利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

5 条记录 (耗时 0.039 秒)

    Thin film forming apparatus using laser
    3.
    发明授权
    Thin film forming apparatus using laser 失效
    使用激光的薄膜成形装置

    公开(公告)号：US5622567A

    公开(公告)日：1997-04-22

    申请号：US158844

    申请日：1993-11-29

    申请人： Kazuyoshi Kojima ,  Tetsuya Takami ,  Kenichi Kuroda ,  Toshiyuki Oishi ,  Yukihiko Wada ,  Akihiko Furukawa

    发明人： Kazuyoshi Kojima ,  Tetsuya Takami ,  Kenichi Kuroda ,  Toshiyuki Oishi ,  Yukihiko Wada ,  Akihiko Furukawa

    IPC分类号： C23C14/02 ,  C23C14/08 ,  C23C14/22 ,  C23C14/28 ,  C23C14/34 ,  C23C14/54 ,  C23C14/56 ,  C23C14/00

    CPC分类号： C23C14/087 ,  C23C14/022 ,  C23C14/22 ,  C23C14/28 ,  C23C14/3471 ,  C23C14/54 ,  C23C14/541 ,  C23C14/547 ,  C23C14/564 ,  Y10S505/732

    摘要： A thin film forming apparatus using laser includes a chamber (1), a target (5) placed therein, a laser light source (10) for emitting laser beam to target (5), and a substrate holder (3). When target (5) is irradiated with laser beam (16), a plume (15) is generated, and materials included in plume (15) are deposited on the surface of a substrate (2) held by substrate holder (3). The laser beam emitted from laser light source (10) has its cross section shaped to a desired shape when passed through a shielding plate (4804), for example, so that the surface of the target (5) is irradiated with the beam having uniform light intensity distribution. Therefore, a plume (15) having uniform density distribution of active particles is generated, and therefore a thin film of high quality can be formed over a wide area with uniform film quality, without damaging the substrate.

    摘要翻译： 使用激光的薄膜形成装置包括：室（1），放置在其中的靶（5），用于将目标物（5）发射激光的激光源（10）和基板保持器（3）。 当用激光束（16）照射靶（5）时，产生羽流（15），并且包含在羽流（15）中的材料沉积在由基板保持器（3）保持的基板（2）的表面上。 从激光光源（10）发射的激光束的横截面通过遮蔽板（4804）时成形为期望的形状，使得靶（5）的表面被均匀地照射 光强分布。 因此，产生具有均匀的活性粒子密度分布的羽流（15），因此可以在不损害基板的情况下，在宽的区域上形成具有均匀膜质量的高质量的薄膜。

    Method of making printed circuit board
    4.
    发明授权
    Method of making printed circuit board 失效
    制作印刷电路板的方法

    公开(公告)号：US4268614A

    公开(公告)日：1981-05-19

    申请号：US967388

    申请日：1978-12-07

    申请人： Tamotsu Ueyama ,  Yukihiko Wada ,  Masaji Homma ,  Hitoshi Aisawa ,  Takayoshi Komatsu ,  Tatsuhisa Shibata ,  Hiroharu Kamiyama

    发明人： Tamotsu Ueyama ,  Yukihiko Wada ,  Masaji Homma ,  Hitoshi Aisawa ,  Takayoshi Komatsu ,  Tatsuhisa Shibata ,  Hiroharu Kamiyama

    IPC分类号： H05K3/18 ,  H05K3/42 ,  G03C5/00

    CPC分类号： H05K3/184 ,  H05K3/42 ,  H05K3/428 ,  H05K2203/025 ,  H05K2203/0565 ,  H05K2203/0574 ,  H05K2203/1383

    摘要： A novel circuit board in which circuit portions including pad portions, through-hole portions and conductors are formed, at least at the pad portions and the through-hole portions of the circuit, in the vacant portions defined by a cured photopolymeric resin composition and the vacant portions are plated with electroless copper. When only the pad portions and through-hole portions are plated with electroless copper, the conductors are all covered with the resin composition, thereby enabling fears of mechanical and chemical damages to be eliminated. When all the circuit portions are plated with electroless copper, the amount of copper required can be considerably reduced.Such circuit board is prepared by applying onto a laminate with or without copper clad thereon a specific photopolymerizable resin composition, irradiating the resin composition-applied laminate with ultraviolet rays through a pattern mask, treating the thus irradiated laminate with a solvent to remove the unexposed portions of resin composition and applying an electroless copper plating to the unexposed portions. A durable and reliable printed circuit board having a high pecision and high density circuit pattern can be provided very simply, easily at low cost.

    摘要翻译： 一种新颖的电路板，其中，在由固化的光聚合树脂组合物限定的空位部分中至少在电路的焊盘部分和通孔部分处形成包括焊盘部分，通孔部分和导体的电路部分， 空位部分镀有化学镀铜。 当只有焊盘部分和通孔部分镀有无电镀铜时，导体都被树脂组合物覆盖，从而可以消除机械和化学损坏的恐惧。 当所有电路部分都镀有化学镀铜时，所需的铜的量可以大大降低。 通过在具有或不具有铜的层压板上涂布特定的光聚合性树脂组合物，通过图案掩模对紫外线照射树脂组合物施加的层压体，用溶剂处理这样照射的层压体以除去未曝光部分来制备这种电路板 的树脂组合物，并对未曝光部分施加化学镀铜。 可以非常简单，容易地以低成本提供具有高精度和高密度电路图案的耐用且可靠的印刷电路板。