公开(公告)号：US20060154066A1

公开(公告)日：2006-07-13

申请号：US11370835

申请日：2006-03-09

申请人： Kenji Kita ,  Yasumasa Morishima ,  Shinichi Ishiwata

发明人： Kenji Kita ,  Yasumasa Morishima ,  Shinichi Ishiwata

IPC分类号： D02G3/00

CPC分类号： H01L24/29 ,  C09J7/38 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2848 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/298 ,  H01L2924/00

摘要： A wafer-processing tape, which has an adhesive layer (1) and a removable adhesive layer (2) formed on a surface of a base film (3), and which has an area where B>A, and an area where A>B, in which a peeling force between the base film (3) and the adhesive layer (1) is designated as A, and peeling forces between a target to be bonded (4) and the adhesive layer (1) and between a target to be bonded (5) and the removable adhesive layer (2) are designated as B, wherein the adhesive layer (1) is transferred onto the chip side during pickup in the area where B>A, and the removable adhesive layer (2) is not transferred onto the target to be bonded (5) in the area where A>B during peeling off the tape.

摘要翻译： 一种晶片加工带，其具有形成在基膜（3）的表面上的粘合剂层（1）和可移除的粘合剂层（2），并且具有B> A的区域和A> B，其中基膜（3）和粘合剂层（1）之间的剥离力被指定为A，以及待接合的靶（4）和粘合剂层（1）之间以及靶 被粘合（5）和可移除粘合剂层（2）指定为B，其中在B> A的区域中，粘合剂层（1）在拾取期间转移到芯片侧，并且可除去粘合剂层（2） 在剥离带子时，在A> B的区域中没有转印到待粘合的目标物（5）上。

公开(公告)号：US07517724B2

公开(公告)日：2009-04-14

申请号：US10556535

申请日：2005-03-15

申请人： Keiichi Hatakeyama ,  Michio Uruno ,  Takayuki Matsuzaki ,  Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata

发明人： Keiichi Hatakeyama ,  Michio Uruno ,  Takayuki Matsuzaki ,  Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata

IPC分类号： H01L21/00

CPC分类号： C09J163/10 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/22 ,  C09J7/35 ,  C09J133/068 ,  C09J161/06 ,  C09J161/28 ,  C09J175/14 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2475/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/73265 ,  H01L2224/83191

摘要： The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing/die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g/eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.5 to 6% by weight of glycidyl acrylate or glycidyl methacrylate, and with a weight average molecular weight of at least 100,000, a filler (d), and a curing accelerator (e).

摘要翻译： 本发明提供一种切割/切片接合片，其可以在切割时用作切割带，能够在拾取期间将半导体元件和粘合剂层与压敏粘合剂层容易地分离，并且其中粘合剂层具有令人满意的 作为芯片接合材料的粘合性。 一种切片/芯片粘接片，其中所述压敏粘合剂层包含含有碘值为0.5至20的分子内，可辐射固化碳 - 碳双键的化合物（A）和至少一种选自以下的化合物（B）： 由聚异氰酸酯，三聚氰胺 - 甲醛树脂和环氧树脂组成的组，并且粘合剂层包含环氧树脂（a），羟基当量至少为150g / eq的酚醛树脂（b），环氧基 - 含有丙烯酸共聚物（c），包含0.5-6重量％的丙烯酸缩水甘油酯或甲基丙烯酸缩水甘油酯，重均分子量至少为100,000，填料（d）和固化促进剂（e）。

公开(公告)号：US20070141330A1

公开(公告)日：2007-06-21

申请号：US11700142

申请日：2007-01-31

申请人： Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata ,  Takanori Yamakawa

发明人： Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata ,  Takanori Yamakawa

IPC分类号： B32B37/12 ,  B32B38/10 ,  B32B38/04 ,  B32B7/12 ,  B32B15/04

CPC分类号： H01L24/29 ,  C09J7/20 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2479/08 ,  H01L21/561 ,  H01L21/563 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/1134 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665

摘要： A wafer-processing tape, having a removable adhesive layer(2), and an adhesive layer (3), formed on a substrate film(1), wherein the tape is used in a process involving the steps of: grinding a back face of a wafer circuit substrate (5) having convex-type metal electrodes (4), and dicing the wafer circuit substrate into chips, in a state that the tape is adhered to the wafer circuit substrate; and picking up the chips, in which the chips are picked up in a state that the adhesive layer (3) is peeled from the substrate film (1) but is bonded to the individual chip.

摘要翻译： 一种形成在基片（1）上的具有可去除的粘合剂层（2）和粘合剂层（3）的晶片加工带，其特征在于，该方法包括以下步骤：研磨 具有凸型金属电极（4）的晶片电路基板（5），并且将所述晶片电路基板切割成芯片，所述芯片粘贴在所述晶片电路基板上。 并且拾取芯片，其中粘合剂层（3）从基材膜（1）剥离但结合到单个芯片的状态下拾取芯片。

公开(公告)号：US20050249909A1

公开(公告)日：2005-11-10

申请号：US11184001

申请日：2005-07-19

申请人： Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata

发明人： Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata

IPC分类号： C09J7/02 ,  H01L21/00 ,  H01L21/68 ,  B32B9/00

CPC分类号： H01L21/6836 ,  C09J7/385 ,  C09J2203/326 ,  H01L21/67132 ,  H01L2221/68327 ,  Y10T428/14 ,  Y10T428/1462 ,  Y10T428/24364 ,  Y10T428/24926 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2852

摘要： A wafer-adhering adhesive tape, which has, on a surface of a base, a radiation-curable removable adhesive layer, and if necessary a die-bonding adhesive layer in order, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.

摘要翻译： 一种晶片粘合胶带，其在基体的表面上具有可辐射固化的可去除的粘合剂层，并且如果需要，在顺序上具有芯片粘合粘合剂层，其中可辐射固化的可除去粘合剂层主要由 在主链中分别具有至少可辐射固化的含碳 - 碳双键的基团，羟基和含有羧基的基团的丙烯酸系共聚物，并且所述可辐射固化的可除去粘合剂层具有凝胶 60％以上的分数。

公开(公告)号：US08722184B2

公开(公告)日：2014-05-13

申请号：US12058170

申请日：2008-03-28

申请人： Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata

发明人： Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata

IPC分类号： B32B7/12 ,  B32B15/04

CPC分类号： H01L21/6836 ,  C09J7/385 ,  C09J2203/326 ,  H01L21/67132 ,  H01L2221/68327 ,  Y10T428/14 ,  Y10T428/1462 ,  Y10T428/24364 ,  Y10T428/24926 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2852

摘要： A wafer-adhering adhesive tape, which has, on a surface of a base, a radiation-curable removable adhesive layer, and if necessary a die-bonding adhesive layer in order, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.

摘要翻译： 一种晶片粘合胶带，其在基体的表面上具有可辐射固化的可去除的粘合剂层，并且如果需要，在顺序上具有芯片粘合粘合剂层，其中可辐射固化的可除去粘合剂层主要由 在主链中分别具有至少可辐射固化的含碳 - 碳双键的基团，羟基和含有羧基的基团的丙烯酸系共聚物，并且所述可辐射固化的可除去粘合剂层具有凝胶 60％以上的分数。

公开(公告)号：US08545979B2

公开(公告)日：2013-10-01

申请号：US11370835

申请日：2006-03-09

申请人： Kenji Kita ,  Yasumasa Morishima ,  Shinichi Ishiwata

发明人： Kenji Kita ,  Yasumasa Morishima ,  Shinichi Ishiwata

IPC分类号： B32B7/12 ,  B32B7/10

CPC分类号： H01L24/29 ,  C09J7/38 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2848 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/298 ,  H01L2924/00

摘要： A wafer-processing tape, which has an adhesive layer and a removable adhesive layer formed on a surface of a base film, and which has an area where B>A, and an area where A>B, in which a peeling force between the base film and the adhesive layer is designated as A, and peeling forces between a target to be bonded and the adhesive layer and between a target to be bonded and the removable adhesive layer are designated as B, wherein the adhesive layer is transferred onto the chip side during pickup in the area where B>A, and the removable adhesive layer is not transferred onto the target to be bonded in the area where A>B during peeling off the tape.

摘要翻译： 一种晶片加工带，其具有形成在基膜的表面上的粘合剂层和可除去的粘合剂层，并且其具有B> A的区域和A> B的区域，其中， 基底膜和粘合剂层被指定为A，将待粘合的目标物和粘合剂层之间以及待接合的靶材与可除去的粘合剂层之间的剥离力指定为B，其中粘合剂层转移到芯片上 在B> A的区域中的拾取过程中，在剥离带子时，在A> B的区域中不能将可移除的粘合剂层转印到待粘合的目标物上。

公开(公告)号：US08043698B2

公开(公告)日：2011-10-25

申请号：US11700142

申请日：2007-01-31

申请人： Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata ,  Takanori Yamakawa

发明人： Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata ,  Takanori Yamakawa

IPC分类号： B32B7/12 ,  B32B15/04

CPC分类号： H01L24/29 ,  C09J7/20 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2479/08 ,  H01L21/561 ,  H01L21/563 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/1134 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665

摘要： A wafer-processing tape, having a removable adhesive layer (2), and an adhesive layer (3), formed on a substrate film (1), wherein the tape is used in a process involving the steps of: grinding a back face of a wafer circuit substrate (5) having convex-type metal electrodes (4), and dicing the wafer circuit substrate into chips, in a state that the tape is adhered to the wafer circuit substrate; and picking up the chips, in which the chips are picked up in a state that the adhesive layer (3) is peeled from the substrate film (1) but is bonded to the individual chip.

摘要翻译： 一种形成在基片（1）上的具有可去除的粘合剂层（2）和粘合剂层（3）的晶片加工带，其特征在于，该方法包括以下步骤：研磨 具有凸型金属电极（4）的晶片电路基板（5），并且将所述晶片电路基板切割成芯片，所述芯片粘贴在所述晶片电路基板上。 并且拾取芯片，其中粘合剂层（3）从基材膜（1）剥离但结合到单个芯片的状态下拾取芯片。

公开(公告)号：US20060204749A1

公开(公告)日：2006-09-14

申请号：US11417123

申请日：2006-05-04

申请人： Kenji Kita ,  Yasumasa Morishima ,  Shinichi Ishiwata ,  Akira Yabuki

发明人： Kenji Kita ,  Yasumasa Morishima ,  Shinichi Ishiwata ,  Akira Yabuki

IPC分类号： B32B7/12 ,  B32B15/04

CPC分类号： H01L21/6836 ,  B32B7/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2891 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A wafer-processing tape (10), having an intermediate resin layer (2), a removable adhesive layer (3), and, if necessary, an adhesive layer (4), which are laminated in this order on a substrate film (1), wherein a storage elastic modulus at 80° C. of the intermediate resin layer is larger than a storage elastic modulus at 80° C. of the removable adhesive layer.

摘要翻译： 一种具有中间树脂层（2），可去除粘合剂层（3）以及如果需要的粘合层（4）的晶片加工带（10），它们依次层压在基片（1）上 ），其中中间树脂层的80℃下的储能弹性模量大于可除去粘合剂层的80℃下的储能弹性模量。

公开(公告)号：USD628170S1

公开(公告)日：2010-11-30

申请号：US29321421

申请日：2008-07-16

申请人： Hiromitsu Maruyama ,  Shuzo Taguchi ,  Yasumasa Morishima ,  Shinichi Ishiwata

设计人： Hiromitsu Maruyama ,  Shuzo Taguchi ,  Yasumasa Morishima ,  Shinichi Ishiwata

公开(公告)号：US09324593B2

公开(公告)日：2016-04-26

申请号：US13342535

申请日：2012-01-03

申请人： Hiromitsu Maruyama ,  Noboru Sakuma ,  Yasumasa Morishima ,  Shinichi Ishiwata

发明人： Hiromitsu Maruyama ,  Noboru Sakuma ,  Yasumasa Morishima ,  Shinichi Ishiwata

IPC分类号： C09J7/02 ,  H01L21/67 ,  H01L21/683

CPC分类号： H01L21/67132 ,  C09J7/20 ,  C09J7/40 ,  C09J2203/326 ,  H01L21/6836 ,  H01L2221/68327 ,  Y10T428/1467 ,  Y10T428/28 ,  Y10T428/2878

摘要： A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.