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    Metal surface protective film forming agent and use thereof
    3.
    发明申请
    Metal surface protective film forming agent and use thereof 审中-公开
    金属表面保护膜成型剂及其用途

    公开(公告)号：US20060049382A1

    公开(公告)日：2006-03-09

    申请号：US10764559

    申请日：2004-01-27

    申请人： Kiyonori Furuta ,  Masahiko Kurauchi ,  Hiroyuki Sato

    发明人： Kiyonori Furuta ,  Masahiko Kurauchi ,  Hiroyuki Sato

    IPC分类号： C23F11/00 ,  C09K3/00

    CPC分类号： C09G1/02 ,  C09G1/04 ,  C23C22/68 ,  C23F3/00 ,  C23F3/04 ,  C23F11/144 ,  H01L21/3212

    摘要： The present invention provides a metal surface protective film-forming agent that contains an α-amino acid (e.g., leucine, phenylalanine and valine) and a metal polishing solution using the same. The present invention also provides a method of polishing a surface of a base material for the manufacture of a substrate for semiconductor circuits, a method of forming a metal surface protective film, the use of the particular amino acid to the metal surface protective film forming agent, a substrate for semiconductor circuit that uses the same, a semiconductor circuit including these and a method of manufacturing the same.

    摘要翻译： 本发明提供含有α-氨基酸（例如亮氨酸，苯丙氨酸和缬氨酸）的金属表面保护膜形成剂和使用其的金属抛光溶液。 本发明还提供一种抛光用于制造半导体电路用基板的基材的表面的方法，形成金属表面保护膜的方法，特定氨基酸对金属表面保护膜形成剂的用途 ，使用该半导体电路的基板，包括它们的半导体电路及其制造方法。

    COMPOSITION FOR CAPSULE COATING
    4.
    发明申请
    COMPOSITION FOR CAPSULE COATING 审中-公开
    胶囊涂料组合物

    公开(公告)号：US20080113019A1

    公开(公告)日：2008-05-15

    申请号：US11951678

    申请日：2007-12-06

    申请人： Hideo Satokawa ,  Kiyonori Furuta ,  Keiji Iwasaki

    发明人： Hideo Satokawa ,  Kiyonori Furuta ,  Keiji Iwasaki

    IPC分类号： A61K9/48

    CPC分类号： A61K9/4891 ,  A23L29/212 ,  A23L29/281 ,  A23P10/30 ,  A61K9/4816 ,  A61K47/36

    摘要： The present invention provides a composition that is suitable for producing a plant-derived, practical capsule shell sheet having both sufficient strength and elongation as a capsule shell, superior adhesiveness and transparency, and a low burden on a drying step. The present invention also provides a capsule shell sheet obtained using the composition and a capsule preparation process. The composition of the present invention contains vegetable polysaccharides and a polyglutamic acid.

    摘要翻译： 本发明提供一种适用于生产具有作为胶囊壳具有足够的强度和伸长率的植物来源的实用的胶囊壳片的组合物，优异的粘合性和透明性，以及干燥步骤的低负担。 本发明还提供使用该组合物和胶囊制备方法获得的胶囊壳片。 本发明的组合物含有植物多糖和聚谷氨酸。

    Photosolder resist composition
    5.
    发明授权
    Photosolder resist composition 失效
    photoolder抗蚀剂组成

    公开(公告)号：US5506321A

    公开(公告)日：1996-04-09

    申请号：US143058

    申请日：1993-10-29

    申请人： Hiroyasu Koto ,  Kiyonori Furuta ,  Eiko Nakao ,  Shigeo Nakamura

    发明人： Hiroyasu Koto ,  Kiyonori Furuta ,  Eiko Nakao ,  Shigeo Nakamura

    IPC分类号： C08F2/48 ,  C08G59/20 ,  C08G59/40 ,  C09D11/033 ,  C09D11/10 ,  C09D11/101 ,  C09D11/102 ,  C09D11/106 ,  C09D11/107 ,  C09D11/108 ,  G03F7/027 ,  G03F7/038 ,  H05K3/28 ,  C08F224/00 ,  C08F220/10

    CPC分类号： G03F7/027 ,  H05K3/287

    摘要： A photosensitive resin composition or photosensitive heat-curing resin composition comprising a photocurable oligomer containing 2 or more polymerizable double bonds and a carboxyl group and a heat-curing component selected from a compound containing one polymerizable double bond and one epoxy group, a compound containing one or more polymerizable double bonds and one or more blocked isocyanate groups; a photosensitive resin composition comprising a photocurable oligomer containing a carboxyl group, a blocked isocyanate group and 2 or more polymerizable double bonds; and a novel compound containing one or more polymerizable double bonds and one or more blocked isocyanate groups are disclosed. The resin compositions have high photosensitivity, excellent developability and provide a solder resist pattern with excellent properties.

    摘要翻译： 一种感光性树脂组合物或感光性热固化性树脂组合物，其含有含有2个以上的可聚合双键和羧基的光固化性低聚物和选自含有一个可聚合双键和一个环氧基的化合物的热固化组分，含有一个 或更多的可聚合双键和一个或多个封端的异氰酸酯基团; 包含含有羧基，封端异氰酸酯基和2个以上可聚合双键的光固化低聚物的感光性树脂组合物; 并且公开了含有一个或多个可聚合双键和一个或多个封端异氰酸酯基团的新型化合物。 树脂组合物具有高的光敏性，优异的显影性，并提供具有优异性能的阻焊图案。

    Method of vacuum-laminating adhesive film
    6.
    发明授权
    Method of vacuum-laminating adhesive film 有权
    粘合膜真空层压方法

    公开(公告)号：US06346164B1

    公开(公告)日：2002-02-12

    申请号：US09439093

    申请日：1999-11-12

    申请人： Shigeo Nakamura ,  Kiyonori Furuta

    发明人： Shigeo Nakamura ,  Kiyonori Furuta

    IPC分类号： B32B3120

    CPC分类号： H05K3/4673 ,  B32B37/12 ,  B32B37/26 ,  B32B2457/08 ,  H05K3/4661 ,  H05K2203/066 ,  H05K2203/068 ,  H05K2203/085 ,  H05K2203/1572 ,  Y10T156/1041

    摘要： Adhesive films may be vacuum laminated on a circuit substrate by sheeting an adhesive film having the same size as or a smaller size than that of a circuit substrate in a state wherein the surface of a resin composition in the adhesive film is allowed to provisionally partially adhere to one surface or both surfaces of the circuit substrate and disposing a protecting film having an area larger than that of the adhesive film on the adhesive film provisionally adhering to the circuit substrate so that the center of the protecting film is disposed at substantially the same position as that of the center of the adhesive film, followed by vacuum laminating under heating and pressing conditions.

    摘要翻译： 在粘合膜中的树脂组合物的表面被允许临时部分粘附的状态下，通过将具有与电路基板尺寸相同或更小的尺寸的粘合剂薄膜，将粘合膜真空层压在电路基板上 到电路基板的一个表面或两个表面，并且将具有比粘合剂膜的面积大的面积的保护膜设置在临时粘附到电路基板上的粘合剂膜上，使得保护膜的中心处于基本相同的位置 作为粘合膜的中心，然后在加热和加压条件下进行真空层压。

    Prepreg for laminate and process for producing printed wiring-board using the same
    7.
    发明授权
    Prepreg for laminate and process for producing printed wiring-board using the same 失效
    用于制造印刷电路板的层压板用预浸料及其制造方法

    公开(公告)号：US6124023A

    公开(公告)日：2000-09-26

    申请号：US978599

    申请日：1997-11-26

    申请人： Kiyonori Furuta ,  Tadahiko Yokota

    发明人： Kiyonori Furuta ,  Tadahiko Yokota

    IPC分类号： B29C70/06 ,  B29K63/00 ,  B29K105/08 ,  B29L9/00 ,  B32B5/28 ,  B32B27/38 ,  C08G59/50 ,  C08J5/24 ,  C08K7/02 ,  C08L63/00 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46 ,  B32B3/00

    CPC分类号： C08J5/24 ,  C08L63/00 ,  H05K3/381 ,  C08J2363/00 ,  Y10T428/24612 ,  Y10T428/2481 ,  Y10T428/24851

    摘要： The problems are to provide a prepreg for laminate which can secure a heat resistance, electrical insulation properties and an adhesion strength of a conductor layer, a printed wiring-board which satisfies a high density and which is excellent in a heat resistance and electrical insulation properties upon utilizing the conventional production equipment and method of laminate pressing, and a process for producing the same.A prepreg for laminate characterized in that a paper-like or fabric-like substrate is impregnated with an epoxy resin composition capable of forming a roughened surface through roughening treatment, and a laminate obtained by using the same; a printed wiring-board obtained by using the printed wiring-board and a process for producing the same, which comprises (1) a step of forming a roughened surface by subjecting the surface of the laminate to the roughening treatment, and (2) a step of forming a conductor layer on the roughened surface of the laminate; and a multi-layer printed wiring-board and a process for producing the same, which comprises (1) a step of laminating the prepreg for laminate with an inner layer material such that the prepreg is disposed on the surface, and pressing them to form a laminate, (2) a step of subjecting the surface of the laminate to the roughening treatment to form a roughened surface, and (3) a step of forming a conductor layer on the roughened surface of the laminate.

    摘要翻译： 问题在于提供一种能够确保导体层的耐热性，电气绝缘性和粘合强度的层叠体的预浸料，满足高密度且耐热性和电绝缘性优异的印刷线路板 在利用传统的生产设备和层叠压制方法及其制造方法。 一种用于层压体的预浸料，其特征在于，通过粗糙化处理将能够形成粗糙化表面的环氧树脂组合物浸渍在纸状或织物状基材中，以及使用它们的层压体。 通过使用印刷线路板获得的印刷线路板及其制造方法，其包括（1）通过对层压体的表面进行粗糙化处理来形成粗糙化表面的步骤，以及（2） 在层压体的粗糙化表面上形成导体层的步骤; 和多层印刷线路板及其制造方法，其包括：（1）将层压材料的预浸料与内层材料层合以使得预浸料坯设置在表面上的步骤，并将其压制形成 层叠体，（2）使层叠体的表面进行粗糙化处理以形成粗糙面的工序，（3）在层叠体的粗糙化面上形成导体层的工序。