摘要:
A process for producing a circuit board includes the steps of detachably laminating a metal foil layer on a surface of a supporting substrate; forming a laminate on the metal foil layer by a buildup method, the laminate including interconnection patterns with insulating layers provided therebetween, the interconnection patterns being electrically connected to each other; separating the metal foil layer from the supporting substrate to detach the laminate; and etching the metal foil layer by photolithography so as to form a predetermined interconnection pattern.
摘要:
A process for producing a circuit board includes the steps of etching the third metal layer of a three-layer metal laminate into a predetermined interconnection pattern by photolithography; forming a laminate on the interconnection pattern by a buildup method, the laminate including interconnection patterns with insulating layers provided therebetween, the interconnection patterns being electrically connected to each other; separating a first metal layer from a supporting substrate to detach the laminate; removing the first metal layer of the three-layer metal laminate by etching using a second metal layer as a barrier layer; and removing the exposed second metal layer by etching.
摘要:
A process for producing a circuit board includes the steps of etching the third metal layer of a three-layer metal laminate into a predetermined interconnection pattern by photolithography; forming a laminate on the interconnection pattern by a buildup method, the laminate including interconnection patterns with insulating layers provided therebetween, the interconnection patterns being electrically connected to each other; separating a first metal layer from a supporting substrate to detach the laminate; removing the first metal layer of the three-layer metal laminate by etching using a second metal layer as a barrier layer; and removing the exposed second metal layer by etching.
摘要:
A printed wiring board is formed by performing cutting in a rectangular region having sides which are oblique to sides of a rectangular sheet material from the rectangular sheet material formed from glass cloth fibers. In the printed wiring board, at least one corner is cut out in a state in which the one corner extends off a cuttable region of the rectangular sheet material.
摘要:
A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.
摘要:
A coupon board is cut out together with a printed wiring board from a sheet material in which a solder resist film is formed on a surface of a glass cloth fiber. The coupon board is for evaluating characteristics of the printed wiring board. The coupon board includes a region on which the solder resist film is not formed, and which extends parallel with one side of the printed wiring board.
摘要:
The intensity of signals in optical networks can be controlled using a variable optical attenuator (VOA). The present invention is a VOA that is particularly well suited for optical networks, for example to provide channel-by-channel normalization of gain control of wavelength division multiplexed signals. The inventive VOA includes a waveguide having a cladding that includes an electro-optical material and electrodes that produce an electric field within the electro-optical material when a voltage difference is applied to the electrodes. The VOA also includes a layer that is parallel to the core of the waveguide and that optically couples to the core to receive light from the attenuated signal. A power meter receives light from the layer as an indication of the amount of light attenuated from the signal and for controlling the voltage to the electrodes.
摘要:
A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.
摘要:
It is an object of the present invention to enhance laser beam transmitting efficiency by accurately controlling an interval between a light emitting (light receiving) element (20) and an optical wave-guide substrate (1) without causing any fluctuation in the interval in a mounting structure of the light transmitting element in which the light emitting (light receiving) element (20) is mounted on the optical wave-guide substrate (1). When the light emitting (light receiving) element is joined to the sub-mount chip (4) and when the sub-mount chip (4) is joined to the optical wave-guide while the element is being directed to the substrate side, the sub-mount chip and the optical wave-guide substrate are joined to each other by the solder bump (6). A post (5) is arranged for regulating an interval between the light emitting (light receiving) element and the optical wave-guide substrate.
摘要:
A coupon board is cut out together with a printed wiring board from a sheet material in which a solder resist film is formed on a surface of a glass cloth fiber. The coupon board is for evaluating characteristics of the printed wiring board. The coupon board includes a region on which the solder resist film is not formed, and which extends parallel with one side of the printed wiring board.