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    Multi-chip module having thermal contacts
    2.
    发明授权
    Multi-chip module having thermal contacts 失效
    具有热触点的多芯片模块

    公开(公告)号：US5432675A

    公开(公告)日：1995-07-11

    申请号：US151871

    申请日：1993-11-15

    申请人： Haruo Sorimachi ,  Kiyotaka Seyama ,  Makoto Sumiyoshi ,  Kazuaki Satoh

    发明人： Haruo Sorimachi ,  Kiyotaka Seyama ,  Makoto Sumiyoshi ,  Kazuaki Satoh

    IPC分类号： H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H05K7/20

    CPC分类号： H01L23/49894 ,  H01L23/3677 ,  H01L23/49866 ,  H01L23/538 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/19107 ,  H01L2924/3011

    摘要： A multi-chip module (MCM) having semiconductor chips on a top surface of multi-layered interconnection circuits formed on a planar surface of a substrate including: (a) multi-layered interconnection circuits comprising alternatively laminated interconnection layers with insulating layers, and thermal contacts, each of the thermal contacts comprising successively laminated interconnection layers on a bottom and on side-walls of a vertical hole penetrating a plurality of the insulating layers, and a thermal conductor filling the vertical hole on the successively laminated interconnection layers, and (b) a plurality of the semiconductor chips attached to the thermal conductor. In a preferred embodiment, a V-shaped vertical hole is formed in the insulating layers of polyimide for a thermal contact, copper films are successively laminated thereon, unpatterned copper and gold films are deposited thereon, and the entire surface of the metal film including the hole is coated by a silver-powder containing epoxy film, to which semiconductor chips are adhered.

    摘要翻译： 一种多芯片模块（MCM），其在多层互连电路的顶面上形成半导体芯片，所述多层布线电路形成在基板的平面上，所述多层布线电路的平面表面包括：（a）多层互连电路， 触点，每个热触头包括穿透多个绝缘层的垂直孔的底部和侧壁上的相继层压的互连层，以及填充连续层压的互连层上的垂直孔的热导体，和（b ）附接到热导体的多个半导体芯片。 在优选实施例中，在聚酰亚胺的绝缘层中形成V形垂直孔用于热接触，铜膜依次层压在其上，未图案化的铜和金膜沉积在其上，金属膜的整个表面包括 孔被含有银粉的环氧树脂膜涂覆，半导体芯片被粘附到其上。

    Apparatus and method for exchanging electrode chips used for resistance welding
    3.
    发明授权
    Apparatus and method for exchanging electrode chips used for resistance welding 失效
    用于电阻焊接的电极芯片交换装置及方法

    公开(公告)号：US4794221A

    公开(公告)日：1988-12-27

    申请号：US95647

    申请日：1987-09-14

    申请人： Fumio Takabe ,  Masashi Kitadate ,  Makoto Sumiyoshi ,  Kiyohiko Igarashi ,  Kazuo Suzuki ,  Takashi Akita

    发明人： Fumio Takabe ,  Masashi Kitadate ,  Makoto Sumiyoshi ,  Kiyohiko Igarashi ,  Kazuo Suzuki ,  Takashi Akita

    IPC分类号： B23K11/30

    CPC分类号： B23K11/3072

    摘要： An apparatus for exchanging electrode chips used for resistance welding. The apparatus includes a base to which a shaft is rotatably mounted. A power source is connected to one end of the shaft to rotate the shaft. An electrode chip-withdrawing knife tool is made of a board connected to the other end of the shaft. The knife tool is provided with recesses which are radially directed about the axis of the shaft. The recesses have their respective knife edge portions each of which is fitted into an annular groove formed between the step portion at the front end of the shank of each arm of a welding gun and the electrode chip fitted over the shank. An electrode chip supply holder in which new polished electrode chips are received is held by a guide member.

    摘要翻译： 用于电阻焊接的电极芯片的交换装置。 该装置包括一个可旋转地安装有轴的基座。 电源连接到轴的一端以旋转轴。 电极取出刀具由与轴的另一端连接的板构成。 刀具具有围绕轴的轴线径向指向的凹部。 凹部具有它们各自的刀刃部分，每个刀刃部分装配到形成在焊枪的每个臂的柄的前端的台阶部分和安装在柄上的电极芯片之间的环形槽中。 接收新的抛光电极芯片的电极芯片供给保持器被引导构件保持。