公开(公告)号：US20100117711A1

公开(公告)日：2010-05-13

申请号：US12527877

申请日：2007-11-15

申请人： Takuya Suzuki ,  Kenji Kawakami ,  Ko Kanaya ,  Yoichi Kitamura

发明人： Takuya Suzuki ,  Kenji Kawakami ,  Ko Kanaya ,  Yoichi Kitamura

IPC分类号： G06F7/44 ,  H01L23/48

CPC分类号： H03D7/02 ,  H01L23/66 ,  H01L2223/6644 ,  H01L2924/0002 ,  H01L2924/3011 ,  H03D9/0633 ,  H01L2924/00

摘要： A two-terminal semiconductor device is formed on a semiconductor substrate. Two wiring patterns are respectively connected to terminals of the semiconductor device, and two electrode pads are respectively connected to the wiring patterns for connecting a signal input/output circuit formed on a separate substrate. Two parallel wiring patterns are respectively connected to the wiring patterns, and two reactance-circuit connection electrode pads are respectively connected to the parallel wiring patterns for electrically connecting a reactance circuit formed on the separate substrate separately from the signal input/output circuit.

摘要翻译： 在半导体衬底上形成二端子半导体器件。 两个布线图案分别连接到半导体器件的端子，并且两个电极焊盘分别连接到用于连接形成在单独基板上的信号输入/输出电路的布线图案。 两个平行布线图案分别连接到布线图案，并且两个电抗电路连接电极焊盘分别连接到并行布线图案，用于将形成在单独基板上的电抗电路与信号输入/输出电路分开地电连接。

公开(公告)号：US08548416B2

公开(公告)日：2013-10-01

申请号：US12527877

申请日：2007-11-15

申请人： Takuya Suzuki ,  Kenji Kawakami ,  Ko Kanaya ,  Yoichi Kitamura

发明人： Takuya Suzuki ,  Kenji Kawakami ,  Ko Kanaya ,  Yoichi Kitamura

IPC分类号： H04B1/28

CPC分类号： H03D7/02 ,  H01L23/66 ,  H01L2223/6644 ,  H01L2924/0002 ,  H01L2924/3011 ,  H03D9/0633 ,  H01L2924/00

摘要： A two-terminal semiconductor device is formed on a semiconductor substrate. Two wiring patterns are respectively connected to terminals of the semiconductor device, and two electrode pads are respectively connected to the wiring patterns for connecting a signal input/output circuit formed on a separate substrate. Two parallel wiring patterns are respectively connected to the wiring patterns, and two reactance-circuit connection electrode pads are respectively connected to the parallel wiring patterns for electrically connecting a reactance circuit formed on the separate substrate separately from the signal input/output circuit.

摘要翻译： 在半导体衬底上形成二端子半导体器件。 两个布线图案分别连接到半导体器件的端子，并且两个电极焊盘分别连接到用于连接形成在单独基板上的信号输入/输出电路的布线图案。 两个平行布线图案分别连接到布线图案，并且两个电抗电路连接电极焊盘分别连接到并行布线图案，用于将形成在单独基板上的电抗电路与信号输入/输出电路分开地电连接。

公开(公告)号：US08229387B2

公开(公告)日：2012-07-24

申请号：US12526432

申请日：2007-04-25

申请人： Kenji Kawakami ,  Takuya Suzuki ,  Ko Kanaya ,  Yoichi Kitamura

发明人： Kenji Kawakami ,  Takuya Suzuki ,  Ko Kanaya ,  Yoichi Kitamura

IPC分类号： H04B1/26

CPC分类号： H03D9/0633 ,  H03D7/02

摘要： Provided is an even harmonic mixer which is reduced in cost and size. The even harmonic mixer includes: a transducer in which a conductor of a microstrip line is connected to a ground plane of a waveguide, for transducing an RF signal transmitted in a waveguide mode into a transmission mode of the microstrip line; an anti-parallel diode pair which is cascade-connected to a microstrip line side of the transducer, and formed on a semiconductor substrate; a branching circuit for branching an LO signal and an IF signal; an open-end stub which is disposed between the transducer and the anti-parallel diode pair, and has a line length of about ½ wavelength at an RF signal frequency; and an open-end stub which is disposed between the anti-parallel diode pair and the branching circuit, and has a line length of about ¼ wavelength at the RF signal frequency.

摘要翻译： 提供了一种降低成本和尺寸的均匀谐波混合器。 均匀谐波混频器包括：传感器，其中微带线的导体连接到波导的接地平面，用于将以波导模式传输的RF信号转换为微带线的传输模式; 反并联二极管对，其级联连接到换能器的微带线侧，并形成在半导体衬底上; 用于分支LO信号和IF信号的分支电路; 设置在换能器和反并联二极管对之间的开口短截线，并且在RF信号频率处具有大约1/2波长的线路长度; 以及设置在反并联二极管对和分支电路之间的开路短截线，并且在RF信号频率处具有约1/4波长的线路长度。

公开(公告)号：US20100315177A1

公开(公告)日：2010-12-16

申请号：US12526432

申请日：2007-04-25

申请人： Kenji Kawakami ,  Takuya Suzuki ,  Ko Kanaya ,  Yoichi Kitamura

发明人： Kenji Kawakami ,  Takuya Suzuki ,  Ko Kanaya ,  Yoichi Kitamura

IPC分类号： H01P5/12

CPC分类号： H03D9/0633 ,  H03D7/02

摘要： Provided is an even harmonic mixer which is reduced in cost and size. The even harmonic mixer includes: a transducer in which a conductor of a microstrip line is connected to a ground plane of a waveguide, for transducing an RF signal transmitted in a waveguide mode into a transmission mode of the microstrip line; an anti-parallel diode pair which is cascade-connected to a microstrip line side of the transducer, and formed on a semiconductor substrate; a branching circuit for branching an LO signal and an IF signal; an open-end stub which is disposed between the transducer and the anti-parallel diode pair, and has a line length of about ½ wavelength at an RF signal frequency; and an open-end stub which is disposed between the anti-parallel diode pair and the branching circuit, and has a line length of about ¼ wavelength at the RF signal frequency.

摘要翻译： 提供了一种降低成本和尺寸的均匀谐波混合器。 均匀谐波混频器包括：传感器，其中微带线的导体连接到波导的接地平面，用于将以波导模式传输的RF信号转换为微带线的传输模式; 反并联二极管对，其级联连接到换能器的微带线侧，并形成在半导体衬底上; 用于分支LO信号和IF信号的分支电路; 设置在换能器和反并联二极管对之间的开口短截线，并且在RF信号频率处具有大约1/2波长的线路长度; 以及设置在反并联二极管对和分支电路之间的开路短截线，并且在RF信号频率处具有约1/4波长的线路长度。

公开(公告)号：US09693492B2

公开(公告)日：2017-06-27

申请号：US14111107

申请日：2012-01-31

申请人： Yusuke Kitsukawa ,  Takuya Suzuki ,  Tomoyuki Unno

发明人： Yusuke Kitsukawa ,  Takuya Suzuki ,  Tomoyuki Unno

IPC分类号： H05K1/11 ,  H05K1/14 ,  H05K9/00 ,  H01L23/04 ,  H01L23/552 ,  H01L23/66

CPC分类号： H05K9/006 ,  H01L23/04 ,  H01L23/552 ,  H01L23/66 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/15192 ,  H01L2924/15321 ,  H01L2924/3025

摘要： A high-frequency package includes a first dielectric substrate having a signal line and a grounding conductor provided on a back side, a high-frequency element connected to a back side of the first dielectric substrate with a first connection conductor therebetween, a second dielectric substrate having a signal line and a grounding conductor provided on a front side facing the back side with the high-frequency element therebetween, and second connection conductors that are arranged so as to surround the high-frequency element and connect the grounding conductor on the back side of the first dielectric substrate and the grounding conductor on the front side of the second dielectric substrate. In the high-frequency package, a dielectric space surrounded by a conductor pattern is formed in the front side of the second dielectric substrate under the high-frequency element.

公开(公告)号：US09433080B2

公开(公告)日：2016-08-30

申请号：US13075779

申请日：2011-03-30

申请人： Takuya Suzuki

发明人： Takuya Suzuki

IPC分类号： H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H01L23/552 ,  H01L23/58 ,  H01L23/66 ,  H01L25/18 ,  H01P5/107 ,  H01L25/065 ,  H01P3/08 ,  H01Q9/04 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34

CPC分类号： H05K1/0218 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2924/15321 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/3011 ,  H01P3/081 ,  H01P5/107 ,  H01Q9/04 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/09618 ,  H05K2201/10151 ,  H05K2201/10734

摘要： Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate (20) is disposed, on an underside surface layer of which are disposed high-frequency circuits (21 and 22) and is formed a first grounding conductor that has same electric potential as grounding conductors of the high-frequency circuits and that surrounds the high-frequency circuits. A mother control substrate (3) is disposed, on which the high-frequency circuit mounting substrate (20) is mounted in such a way that the high-frequency circuits are sandwiched therebetween and on which a second grounding conductor is formed in a region facing the high-frequency circuits. Plural first lands are formed on the first grounding conductor of the high-frequency circuit mounting substrate (20) to surround the high-frequency circuits. Plural second lands are formed that are electrically connected to the second grounding conductor at positions on a surface layer of the mother control substrate (3) which face the first lands. Plural solder balls (30G2) are disposed for connecting the first lands and the second lands. The high-frequency circuits are housed in pseudo shielding cavities surrounded by the solder balls (30G2), the grounding conductors of the high-frequency circuits, and the first and second grounding conductors.

公开(公告)号：US09070961B2

公开(公告)日：2015-06-30

申请号：US13062349

申请日：2009-09-02

申请人： Takuya Suzuki

发明人： Takuya Suzuki

IPC分类号： H05K1/11 ,  H05K1/14 ,  H01P5/107 ,  H01L23/552 ,  H01L23/58 ,  H01L23/66 ,  H01L25/18 ,  H05K1/02 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34

CPC分类号： H05K1/0218 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2924/15321 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/3011 ,  H01P3/081 ,  H01P5/107 ,  H01Q9/04 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/09618 ,  H05K2201/10151 ,  H05K2201/10734

摘要： Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate (20) is disposed, on an underside surface layer of which are disposed high-frequency circuits (21 and 22) and is formed a first grounding conductor that has same electric potential as grounding conductors of the high-frequency circuits and that surrounds the high-frequency circuits. A mother control substrate (3) is disposed, on which the high-frequency circuit mounting substrate (20) is mounted in such a way that the high-frequency circuits are sandwiched therebetween and on which a second grounding conductor is formed in a region facing the high-frequency circuits. Plural first lands are formed on the first grounding conductor of the high-frequency circuit mounting substrate (20) to surround the high-frequency circuits. Plural second lands are formed that are electrically connected to the second grounding conductor at positions on a surface layer of the mother control substrate (3) which face the first lands. Plural solder balls (30G2) are disposed for connecting the first lands and the second lands. The high-frequency circuits are housed in pseudo shielding cavities surrounded by the solder balls (30G2), the grounding conductors of the high-frequency circuits, and the first and second grounding conductors.

摘要翻译： 使用不使用任何盖子的简单且便宜的配置来实现高频电路的屏蔽。 高频电路安装基板（20）设置在其下表面层上，设置有高频电路（21和22），并形成与第一接地导体相同的电位的第一接地导体， 频率电路，并且围绕高频电路。 设置母控制基板（3），其上安装有高频电路安装基板（20），使得高频电路夹在其间并在其上形成有第二接地导体的区域 高频电路。 多个第一焊盘形成在高频电路安装基板（20）的第一接地导体上，以围绕高频电路。 形成在母板控制基板（3）的面对第一焊盘的位置处与第二接地导体电连接的多个第二焊盘。 多个焊球（30G2）被设置用于连接第一焊盘和第二焊盘。 高频电路容纳在由焊球（30G2），高频电路的接地导体以及第一和第二接地导体包围的伪屏蔽腔中。

公开(公告)号：US07994881B2

公开(公告)日：2011-08-09

申请号：US12307755

申请日：2007-10-30

申请人： Takuya Suzuki

发明人： Takuya Suzuki

IPC分类号： H01P1/04

CPC分类号： H01P1/042 ,  H01P3/121

摘要： A rectangular conductor pattern is formed around a first waveguide on a multilayer dielectric substrate facing a metal substrate, with an end at about λ/4 away from a long side edge of the first waveguide, where λ is a free-space wavelength of a signal wave. A conductor opening is formed between the end of the conduction pattern and the long side edge of the first waveguide, with a length longer than a long side of the first waveguide and shorter than about λ. A closed-ended dielectric transmission path is formed in the multilayer dielectric substrate in the layer direction, with a length of about λg/4, where λg is an in-substrate effective wavelength of the signal wave.

摘要翻译： 在面向金属基板的多层电介质基板上的第一波导周围形成矩形导体图案，其端部距离第一波导的长边缘大约λ/ 4，其中λ是信号的自由空间波长 波。 导体开口形成在导电图案的端部和第一波导的长边缘之间，其长度比第一波导的长边长并且短于约λ。 在多层电介质基板中沿层方向形成封闭电介质传输路径，长度约为λg/ 4，其中λg为信号波的衬底内有效波长。

公开(公告)号：US20110163919A1

公开(公告)日：2011-07-07

申请号：US13062349

申请日：2009-09-02

申请人： Takuya Suzuki

发明人： Takuya Suzuki

IPC分类号： H05K9/00 ,  H01Q1/38

CPC分类号： H05K1/0218 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2924/15321 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/3011 ,  H01P3/081 ,  H01P5/107 ,  H01Q9/04 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/09618 ,  H05K2201/10151 ,  H05K2201/10734

摘要： Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate (20) is disposed, on an underside surface layer of which are disposed high-frequency circuits (21 and 22) and is formed a first grounding conductor that has same electric potential as grounding conductors of the high-frequency circuits and that surrounds the high-frequency circuits. A mother control substrate (3) is disposed, on which the high-frequency circuit mounting substrate (20) is mounted in such a way that the high-frequency circuits are sandwiched therebetween and on which a second grounding conductor is formed in a region facing the high-frequency circuits. Plural first lands are formed on the first grounding conductor of the high-frequency circuit mounting substrate (20) to surround the high-frequency circuits. Plural second lands are formed that are electrically connected to the second grounding conductor at positions on a surface layer of the mother control substrate (3) which face the first lands. Plural solder balls (30G2) are disposed for connecting the first lands and the second lands. The high-frequency circuits are housed in pseudo shielding cavities surrounded by the solder balls (30G2), the grounding conductors of the high-frequency circuits, and the first and second grounding conductors.

摘要翻译： 使用不使用任何盖子的简单且便宜的配置来实现高频电路的屏蔽。 高频电路安装基板（20）设置在其下表面层上，设置有高频电路（21和22），并形成与第一接地导体相同的电位的第一接地导体， 频率电路，并且围绕高频电路。 设置母控制基板（3），其上安装有高频电路安装基板（20），使得高频电路夹在其间并在其上形成有第二接地导体的区域 高频电路。 多个第一焊盘形成在高频电路安装基板（20）的第一接地导体上，以围绕高频电路。 形成在母板控制基板（3）的面对第一焊盘的位置处与第二接地导体电连接的多个第二焊盘。 多个焊球（30G2）被设置用于连接第一焊盘和第二焊盘。 高频电路容纳在由焊球（30G2），高频电路的接地导体以及第一和第二接地导体包围的伪屏蔽腔中。

公开(公告)号：US07725009B2

公开(公告)日：2010-05-25

申请号：US11176777

申请日：2005-07-07

申请人： Takuya Suzuki

发明人： Takuya Suzuki

IPC分类号： H04N5/00

CPC分类号： H04N21/462 ,  H04N5/57 ,  H04N5/63 ,  H04N5/85 ,  H04N21/4325 ,  H04N21/4424

摘要： A video reproduction apparatus detects the remaining time of a movie being reproduced and a battery's availability and calculates therefrom power available before reproducing the movie ends, and uses the power as calculated and a table representing a relationship between the liquid crystal display device's screen brightness and power consumption to calculate and set the liquid crystal display device's screen brightness to prevent the battery from running out while the movie is being reproduced.

摘要翻译： 视频再现装置检测正在再现的电影的剩余时间和电池的可用性，并且从其计算再现电影结束之前的可用电力，并且使用所计算的电力和表示液晶显示装置的屏幕亮度和功率之间的关系的表 消耗来计算和设置液晶显示设备的屏幕亮度，以防止在电影被再现时电池电量耗尽。