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公开(公告)号：US20100122843A1
公开(公告)日：2010-05-20
申请号：US12271519
申请日：2008-11-14
CPC分类号： H01L23/49822 , H01L23/145 , H01L23/49816 , H01L23/49827 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H05K1/056 , H05K3/426 , H05K3/445 , H05K3/4608 , H05K2201/0281 , H05K2201/0323 , H05K2201/0347 , H05K2201/0959 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T428/12035 , H01L2224/0401
摘要： A circuit board has plated through holes which are laid out with a fine pitch and meets requirements relating to characteristics such as strength and thermal expansion coefficient. A method of manufacturing a circuit board includes: a step of forming a core portion by thermal compression bonding prepregs formed by disposing carbon fibers so as to produce openings at positions where plated through holes will pass through and impregnating the carbon fibers with resin; a step of forming through holes that pass inside the openings at positions of the openings in the core portion; and a step of forming a conductive layer on inner surfaces of the through holes to form plated through holes at positions that do not interfere with the carbon fibers and thereby produce a core substrate.
摘要翻译： 电路板具有以细间距布置的电镀通孔，并且满足与强度和热膨胀系数等特性有关的要求。 一种电路板的制造方法，其特征在于，包括：通过热压缩形成芯部的步骤，通过设置碳纤维形成的预浸料，以在电镀通孔穿过的位置处产生开口，并用树脂浸渍碳纤维; 在芯部的开口部的位置形成贯通孔内的通孔的工序; 以及在通孔的内表面上形成导电层的步骤，在不干扰碳纤维的位置处形成电镀通孔，从而制造芯基板。
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公开(公告)号：US20090095521A1
公开(公告)日：2009-04-16
申请号：US12272048
申请日：2008-11-17
CPC分类号： H05K1/0366 , H05K3/445 , H05K3/4641 , H05K2201/0278 , H05K2201/029 , H05K2201/0323 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A circuit board has plated through holes which are laid out with a fine pitch and meets requirements relating to characteristics such as the thermal expansion coefficient of the circuit board. A method of manufacturing a circuit board includes: a step of forming a core portion by thermal compression bonding prepregs which include first fibers that conduct electricity and second fibers that do not conduct electricity, which have the second fibers disposed at positions where plated through holes will pass through, and which are impregnated with resin; a step of forming through holes at positions in the core portion where the second fibers are disposed; and a step of forming a conductive layer on inner surfaces of the through holes to form plated through holes at positions that do not interfere with the first fibers and thereby produce a core substrate.
摘要翻译： 电路板具有以细间距布置的电镀通孔，并满足与电路板的热膨胀系数等特性相关的要求。 一种制造电路板的方法包括：通过热压接预浸料形成芯部的步骤，该预浸料包括导电的第一纤维和不导电的第二纤维，其中第二纤维布置在镀通孔的位置 通过，并用树脂浸渍; 在设置有第二纤维的芯部中的位置形成通孔的工序; 以及在通孔的内表面上形成导电层的步骤，在不干扰第一纤维的位置处形成电镀通孔，从而制造芯基板。
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公开(公告)号：US20090146112A1
公开(公告)日：2009-06-11
申请号：US12183777
申请日：2008-07-31
申请人： Kishio YOKOUCHI
发明人： Kishio YOKOUCHI
IPC分类号： H01B1/24
CPC分类号： H01B1/24 , H05K1/056 , H05K2201/0281 , H05K2201/0323 , H05K2203/0793 , H05K2203/095
摘要： The composite material, which comprises carbon materials and resin, is capable of giving original characteristics of the carbon materials, e.g., carbon fibers, in case of, for example, being used in a circuit board having a core section including carbon fibers. The composite material of the present invention comprises: the carbon materials, which are composed of graphite or materials having graphite structures; and resin. Surfaces of the carbon materials are modified. The resin and the carbon materials are chemically or physically bonded.
摘要翻译： 包含碳材料和树脂的复合材料在例如用于具有包含碳纤维的核心部分的电路板的情况下能够提供碳材料例如碳纤维的原始特性。 本发明的复合材料包括：由石墨或具有石墨结构的材料构成的碳材料; 和树脂。 改变了碳材料的表面。 树脂和碳材料是化学或物理结合的。
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公开(公告)号：US20090151985A1
公开(公告)日：2009-06-18
申请号：US12189402
申请日：2008-08-11
申请人： Kishio YOKOUCHI
发明人： Kishio YOKOUCHI
CPC分类号： H05K3/0052 , H05K1/0366 , H05K3/28 , H05K3/44 , H05K3/4641 , H05K2201/0281 , H05K2201/0323 , H05K2201/09036 , H05K2201/0909 , Y10T29/49155
摘要： When package circuit boards are formed by dicing a circuit board sheet with a core substrate that conducts electricity, conductive material is not exposed from the outer side surfaces of the package circuit boards, thereby preventing electrical shorting of the package circuit boards. A method of dicing a circuit board sheet includes: a step of forming a circuit board sheet by forming a core portion that includes a conductive material and providing a wiring layer on the surface of the core portion; a step of forming concave channels in a thickness direction of the circuit board sheet from one surface of the circuit board sheet so as to pass through at least the core portion; a step of forming an insulating cover layer on a surface of the wiring layer and inside the concave channels; and a step of dicing the circuit board sheet within widths of the concave channels with positions of the concave channels as dicing positions.
摘要翻译： 当通过用导电的芯基板对电路板片进行切割来形成封装电路板时，导电材料不会从封装电路板的外侧表面露出，从而防止封装电路板的电短路。 切割电路板片的方法包括：通过形成包括导电材料的芯部并在芯部的表面上提供布线层来形成电路板片的步骤; 从所述电路板片的一个表面沿所述电路板片的厚度方向形成凹通道以至少穿过所述芯部的步骤; 在所述布线层的表面和所述凹槽内形成绝缘覆盖层的工序; 以及在凹槽的宽度内将电路板片材切割成凹槽的位置作为切割位置的步骤。
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