摘要:
A novel hot-melt adhesive composition comprising 100 parts by weight of a polyamide copolymer resin having a melting point of about 80.degree. to about 160.degree. C. and composed of at least three monomers, about 5 to about 30 parts by weight of a terpene-phenol resin having a softening point of about 80.degree. to about 120.degree. C., and about 5 to about 10 parts by weight of a plasticizer.
摘要:
A laminate for interior finish material comprising a frame and a covering material thermally adhered to each other with a hot melt adhesive containing a polyamide copolymer of a melting point of about 80.degree. - 140.degree. C as principal component.
摘要:
A thermoplastic hot melt adhesive composition for bonding metals which comprises a homogeneous mixture of (A) 60 to 90 percent by weight of a nylon material selected from the group consisting of homopolymers and copolymers of nylon monomer selected from the group consisting of nylon salts having at least 10 carbon atoms, nylon-forming .omega.-amino acids and nylon-forming lactams, and (B) 10 to 40 percent by weight of an ethylene/vinyl acetate copolymer containing 1 to 25 weight percent of vinyl acetate.
摘要:
The shape of a tip of an insulating material of an insulating isolation region is provided as being a concave one recessed below the back surface of an n-semiconductor substrate. This reduces the electric field strength at the corner at which the bottom of the n-semiconductor substrate is in contact with the insulating isolation region to allow an excellent breakdown voltage to be obtained. Moreover, by forming a high impurity concentration region such as a field-stop layer on the back surface of the n-semiconductor substrate, a depletion layer extending from the top surface is prevented from reaching the back surface This eliminates an influence of a surface state introduced in the interface between the insulator film formed on the back surface and the n-semiconductor substrate, by which an excellent breakdown voltage can be obtained.
摘要:
An insulated gate thyristor is provided in which an inversion layer is created beneath a gate electrode to which a voltage is applied. An emitter region of a first conductivity type is biased to the same potential as a first main electrode via a MOSFET channel, and a thyristor portion consisting of the emitter region, a second base region of a second conductivity type, a base layer of the first conductivity type and an emitter layer of the second conductivity type is turned on. As electrons are injected uniformly from the entire emitter region, the insulated gate thyristor quickly shifts to the thyristor mode, and the on-voltage of the insulated gate thyristor of the invention is lowered. The insulated gate thyristor of the invention does not require a hole current that flows through the second base region of a convention EST in the Z-direction. In turning off, the pn junction recovers quickly without causing current localization, and the breakdown withstand capability if improved.
摘要:
A character erasable printing apparatus is designed to erase a character or an underline in plural times of erasing action by moving the printing head, and to print a character by a single printing action.Therefore, when an underlined character is erased together with its underline, and a correct character is printed together with an underline, the underline is interrupted.Disclosed are, to pervent such interruption of the underline, a character erasable printing apparatus capable of erasing only the character without erasing the underline when the underline mode is being set, a character erasable printing apparatus capable of erasing only the character without erasing the underline when erasing a character adjacent to an underlined character, and a character erasable printing apparatus capable of erasing the underline without moving the printing head when erasing an underline of a character adjacent to an underlined character.
摘要:
A silicon carbide vertical field effect transistor includes a first-conductive-type silicon carbide substrate; a low-concentration first-conductive-type silicon carbide layer formed on a surface of the first-conductive-type silicon carbide substrate; second-conductive-type regions selectively formed on a surface of the first-conductive-type silicon carbide layer; first-conductive-type source regions formed in the second-conductive-type regions; a high-concentration second-conductive-type region formed between the first-conductive-type source regions in the second-conductive-type region; a source electrode electrically connected to the high-concentration second-conductive-type region and a first-conductive-type source region; a gate insulating film formed from the first-conductive-type source regions formed in adjacent second-conductive-type regions, onto the second-conductive-type regions and the first-conductive-type silicon carbide layer; a gate electrode formed on the gate insulating film; and a drain electrode on the back side of the first-conductive-type silicon carbide substrate, wherein an avalanche generating unit is disposed between the second-conductive-type region and the first-conductive-type silicon carbide layer.
摘要:
The shape of a tip of an insulating material of an insulating isolation region is provided as being a concave one recessed below the back surface of an n-semiconductor substrate. This reduces the electric field strength at the corner at which the bottom of the n-semiconductor substrate is in contact with the insulating isolation region to allow an excellent breakdown voltage to be obtained. Moreover, by forming a high impurity concentration region such as a field-stop layer on the back surface of the n-semiconductor substrate, a depletion layer extending from the top surface is prevented from reaching the back surface. This eliminates an influence of a surface state introduced in the interface between the insulator film formed on the back surface and the n-semiconductor substrate, by which an excellent breakdown voltage can be obtained.
摘要:
An insulated gate thyristor is provided which includes: a first-conductivity-type base layer, first and second-conductivity-type base regions formed in the base layer, a first-conductivity-type source region formed in the first base region, a first-conductivity-type emitter region formed in the second base region, and a gate electrode layer formed on a gate insulating film over the first base region, first-conductivity-type base layer, and second base region, which are interposed between the first-conductivity-type source region and the first-conductivity-type emitter region. The thyristor further includes a first main electrode that contacts with both the first base region and the first-conductivity-type source region, a second-conductivity-type emitter layer formed on the other surface of the first-conductivity-type base layer, a second main electrode that contacts with the second-conductivity-type emitter layer, a gate electrode connected to the gate electrode layer; and an insulating film covering entire surface areas of the second second-conductivity-type base region and the first-conductivity-type emitter region. In this insulated gate thyristor, an exposed surface portion of the first second-conductivity-type base region that is interposed between the first-conductivity-type base layer and the first-conductivity-type source region has a smaller width than an exposed surface portion of the second second-conductivity-type base region interposed between the first-conductivity-type base layer and the first-conductivity-type emitter region.
摘要:
An insulated gate thyristor includes a first-conductivity-type base layer having a high resistivity, first and second second-conductivity-type base regions formed in a surface layer of the first-conductivity-type base layer, a first-conductivity-type source region formed in a surface layer of the first second-conductivity-type base region, and a first-conductivity-type emitter region formed in a surface layer of the second second-conductivity-type base region. The thyristor further includes a gate electrode formed through an insulating film on the first second-conductivity-type base region, an exposed portion of the first-conductivity-type base layer and the second second-conductivity-type base region, a first main electrode that contacts both the first second-conductivity-type base layer and first-conductivity-type source region, a second-conductivity-type emitter layer formed on the first-conductivity-type base layer, a second main electrode that contacts the second-conductivity-type emitter layer, and an insulating film covering entire areas of surfaces of the second second-conductivity-type base region and first-conductivity-type emitter region. The second second-conductivity-type base region has a diffusion depth that is greater than a larger one of diffusion depths of the first second-conductivity-type base region and a second-conductivity-type well region included in the first second-conductivity-type base region.