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16 条记录 (耗时 0.023 秒)

    Multi-chip module having thermal contacts
    1.
    发明授权
    Multi-chip module having thermal contacts 失效
    具有热触点的多芯片模块

    公开(公告)号：US5432675A

    公开(公告)日：1995-07-11

    申请号：US151871

    申请日：1993-11-15

    申请人： Haruo Sorimachi ,  Kiyotaka Seyama ,  Makoto Sumiyoshi ,  Kazuaki Satoh

    发明人： Haruo Sorimachi ,  Kiyotaka Seyama ,  Makoto Sumiyoshi ,  Kazuaki Satoh

    IPC分类号： H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H05K7/20

    CPC分类号： H01L23/49894 ,  H01L23/3677 ,  H01L23/49866 ,  H01L23/538 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/19107 ,  H01L2924/3011

    摘要： A multi-chip module (MCM) having semiconductor chips on a top surface of multi-layered interconnection circuits formed on a planar surface of a substrate including: (a) multi-layered interconnection circuits comprising alternatively laminated interconnection layers with insulating layers, and thermal contacts, each of the thermal contacts comprising successively laminated interconnection layers on a bottom and on side-walls of a vertical hole penetrating a plurality of the insulating layers, and a thermal conductor filling the vertical hole on the successively laminated interconnection layers, and (b) a plurality of the semiconductor chips attached to the thermal conductor. In a preferred embodiment, a V-shaped vertical hole is formed in the insulating layers of polyimide for a thermal contact, copper films are successively laminated thereon, unpatterned copper and gold films are deposited thereon, and the entire surface of the metal film including the hole is coated by a silver-powder containing epoxy film, to which semiconductor chips are adhered.

    摘要翻译： 一种多芯片模块（MCM），其在多层互连电路的顶面上形成半导体芯片，所述多层布线电路形成在基板的平面上，所述多层布线电路的平面表面包括：（a）多层互连电路， 触点，每个热触头包括穿透多个绝缘层的垂直孔的底部和侧壁上的相继层压的互连层，以及填充连续层压的互连层上的垂直孔的热导体，和（b ）附接到热导体的多个半导体芯片。 在优选实施例中，在聚酰亚胺的绝缘层中形成V形垂直孔用于热接触，铜膜依次层压在其上，未图案化的铜和金膜沉积在其上，金属膜的整个表面包括 孔被含有银粉的环氧树脂膜涂覆，半导体芯片被粘附到其上。

    Module sealing structure
    6.
    发明授权
    Module sealing structure 失效
    模块密封结构

    公开(公告)号：US4949219A

    公开(公告)日：1990-08-14

    申请号：US356245

    申请日：1989-05-24

    申请人： Kiyokazu Moriizumi ,  Kyoichiro Kawano ,  Kiyotaka Seyama

    发明人： Kiyokazu Moriizumi ,  Kyoichiro Kawano ,  Kiyotaka Seyama

    IPC分类号： H01L23/473 ,  H01L23/10 ,  H01L23/20 ,  H01L23/433

    CPC分类号： H01L23/10 ,  H01L23/20 ,  H01L23/4332 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/09701 ,  H01L2924/15312

    摘要： A sealed module includes a cold plate having a passage through which a cooling medium flows, a plurality of bellows structures having first ends which communicate with the passage in the cold plate to form a thermal conduction type cooling system and a plated printed circuit having a substrate and a plurality of integrated circuit elements provided on a first surface the substrate. The integrated circuit elements are in contact with ends of the bellows structures. A metal fitting secured on the cold plate has a flange disposed beneath the other surface of the substrate to present a junction between the second surface of the substrate and the flange of the metal fitting. A polyimide layer is formed on the surface of the substrate and a conductor layer is formed on the polyimide layer. The polyimide layer and the conductor layer are approximately ring shaped at least at the peripheral portions of the substrate. The flange of the metal fitting is fixed to the substrate by solder provided between the conductor layer and the flange, to thereby provide a seal between the substrate and the flange.

    Printed board unit for optical transmission and mounting method
    8.
    发明授权
    Printed board unit for optical transmission and mounting method 失效
    用于光学传输和安装方法的印刷电路板单元

    公开(公告)号：US06959125B2

    公开(公告)日：2005-10-25

    申请号：US10341437

    申请日：2003-01-14

    申请人： Takashi Kanda ,  Kiyotaka Seyama ,  Kaoru Sugimoto ,  Souichi Obata ,  Yasutomo Maehara

    发明人： Takashi Kanda ,  Kiyotaka Seyama ,  Kaoru Sugimoto ,  Souichi Obata ,  Yasutomo Maehara

    IPC分类号： G02B6/42 ,  G02B6/43 ,  G02B6/12

    CPC分类号： G02B6/43 ,  G02B6/42 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2924/00014

    摘要： It is an object of the present invention to enhance laser beam transmitting efficiency by accurately controlling an interval between a light emitting (light receiving) element (20) and an optical wave-guide substrate (1) without causing any fluctuation in the interval in a mounting structure of the light transmitting element in which the light emitting (light receiving) element (20) is mounted on the optical wave-guide substrate (1). When the light emitting (light receiving) element is joined to the sub-mount chip (4) and when the sub-mount chip (4) is joined to the optical wave-guide while the element is being directed to the substrate side, the sub-mount chip and the optical wave-guide substrate are joined to each other by the solder bump (6). A post (5) is arranged for regulating an interval between the light emitting (light receiving) element and the optical wave-guide substrate.

    摘要翻译： 本发明的目的是通过精确地控制发光（光接收）元件（20）和光波导基板（1）之间的间隔而不会引起在 其中发光（光接收）元件（20）安装在光波导基板（1）上的透光元件的安装结构。 当发光（光接收）元件接合到子安装芯片（4）时，并且当元件被引导到基板侧时，子安装芯片（4）接合到光波导上时， 副安装芯片和光波导基板通过焊料凸块（6）相互连接。 布置用于调节发光（光接收）元件和光波导基板之间的间隔的柱（5）。

    High density printed wiring board
    9.
    发明授权
    High density printed wiring board 失效
    高密度印刷线路板

    公开(公告)号：US4912603A

    公开(公告)日：1990-03-27

    申请号：US327424

    申请日：1989-03-23

    申请人： Kiyotaka Seyama

    发明人： Kiyotaka Seyama

    IPC分类号： H05K3/46 ,  H01L23/538 ,  H05K1/00 ,  H05K1/11 ,  H05K3/22 ,  H05K3/42

    CPC分类号： H05K1/0292 ,  H01L23/5384 ,  H05K1/114 ,  H01L2224/16225 ,  H05K1/0298 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K3/429 ,  Y10T29/49156

    摘要： A high density printed wiring board, on which terminal pads are provided and high density semiconductor devices each having input and output terminals are mounted through the terminal pads, is provided with via pads which are internally connected with respective previously designated circuits of the board and are placed adjacent each terminal pad and are electrically connected with the corresponding terminal pad by a wiring pattern provided on the surface of the board. When the destination of the terminal pad is to be modified for connection with another circuit of the board, the wiring pattern is severed and electrical connection between the terminal pad and the other circuit is made using insulated new discrete wiring wired on the surface of the board. Modification pads for relaying the new wiring are provided on the surface of the board in areas adjacent to and surrounding the region where the terminal pads are located or arranged within such region so that each modification pad is disposed adjacent a corresponding terminal pad and via pad.

    摘要翻译： 设置有端子焊盘的高密度印刷布线板和通过端子焊盘安装有输入和输出端子的高密度半导体器件设置有与板的各个预先指定的电路内部连接的通孔焊盘，并且 放置在每个端子焊盘附近并且通过设置在板的表面上的布线图案与相应的端子焊盘电连接。 当端子焊盘的目的地要修改以与板的另一个电路连接时，布线图案被切断，并且端子焊盘和另一个电路之间的电连接是使用布线在板的表面上的绝缘的新的分立布线 。 用于中继新配线的修改焊盘设置在板的表面上，在邻近并围绕端子焊盘所在区域的区域中，或者布置在这些区域内，使每个修改焊盘邻近相应的端子焊盘和通孔焊盘。

    Multilayer thin-film wiring board
    10.
    发明授权
    Multilayer thin-film wiring board 失效
    多层薄膜接线板

    公开(公告)号：US5608192A

    公开(公告)日：1997-03-04

    申请号：US506918

    申请日：1995-07-26

    申请人： Kiyokazu Moriizumi ,  Kiyotaka Seyama

    发明人： Kiyokazu Moriizumi ,  Kiyotaka Seyama

    IPC分类号： H05K3/46 ,  H01L23/12 ,  H01L23/538 ,  H05K1/00 ,  H05K1/03 ,  H05K3/42

    CPC分类号： H01L23/5386 ,  H01L23/5384 ,  H05K1/0287 ,  H01L2924/0002 ,  H05K1/0289 ,  H05K1/0298 ,  H05K1/0306 ,  H05K2201/09454 ,  H05K2201/09945 ,  H05K2203/061 ,  H05K3/429 ,  H05K3/4644 ,  H05K3/467

    摘要： A multilayer thin-film wiring board formed by laminating at least three wiring layers including first, second, and third wiring layers together with a dielectric layer. The first wiring layer includes a first pattern having a plurality of first windows arranged with the same pitch both in a lateral direction and in a longitudinal direction of the wiring board, and a plurality of first island patterns each located at a substantially central portion of each first window. Similarly, the second wiring layer includes a second pattern having a plurality of second windows, and a plurality of second island patterns each located at a substantially central portion of each second window. The second windows are shifted from the first windows by half the pitch both in the lateral direction and in the longitudinal direction. The third wiring layer includes first and second via pads formed on a surface of the wiring board. The first via pad, the first pattern, and at least one of the second island patterns are connected together by a first via. The second via pad, the second pattern, and at least one of the first island patterns are connected together by a second via.

    摘要翻译： 通过将包括第一，第二和第三布线层的至少三个布线层与电介质层层叠而形成的多层薄膜布线板。 第一布线层包括第一图案，其具有在布线板的横向和纵向方向上以相同的间距布置的多个第一窗口，以及多个第一岛状图案，每个第一窗口位于每个第一窗口的大致中央部分 第一窗口 类似地，第二布线层包括具有多个第二窗口的第二图案和分别位于每个第二窗口的大致中心部分的多个第二岛状图案。 第二窗口在横向和纵向方向上从第一窗口偏移了一半的距离。 第三布线层包括形成在布线板的表面上的第一和第二通孔焊盘。 第一通孔焊盘，第一图案以及第二岛状图案中的至少一个通过第一通孔连接在一起。 第二通孔焊盘，第二图案以及第一岛状图案中的至少一个通过第二通孔连接在一起。