摘要:
A memory subsystem package has a memory controller interface ASIC (application specific integrated circuit) and a plurality of Memory modules. The ASIC has a bi-directional serial protocol i2C communication bus to off chip drivers for monitoring temperature and for adjusting the environment surrounding the package by controlling fans using fan switches and variable voltage controls. In addition there is provided an Alternating Current Built in Self Test (AC BIST) with variable data receiver voltage reference for performing high-speed AC memory subsystem self-test for that ASIC enabling writing of pseudo-random patterns to memory, reading them back and comparing the expected results at hardware speeds. Vref can be made to vary across its allowable range during AC self test to provide improved coverage. The system monitors Vddq during normal system operation using an ADC. The system varies Vref as a function of Vddq, using a combination of a DAC and ADC. The system varies Vref as a function of Vddq, such that Vref=1/m*Vddq+OFFSET, where m can be 1, 2, 4, or 8, and where OFFSET can be positive or negative ranging from 1/n * Vddq to n−1/n*Vddq, where n is the voltage granularity of the DAC.
摘要翻译:存储器子系统包具有存储器控制器接口ASIC(专用集成电路)和多个存储器模块。 ASIC具有双向串行协议i2C通信总线到芯片外驱动器,用于监控温度,并通过使用风扇开关和可变电压控制控制风扇来调节封装周围的环境。 此外,还提供了具有可变数据接收器电压参考的内置自测(AC BIST)的交流电,用于为该ASIC执行高速AC存储器子系统自检,使得能够将伪随机模式写入存储器,读取它们, 在硬件速度下比较预期结果。 在AC自检期间,可以使Vref在其允许范围内变化,以提供更好的覆盖。 系统使用ADC在系统正常运行期间监视Vddq。 该系统使用DAC和ADC的组合,将Vdd变为Vddq的函数。 该系统将Vref作为Vddq的函数,使得Vref = 1 / m * Vddq + OFFSET,其中m可以是1,2,4或8,并且其中OFFSET可以是正或负范围从1 / n * Vddq 到n-1 / n * Vddq,其中n是DAC的电压粒度。
摘要:
A system and method for providing SDRAM mode register shadowing in a memory system. A system includes a memory interface device adapted for use in a memory system. The memory interface device includes an interface to one or more ranks of memory devices, and each memory device includes one or more types of mode registers. The memory interface device also includes an interface to a memory bus for receiving commands from a memory controller. The commands include a mode register set command specifying a new mode register setting for one or more ranks of memory devices and a mode register type. The memory interface device further includes a mode register shadow module to capture settings applied to the mode registers. The module includes a shadow register for each type of mode register and a shadow log for each type of mode register. The module also includes mode register shadow logic to detect a mode register set command, to store the new mode register setting in the shadow register corresponding to the specified mode register type, and to set one or more bits in the shadow log corresponding to the specified mode register type to indicate which of the ranks of memory devices have been programmed with the new mode register setting.
摘要:
A synchronous input to output protocol translator supporting multiple reference oscillator frequencies and fixed latency data computation and chip crossing circuits enables implementation of a method for delaying osc2 relative to osc1 in a configurable way to provide a constant, minimal Tptcc over a range of refosc frequencies between circuits for data transferred. It requires that the data transferred from a register R1 be sent over multiple wires via configurable delay circuitry for osc2, capture circuitry at the input to R2, and a circuit to transfer a synchronizing signal from a non-delayed clock domain to a delayed clock domain. Relative to osc1, osc2 is a delayed, synchronous clock.
摘要:
A memory subsystem package has a memory controller interface ASIC (application specific integrated circuit) and a plurality of memory modules. The ASIC has a bi-directional serial protocol i2C communication bus to off chip drivers for monitoring temperature and for adjusting the environment surrounding the package by controlling fans using fan switches and variable voltage controls. In addition there is provided an Alternating Current Built in Self Test (AC BIST) with variable data receiver voltage reference for performing high-speed AC memory subsystem self-test for that ASIC enabling writing of pseudo-random patterns to memory, reading them back and comparing the expected results at hardware speeds. Vref can be made to vary across its allowable range during AC self test to provide improved coverage. The system monitors Vddq during normal system operation using an ADC. The system varies Vref as a function of Vddq, using a combination of a DAC and ADC. The system varies Vref as a function of Vddq, such that Vref=1/m*Vddq+OFFSET, where m can be 1, 2, 4, or 8, and where OFFSET can be positive or negative ranging from 1/n*Vddq to n−1/n*Vddq, where n is the voltage granularity of the DAC.
摘要:
A memory subsystem package has a memory controller interface ASIC (application specific integrated circuit) and a plurality of memory modules. The ASIC has a bi-directional serial protocol i2C communication bus to off chip drivers for monitoring temperature and for adjusting the environment surrounding the package by controlling fans using fan switches and variable voltage controls. In addition there is provided an Alternating Current Built in Self Test (AC BIST) with variable data receiver voltage reference for performing high-speed AC memory subsystem self-test for that ASIC enabling writing of pseudo-random patterns to memory, reading them back and comparing the expected results at hardware speeds. Vref can be made to vary across its allowable range during AC self test to provide improved coverage. The system monitors vddq during normal system operation using an ADC. The system varies Vref as a function of Vddq, using a combination of a DAC and ADC. The system varies Vref as a function of Vddq, such that Vref=1/m*Vddq+OFFSET, where m can be 1, 2, 4, or 8, and where OFFSET can be positive or negative ranging from 1/n*Vddq to n−1/n*Vddq, where n is the voltage granularity of the DAC.
摘要翻译:存储器子系统包具有存储器控制器接口ASIC(专用集成电路)和多个存储器模块。 ASIC具有双向串行协议i2C通信总线到芯片外驱动器,用于监控温度,并通过使用风扇开关和可变电压控制控制风扇来调节封装周围的环境。 此外,还提供了具有可变数据接收器电压参考的内置自测(AC BIST)的交流电,用于为该ASIC执行高速AC存储器子系统自检,使得能够将伪随机模式写入存储器,读取它们, 在硬件速度下比较预期结果。 在AC自检期间,可以使Vref在其允许范围内变化,以提供更好的覆盖。 系统在使用ADC的正常系统操作期间监视vddq。 该系统使用DAC和ADC的组合,将Vdd变为Vddq的函数。 该系统将Vref作为Vddq的函数,使得Vref = 1 / m * Vddq + OFFSET,其中m可以是1,2,4或8,并且其中OFFSET可以是正或负范围从1 / n * Vddq 到n-1 / n * Vddq,其中n是DAC的电压粒度。
摘要:
A memory subsystem package has a memory controller interface ASIC (application specific integrated circuit) and a plurality of memory modules. The ASIC has a bi-directional serial protocol i2C communication bus to off chip drivers for monitoring temperature and for adjusting the environment surrounding the package by controlling fans using fan switches and variable voltage controls. In addition there is provided an Alternating Current Built in Self Test (AC. BIST) with variable data receiver voltage reference for performing high-speed AC memory subsystem self-test for that ASIC enabling writing of pseudo-random patterns to memory, reading them back and comparing the expected results at hardware speeds. Vref can be made to vary across its allowable range during AC self test to provide improved coverage. The system monitors Vddq during normal system operation using an ADC. The system varies Vref as a function of Vddq, using a combination of a DAC and ADC. The system varies Vref as a function of Vddq, such that Vref=1/m*Vddq+OFFSET, where m can be 1, 2, 4, or 8, and where OFFSET can be positive or negative ranging from 1/n*Vddq to n−1/n*Vddq, where n is the voltage granularity of the DAC.
摘要翻译:存储器子系统包具有存储器控制器接口ASIC(专用集成电路)和多个存储器模块。 ASIC具有双向串行协议i2C通信总线到芯片外驱动器,用于监控温度,并通过使用风扇开关和可变电压控制控制风扇来调节封装周围的环境。 此外,还提供了具有可变数据接收器电压参考的内置自检(AC。BIST)的交流电,用于为该ASIC执行高速AC存储器子系统自检,使得能够将伪随机模式写入存储器,读取它们 并以硬件速度比较预期结果。 在AC自检期间,可以使Vref在其允许范围内变化,以提供更好的覆盖。 系统使用ADC在系统正常运行期间监视Vddq。 该系统使用DAC和ADC的组合,将Vdd变为Vddq的函数。 该系统将Vref作为Vddq的函数,使得Vref = 1 / m * Vddq + OFFSET,其中m可以是1,2,4或8,并且其中OFFSET可以是正或负范围从1 / n * Vddq 到n-1 / n * Vddq,其中n是DAC的电压粒度。
摘要:
A system and method for providing SDRAM mode register shadowing in a memory system. A system includes a memory interface device adapted for use in a memory system. The memory interface device includes an interface to one or more ranks of memory devices, and each memory device includes one or more types of mode registers. The memory interface device also includes an interface to a memory bus for receiving commands from a memory controller. The commands include a mode register set command specifying a new mode register setting for one or more ranks of memory devices and a mode register type. The memory interface device further includes a mode register shadow module to capture settings applied to the mode registers. The module includes a shadow register for each type of mode register and a shadow log for each type of mode register. The module also includes mode register shadow logic to detect a mode register set command, to store the new mode register setting in the shadow register corresponding to the specified mode register type, and to set one or more bits in the shadow log corresponding to the specified mode register type to indicate which of the ranks of memory devices have been programmed with the new mode register setting.
摘要:
A logical design including multiple logical blocks is mapped onto an integrated circuit chip. A chip level floor plan is created on the chip, including temporary areas on the chip set aside for accommodating logical blocks having logical content including timing requirements based on the logical design. The temporary areas are translated into physical cells on the chip with pins assigned for inputs and outputs for the logical blocks. The logical blocks are mapped to the physical cells on the chip in a time sensitive manner using timing assertions to form temporary logical partitions. Blocks on the chip, including the temporary logical partitions, are connected based on the timing assertions. A timing analysis is performed on the chip to determine timing slack associated with each temporary logical partition. A determination is made whether the timing slack is acceptable. If the timing slack is not acceptable, the slack is apportioned for, and apportioned slack information is fed back in the form of timing assertions. Mapping, connecting, performing a timing analysis, and apportioning for slack are repeated until the timing slack associated with each temporary logical partition is determined to be acceptable.
摘要:
A memory interface device uses a driver impedance adjustment engine with state machine for off chip driver (OCD) calibration which is used to set the driver voltage levels of the DRAM memory module or DIMM of the JEDEC DDR-II standard type. By adjusting the pull-up drive strength and pull-down drive strength, the output voltage levels and the rise times can be optimized to find the minimal signal swing that is still immune to noise, while not degrading the data eye significantly. The state machine finds the optimal setting for the DRAM Driver Impedance, using both DC and AC methods adjusting the value of the driver impedance through a master ASIC, and then sampling the known value sent back from the DRAM. The state machine will stop when the optimal value of the driver impedance is found and automates the process of detecting the optimal driver impedance and configuring the DRAM module or DIMM accordingly. The ASIC circuit and method use a data strobe, not only as strobe, but as data input during OCD calibration. Optimal driver impedance setting of a DDR-II DRAM is detected in a DC mode. Using AC-BIST the optimal driver impedance setting can be adjusted and optimized to account for AC timing influences such as coupled noise, data dependent jitter, and intersymbol interference.
摘要:
A time-division multiplex system is disclosed where the data from two sources is coupled over a multiplexer controller by a generator comprising an XOR gate and a pair of latches where the output of both latches are coupled to the XOR gate and an inverter at the input of each latch. One of the latches is gated by a master clock signal and the other latch is gated by a clocked signal skewed approximately one-half clock cycle.