公开(公告)号：US6110291A

公开(公告)日：2000-08-29

申请号：US689313

申请日：1996-08-07

申请人： Kenyu Haruta ,  Koichi Ono ,  Hitoshi Wakata ,  Mutsumi Tsuda ,  Yoshio Saito ,  Keisuke Nanba ,  Kazuyoshi Kojima ,  Tetsuya Takami ,  Akihiro Suzuki ,  Tomohiro Sasagawa ,  Kenichi Kuroda ,  Toshiyuki Oishi ,  Yukihiko Wada ,  Akihiko Furukawa ,  Yasuji Matsui ,  Akimasa Yuki ,  Takaaki Kawahara ,  Hideki Yabe ,  Taisuke Furukawa ,  Kouji Kise ,  Noboru Mikami ,  Tsuyoshi Horikawa ,  Tetsuo Makita ,  Kazuo Kuramoto ,  Naohiko Fujino ,  Hiroshi Kuroki ,  Tetsuo Ogama ,  Junji Tanimura

发明人： Kenyu Haruta ,  Koichi Ono ,  Hitoshi Wakata ,  Mutsumi Tsuda ,  Yoshio Saito ,  Keisuke Nanba ,  Kazuyoshi Kojima ,  Tetsuya Takami ,  Akihiro Suzuki ,  Tomohiro Sasagawa ,  Kenichi Kuroda ,  Toshiyuki Oishi ,  Yukihiko Wada ,  Akihiko Furukawa ,  Yasuji Matsui ,  Akimasa Yuki ,  Takaaki Kawahara ,  Hideki Yabe ,  Taisuke Furukawa ,  Kouji Kise ,  Noboru Mikami ,  Tsuyoshi Horikawa ,  Tetsuo Makita ,  Kazuo Kuramoto ,  Naohiko Fujino ,  Hiroshi Kuroki ,  Tetsuo Ogama ,  Junji Tanimura

IPC分类号： C23C14/02 ,  C23C14/08 ,  C23C14/22 ,  C23C14/28 ,  C23C14/34 ,  C23C14/54 ,  C23C14/56 ,  C23C14/00

CPC分类号： C23C14/087 ,  C23C14/022 ,  C23C14/22 ,  C23C14/28 ,  C23C14/3471 ,  C23C14/54 ,  C23C14/541 ,  C23C14/547 ,  C23C14/564 ,  Y10S505/732

摘要： A thin film forming apparatus using laser includes a chamber (1), a target (5) placed therein, a laser light source (10) for emitting laser beam to target (5), and a substrate holder (3). When target (5) is irradiated with laser beam (16), a plume (15) is generated, and materials included in plume (15) are deposited on the surface of a substrate (2) held by substrate holder (3). The laser beam emitted from laser light source (10) has its cross section shaped to a desired shape when passed through a shielding plate (4804), for example, so that the surface of the target (5) is irradiated with the beam having uniform light intensity distribution. Therefore, a plume (15) having uniform density distribution of active particles is generated, and therefore a thin film of high quality can be formed over a wide area with uniform film quality, without damaging the substrate.

公开(公告)号：US6033741A

公开(公告)日：2000-03-07

申请号：US693719

申请日：1996-08-07

申请人： Kenyu Haruta ,  Koichi Ono ,  Hitoshi Wakata ,  Yoshio Saito ,  Kazuyoshi Kojima ,  Tetsuya Takami ,  Akihiro Suzuki ,  Yukihiko Wada

发明人： Kenyu Haruta ,  Koichi Ono ,  Hitoshi Wakata ,  Yoshio Saito ,  Kazuyoshi Kojima ,  Tetsuya Takami ,  Akihiro Suzuki ,  Yukihiko Wada

IPC分类号： C23C14/02 ,  C23C14/08 ,  C23C14/22 ,  C23C14/28 ,  C23C14/34 ,  C23C14/54 ,  C23C14/56 ,  C23C14/00

CPC分类号： C23C14/087 ,  C23C14/022 ,  C23C14/22 ,  C23C14/28 ,  C23C14/3471 ,  C23C14/54 ,  C23C14/541 ,  C23C14/547 ,  C23C14/564 ,  Y10S505/732

摘要： A thin film forming apparatus using laser includes a chamber (1), a target (5) placed therein, a laser light source (10) for emitting laser beam to target (5), and a substrate holder (3). When target (5) is irradiated with laser beam (16), a plume (15) is generated, and materials included in plume (15) are deposited on the surface of a substrate (2) held by substrate holder (3). The laser beam emitted from laser light source (10) has its cross section shaped to a desired shape when passed through a shielding plate (4804), for example, so that the surface of the target (5) is irradiated with the beam having uniform light intensity distribution. Therefore, a plume (15) having uniform density distribution of active particles is generated, and therefore a thin film of high quality can be formed over a wide area with uniform film quality, without damaging the substrate.

摘要翻译： 使用激光的薄膜形成装置包括：室（1），放置在其中的靶（5），用于将目标物（5）发射激光的激光源（10）和基板保持器（3）。 当用激光束（16）照射靶（5）时，产生羽流（15），并且包含在羽流（15）中的材料沉积在由基板保持器（3）保持的基板（2）的表面上。 从激光光源（10）发射的激光束的横截面通过遮蔽板（4804）时成形为期望的形状，使得靶（5）的表面被均匀地照射 光强分布。 因此，产生具有均匀的活性粒子密度分布的羽流（15），因此可以在不损害基板的情况下，在宽的区域上形成具有均匀膜质量的高质量的薄膜。

公开(公告)号：US5622567A

公开(公告)日：1997-04-22

申请号：US158844

申请日：1993-11-29

申请人： Kazuyoshi Kojima ,  Tetsuya Takami ,  Kenichi Kuroda ,  Toshiyuki Oishi ,  Yukihiko Wada ,  Akihiko Furukawa

发明人： Kazuyoshi Kojima ,  Tetsuya Takami ,  Kenichi Kuroda ,  Toshiyuki Oishi ,  Yukihiko Wada ,  Akihiko Furukawa

IPC分类号： C23C14/02 ,  C23C14/08 ,  C23C14/22 ,  C23C14/28 ,  C23C14/34 ,  C23C14/54 ,  C23C14/56 ,  C23C14/00

CPC分类号： C23C14/087 ,  C23C14/022 ,  C23C14/22 ,  C23C14/28 ,  C23C14/3471 ,  C23C14/54 ,  C23C14/541 ,  C23C14/547 ,  C23C14/564 ,  Y10S505/732

摘要： A thin film forming apparatus using laser includes a chamber (1), a target (5) placed therein, a laser light source (10) for emitting laser beam to target (5), and a substrate holder (3). When target (5) is irradiated with laser beam (16), a plume (15) is generated, and materials included in plume (15) are deposited on the surface of a substrate (2) held by substrate holder (3). The laser beam emitted from laser light source (10) has its cross section shaped to a desired shape when passed through a shielding plate (4804), for example, so that the surface of the target (5) is irradiated with the beam having uniform light intensity distribution. Therefore, a plume (15) having uniform density distribution of active particles is generated, and therefore a thin film of high quality can be formed over a wide area with uniform film quality, without damaging the substrate.

摘要翻译： 使用激光的薄膜形成装置包括：室（1），放置在其中的靶（5），用于将目标物（5）发射激光的激光源（10）和基板保持器（3）。 当用激光束（16）照射靶（5）时，产生羽流（15），并且包含在羽流（15）中的材料沉积在由基板保持器（3）保持的基板（2）的表面上。 从激光光源（10）发射的激光束的横截面通过遮蔽板（4804）时成形为期望的形状，使得靶（5）的表面被均匀地照射 光强分布。 因此，产生具有均匀的活性粒子密度分布的羽流（15），因此可以在不损害基板的情况下，在宽的区域上形成具有均匀膜质量的高质量的薄膜。

公开(公告)号：US08273457B2

公开(公告)日：2012-09-25

申请号：US13166570

申请日：2011-06-22

申请人： Itsuo Watanabe ,  Kenzo Takemura ,  Akira Nagai ,  Kazuhiro Isaka ,  Osamu Watanabe ,  Kazuyoshi Kojima

发明人： Itsuo Watanabe ,  Kenzo Takemura ,  Akira Nagai ,  Kazuhiro Isaka ,  Osamu Watanabe ,  Kazuyoshi Kojima

IPC分类号： B32B27/38

CPC分类号： H01L24/83 ,  C09J9/02 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0271 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0379 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T156/10 ,  Y10T156/109 ,  Y10T428/24942 ,  Y10T428/24959 ,  Y10T428/2852 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31855 ,  H01L2924/00

摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

公开(公告)号：US08043709B2

公开(公告)日：2011-10-25

申请号：US10541380

申请日：2004-06-24

申请人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

发明人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

IPC分类号： H01R11/01 ,  H01B1/22 ,  H01L21/60 ,  H05K1/14 ,  H05K3/36 ,  C09J9/02

CPC分类号： H01L24/83 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/3452 ,  H05K2203/0594 ,  Y10T156/10 ,  Y10T428/2495 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05552

摘要： The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

摘要翻译： 本发明是一种电路连接材料，用于将电路和绝缘层彼此相邻形成的电路部件的相互连接在基板的表面上，以及电路部件，其中电极和绝缘层邻近形成 彼此在板的表面上，边缘部分和绝缘层基于主表面形成比电极更大的厚度，其中该电路连接材料包含粘合剂组合物和具有 平均粒径为1μm以上且小于10μm，硬度为1.961〜6.865GPa，该电路连接材料在40℃下的储能弹性模量为0.5〜3GPa，平均热膨胀系数 当进行固化处理时，在25℃至100℃下为30-200ppm /℃。

公开(公告)号：US20110247873A1

公开(公告)日：2011-10-13

申请号：US13166570

申请日：2011-06-22

申请人： Itsuo WATANABE ,  Kenzo Takemura ,  Akira Nagai ,  Kazuhiro Isaka ,  Osamu Watanabe ,  Kazuyoshi Kojima

发明人： Itsuo WATANABE ,  Kenzo Takemura ,  Akira Nagai ,  Kazuhiro Isaka ,  Osamu Watanabe ,  Kazuyoshi Kojima

IPC分类号： H05K1/11 ,  H05K13/04 ,  B32B37/14 ,  B32B37/10 ,  B32B37/12

CPC分类号： H01L24/83 ,  C09J9/02 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0271 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0379 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T156/10 ,  Y10T156/109 ,  Y10T428/24942 ,  Y10T428/24959 ,  Y10T428/2852 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31855 ,  H01L2924/00

摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

公开(公告)号：US20100263208A1

公开(公告)日：2010-10-21

申请号：US12740801

申请日：2008-02-06

申请人： Motohiro Arifuku ,  Kazuyoshi Kojima ,  Kouji Kobayashi

发明人： Motohiro Arifuku ,  Kazuyoshi Kojima ,  Kouji Kobayashi

IPC分类号： H05K3/36

CPC分类号： H05K3/361 ,  H05K3/28 ,  H05K3/323 ,  H05K2201/0191 ,  H05K2203/0594 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： The invention provides a circuit connecting method that can satisfactorily reduce connection resistance between circuit electrodes electrically connected via an anisotropic conductive film for circuit connection.The circuit connecting method comprises a step of preparing a circuit member 12 having circuit electrodes 12b formed on a glass substrate 12a, a step of preparing a flexible wiring board 14 having circuit electrodes 14b formed on a base 14a and provided with a solder resist 18 at the sections of the circuit electrodes 14b other than the sections that are connected to the circuit electrodes 12b, and a step of bonding the circuit member 12 to the flexible wiring board 14 via an anisotropic conductive film for circuit connection 16 so that part of the anisotropic conductive film for circuit connection 16 overlaps with part of the solder resist 18. The thickness h3 of the anisotropic conductive film for circuit connection 16 is no greater than the total of the height h1 of the circuit electrodes 12b and the height h2 of the circuit electrodes 14b.

摘要翻译： 本发明提供一种电路连接方法，其可以令人满意地减小经由用于电路连接的各向异性导电膜电连接的电路电极之间的连接电阻。 电路连接方法包括制备具有形成在玻璃基板12a上的电路电极12b的电路部件12的步骤，制备柔性布线基板14的步骤，该柔性布线基板14具有形成在基座14a上的电路电极14b，并设置有阻焊剂18 除了连接到电路电极12b的部分之外的电路电极14b的部分，以及通过用于电路连接16的各向异性导电膜将电路部件12接合到柔性布线板14的步骤，使得部分各向异性 用于电路连接的导电膜16与阻焊剂18的一部分重叠。用于电路连接16的各向异性导电膜的厚度h3不大于电路电极12b的高度h1和电路电极的高度h2的总和 14b。

公开(公告)号：US20100025097A1

公开(公告)日：2010-02-04

申请号：US12447543

申请日：2007-10-30

申请人： Kazuyoshi Kojima ,  Kouji Kobayashi ,  Motohiro Arifuku ,  Nichiomi Mochizuki

发明人： Kazuyoshi Kojima ,  Kouji Kobayashi ,  Motohiro Arifuku ,  Nichiomi Mochizuki

IPC分类号： H05K1/14

CPC分类号： H01B1/22 ,  C08K7/16 ,  C08K9/02 ,  C09J9/02 ,  C09J11/02 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0221 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： There is provided a circuit connection structure that can provide satisfactory electrical connection between opposing circuit electrodes and that can sufficiently increase the long-term reliability of electrical characteristics between circuit electrodes. A circuit connection structure 1 comprising a first circuit member 30 having a first circuit electrode 32 formed on the main side 31a of a first circuit board 31, a second circuit member 40 situated opposing the first circuit member 30 and having a second circuit electrode 42 formed on the main side 41a of a second circuit board 41, and a circuit-connecting member 10 provided between the main side of the first circuit member 30 and the main side of the second circuit member 40 and electrically connecting the first and second circuit electrodes 32, 42, characterized in that the thickness of the first and second circuit electrodes 32, 42 is at least 50 nm, the circuit-connecting member 10 is obtained by curing a circuit-connecting material containing an adhesive composition and conductive particles 12 having multiple protrusions 14 on the surface side, and the outermost layer of the conductive particles 12 is composed of nickel or a nickel alloy.

摘要翻译： 提供了一种电路连接结构，其可以在相对的电路电极之间提供令人满意的电连接，并且可以充分增加电路电极之间的电特性的长期可靠性。 电路连接结构1包括第一电路构件30，第一电路构件30具有形成在第一电路板31的主侧31a上的第一电路电极32，与第一电路构件30相对的第二电路构件40，并且形成有第二电路电极42 在第二电路基板41的主面41a和设置在第一电路部件30的主面与第二电路部件40的主面之间并电连接第一和第二电路电极32的电路连接部件10 42，其特征在于，第一和第二电路电极32,42的厚度为至少50nm，电路连接部件10通过固化含有粘合剂组合物的电路连接材料和具有多个突起的导电粒子12而获得 14，导电粒子12的最外层由镍或镍合金构成。

公开(公告)号：US08132319B2

公开(公告)日：2012-03-13

申请号：US12740801

申请日：2008-02-06

申请人： Motohiro Arifuku ,  Kazuyoshi Kojima ,  Kouji Kobayashi

发明人： Motohiro Arifuku ,  Kazuyoshi Kojima ,  Kouji Kobayashi

IPC分类号： H05K3/30

CPC分类号： H05K3/361 ,  H05K3/28 ,  H05K3/323 ,  H05K2201/0191 ,  H05K2203/0594 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： The invention provides a circuit connecting method that can satisfactorily reduce connection resistance between circuit electrodes electrically connected via an anisotropic conductive film for circuit connection.The circuit connecting method comprises a step of preparing a circuit member 12 having circuit electrodes 12b formed on a glass substrate 12a, a step of preparing a flexible wiring board 14 having circuit electrodes 14b formed on a base 14a and provided with a solder resist 18 at the sections of the circuit electrodes 14b other than the sections that are connected to the circuit electrodes 12b, and a step of bonding the circuit member 12 to the flexible wiring board 14 via an anisotropic conductive film for circuit connection 16 so that part of the anisotropic conductive film for circuit connection 16 overlaps with part of the solder resist 18. The thickness h3 of the anisotropic conductive film for circuit connection 16 is no greater than the total of the height h1 of the circuit electrodes 12b and the height h2 of the circuit electrodes 14b.

摘要翻译： 本发明提供一种电路连接方法，其可以令人满意地减小经由用于电路连接的各向异性导电膜电连接的电路电极之间的连接电阻。 电路连接方法包括制备具有形成在玻璃基板12a上的电路电极12b的电路部件12的步骤，制备柔性布线基板14的步骤，该柔性布线基板14具有形成在基座14a上的电路电极14b，并设置有阻焊剂18 除了连接到电路电极12b的部分之外的电路电极14b的部分，以及通过用于电路连接16的各向异性导电膜将电路部件12接合到柔性布线板14的步骤，使得部分各向异性 用于电路连接的导电膜16与阻焊剂18的一部分重叠。用于电路连接16的各向异性导电膜的厚度h3不大于电路电极12b的高度h1和电路电极的高度h2的总和 14b。

公开(公告)号：US20110247757A1

公开(公告)日：2011-10-13

申请号：US13163442

申请日：2011-06-17

申请人： Motohiro ARIFUKU ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

发明人： Motohiro ARIFUKU ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

IPC分类号： H05K13/04 ,  B32B37/06 ,  B32B37/12 ,  B32B37/14 ,  B32B37/02 ,  B32B37/10 ,  B82Y99/00 ,  B82Y30/00

CPC分类号： H01L24/83 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/3452 ,  H05K2203/0594 ,  Y10T156/10 ,  Y10T428/2495 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05552

摘要： The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

摘要翻译： 本发明是一种电路连接材料，用于将电路和绝缘层彼此相邻形成的电路部件的相互连接在基板的表面上，以及电路部件，其中电极和绝缘层邻近形成 彼此在板的表面上，边缘部分和绝缘层基于主表面形成比电极更大的厚度，其中该电路连接材料包含粘合剂组合物和具有 平均粒径为1μm以上且小于10μm，硬度为1.961〜6.865GPa，该电路连接材料在40℃下的储能弹性模量为0.5〜3GPa，平均热膨胀系数 当进行固化处理时，在25℃至100℃下为30-200ppm /℃。