard print conditions and print conditions of the document data for each page. From the render data of the document data or from the standard render data, print data that can be processed by the printer is generated.
摘要翻译： 在打印机驱动程序中，将标准打印条件和标准渲染数据的组合保存为标准模式，并将标准打印条件和用于异常设置的标准渲染数据的组合保存为打印应用程序模式。 打印应用程序模式和标准模式相互关联。 当打印文档数据时，打印条件数据和渲染数据由每页打印，比较标准打印条件和标准渲染数据，并且检测到最相似的标准图案。 参照对应于检测到的标准图案的打印应用程序模式，并且通过组合每页的文档数据的标准打印条件和打印条件来生成打印条件。 从文档数据的渲染数据或标准渲染数据，生成可由打印机处理的打印数据。
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