Thin film forming apparatus using laser
    2.
    发明授权
    Thin film forming apparatus using laser 失效
    使用激光的薄膜成形装置

    公开(公告)号:US5622567A

    公开(公告)日:1997-04-22

    申请号:US158844

    申请日:1993-11-29

    摘要: A thin film forming apparatus using laser includes a chamber (1), a target (5) placed therein, a laser light source (10) for emitting laser beam to target (5), and a substrate holder (3). When target (5) is irradiated with laser beam (16), a plume (15) is generated, and materials included in plume (15) are deposited on the surface of a substrate (2) held by substrate holder (3). The laser beam emitted from laser light source (10) has its cross section shaped to a desired shape when passed through a shielding plate (4804), for example, so that the surface of the target (5) is irradiated with the beam having uniform light intensity distribution. Therefore, a plume (15) having uniform density distribution of active particles is generated, and therefore a thin film of high quality can be formed over a wide area with uniform film quality, without damaging the substrate.

    摘要翻译: 使用激光的薄膜形成装置包括:室(1),放置在其中的靶(5),用于将目标物(5)发射激光的激光源(10)和基板保持器(3)。 当用激光束(16)照射靶(5)时,产生羽流(15),并且包含在羽流(15)中的材料沉积在由基板保持器(3)保持的基板(2)的表面上。 从激光光源(10)发射的激光束的横截面通过遮蔽板(4804)时成形为期望的形状,使得靶(5)的表面被均匀地照射 光强分布。 因此,产生具有均匀的活性粒子密度分布的羽流(15),因此可以在不损害基板的情况下,在宽的区域上形成具有均匀膜质量的高质量的薄膜。

    SEMICONDUCTOR DEVICE
    6.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20140203393A1

    公开(公告)日:2014-07-24

    申请号:US14239375

    申请日:2012-07-31

    IPC分类号: H01L29/872

    摘要: A semiconductor device having high breakdown voltage and high reliability without forming an embedded injection layer with high position accuracy. The semiconductor device includes a base as an active area of a second conductivity type formed on a surface layer of a semiconductor layer of a first conductivity type to constitute a semiconductor element; guard rings as a plurality of first impurity regions of the second conductivity type formed on the surface layer of the semiconductor layer spaced apart from each other to respectively surround the base in plan view; and an embedded injection layer as a second impurity region of the second conductivity type embedded in the surface layer of the semiconductor layer to connect at least two bottom portions of the plurality of guard rings.

    摘要翻译: 具有高击穿电压和高可靠性的半导体器件,而不形成具有高定位精度的嵌入式注入层。 半导体器件包括形成在第一导电类型的半导体层的表面层上的第二导电类型的有源区的基底,以构成半导体元件; 保护环作为多个第一导电类型的第一杂质区域,形成在半导体层的表面层上彼此间隔开以在平面图中分别包围基底; 以及作为第二导电类型的第二杂质区域的嵌入式注入层,其嵌入在半导体层的表面层中,以连接多个保护环的至少两个底部。

    SEMICONDUCTOR DEVICE
    8.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20130153900A1

    公开(公告)日:2013-06-20

    申请号:US13818993

    申请日:2011-08-26

    IPC分类号: H01L23/34

    摘要: A semiconductor device capable of rapidly and accurately sensing the information regarding the temperature of a semiconductor transistor contained therein. A MOSFET includes a plurality of cells, and includes a main cell group including a cell for supplying a current to a load among the plurality of cells, and a sense cell group including a cell for sensing temperature information regarding the temperature of the MOSFET thereamong. The main cell group and the sense cell group have different temperature characteristics showing changes in electrical characteristics to changes in temperature. A temperature sensing circuit senses the temperature of the MOSFET based on, for example, a value of a main current flowing through the main cell group and a value of a sense current flowing through the sense cell group.

    摘要翻译: 一种半导体器件,其能够快速且准确地感测关于其中包含的半导体晶体管的温度的信息。 MOSFET包括多个单元,并且包括主单元组,其包括用于向多个单元之间的负载提供电流的单元,以及包括用于感测关于MOSFET的温度的温度信息的单元的感测单元组。 主电池组和感应电池组具有不同的温度特性,显示电特性随温度变化的变化。 温度检测电路基于例如流过主单元组的主电流的值和流过感测单元组的感测电流的值来感测MOSFET的温度。