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    TERMINAL MOUNTING STRUCTURE AND METHOD
    3.
    发明申请
    TERMINAL MOUNTING STRUCTURE AND METHOD 审中-公开
    端子安装结构和方法

    公开(公告)号：US20110163569A1

    公开(公告)日：2011-07-07

    申请号：US13063843

    申请日：2009-01-23

    申请人： Miki Yoneyama ,  Kohichiro Kawate ,  Kenji Kuwahara

    发明人： Miki Yoneyama ,  Kohichiro Kawate ,  Kenji Kuwahara

    IPC分类号： B60J1/00 ,  H01R4/00 ,  B29C65/48

    CPC分类号： H01R12/515 ,  H01R13/2492 ,  H01R13/639 ,  H05B3/84 ,  H05B2203/016 ,  H05K3/321 ,  H05K3/3426 ,  Y10T156/1089

    摘要： To provide a terminal mounting structure, the electrical continuation and the joining strength of which are sufficiently high although the structure is simple, further the reliability of which is high even when it is used over a long period of time and to provide a terminal mounting method therefor. A terminal (3) is connected and continued to a conductor (2) such as a heating wire provided on a substrate (1). Terminal (3) includes: a fixing portion (31); elastic portions (32) extending from fixing portion (31); and a substrate contact portion (33) provided in elastic portion (32) so that substrate contact portion (33) can be protruded with respect to substrate (1), and electrically connected to conductor (2). Each fixing portion (31) is made to adhere to substrate (1) by a joining means such as a double-sided adhesive tape (4). Substrate contact portion (33) of terminal (3) is made to adhere to substrate (1) by adhesive (5) under the condition that substrate contact portion (33) comes into contact with conductor (2) by a repulsive force generated by an elastic displacement of elastic portion (32).

    摘要翻译： 为了提供一种端子安装结构，虽然结构简单，但其电连续性和接合强度足够高，即使长时间使用也可靠性高，并提供端子安装方法 因此。 端子（3）连接并连接到诸如设置在基板（1）上的加热丝的导体（2）。 端子（3）包括：固定部分（31）; 从固定部分（31）延伸的弹性部分（32）; 以及设置在弹性部分（32）中的基板接触部分（33），使得基板接触部分（33）可以相对于基板（1）突出并且电连接到导体（2）。 通过诸如双面胶带（4）的接合装置使每个固定部分（31）粘附到基底（1）上。 端子（3）的基板接触部分（33）通过粘合剂（5）在基板接触部分（33）通过由导体（2）产生的排斥力与导体（2）接触的条件下粘附到基板（1） 弹性部分（32）的弹性位移。

    Method for Connecting Printed Circuit Boards
    7.
    发明申请
    Method for Connecting Printed Circuit Boards 审中-公开
    连接印刷电路板的方法

    公开(公告)号：US20080283280A1

    公开(公告)日：2008-11-20

    申请号：US12092773

    申请日：2006-11-09

    申请人： Kohichiro Kawate ,  Yoshihisa Kawate

    发明人： Kohichiro Kawate ,  Yoshihisa Kawate

    IPC分类号： H05K1/14 ,  B29C65/54

    CPC分类号： H05K3/361 ,  H05K3/328 ,  H05K2201/0129 ,  H05K2201/0212 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/0285 ,  H05K2203/1189

    摘要： To provide a method for connecting printed circuit boards with high connection reliability, while avoiding the problem of shorting even with a fine pitch. A method for connecting printed circuit boards (PCB) containing metal wiring, or connecting a printed circuit board (PCB) containing metal wiring with a metal lead wire or a metal contact, which method includes a step of thermocompression bonding of an adhesive film with connectors, the adhesive film being composed of an adhesive composition comprising a thermoplastic resin and organic particles, wherein the viscosity decreases as the applied thermocompression force increases at a temperature of 100-250° C.

    摘要翻译： 提供一种以高连接可靠性连接印刷电路板的方法，同时避免了即使具有精细间距的短路问题。 一种用于连接包含金属布线的印刷电路板（PCB）或将包含金属布线的印刷电路板（PCB）与金属引线或金属接触件连接的方法，该方法包括将粘合剂膜与连接器热压接合的步骤 粘合剂膜由包含热塑性树脂和有机颗粒的粘合剂组合物组成，其中随着施加的热压力在100-250℃的温度下增加，粘度降低。

    Method for Mutually Connecting Circuit Boards
    8.
    发明申请
    Method for Mutually Connecting Circuit Boards 失效
    电路板互连方法

    公开(公告)号：US20080205019A1

    公开(公告)日：2008-08-28

    申请号：US11917527

    申请日：2006-06-21

    申请人： Yoshiaki Sato ,  Kohichiro Kawate ,  James R. White

    发明人： Yoshiaki Sato ,  Kohichiro Kawate ,  James R. White

    IPC分类号： H05K1/14

    CPC分类号： H05K3/365 ,  H01L2224/73204 ,  H01L2224/83101 ,  H05K1/117 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49195

    摘要： A method for connecting circuit boards, comprising: (i) preparing a first circuit board having connection parts assigned to end parts of a plurality of conductor wirings, and a second circuit board having connection parts assigned to corresponding end parts of a plurality of conductor wirings; (ii) disposing the connection parts of the first circuit board to face the connection parts of the second circuit board with a thermosetting adhesive film between the connection parts of the circuit boards; and (iii) applying heat and pressure to the connection parts and to the thermosetting adhesive film sufficiently high to thoroughly push away the adhesive film so as to establish electrical contact between connection parts of the circuit boards facing each other and to allow for curing of the adhesive; wherein the conductor wirings constituting the connection parts of at least one of the first and second circuit boards contain non-linear wirings.

    摘要翻译： 一种用于连接电路板的方法，包括：（i）制备具有分配给多个导体布线的端部的连接部分的第一电路板和具有分配给多个导体布线的相应端部的连接部分的第二电路板 ; （ii）将第一电路板的连接部分设置成与电路板的连接部分之间的热固性粘合膜面对第二电路板的连接部分; 和（iii）对连接部分和热固性粘合剂膜施加足够高的热量和压力，以充分地推开粘合剂膜，以便在彼此面对的电路板的连接部分之间建立电接触，并允许固化 胶粘剂; 其中构成第一和第二电路板中的至少一个的连接部分的导体配线包含非线性配线。

    Method for Connecting Flexible Printed Circuit Board to Another Circuit Board
    9.
    发明申请
    Method for Connecting Flexible Printed Circuit Board to Another Circuit Board 审中-公开
    将柔性印刷电路板连接到另一个电路板的方法

    公开(公告)号：US20080156437A1

    公开(公告)日：2008-07-03

    申请号：US11816124

    申请日：2006-03-07

    申请人： Kohichiro Kawate ,  Yoshiaki Sato ,  Yuji Hirasawa

    发明人： Kohichiro Kawate ,  Yoshiaki Sato ,  Yuji Hirasawa

    IPC分类号： C09J163/00

    CPC分类号： H01R12/61 ,  H01R12/62 ,  H05K1/111 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09727 ,  H05K2201/10977 ,  H05K2203/1189

    摘要： A method for connecting FPC to a second circuit board, comprising the steps of (i) preparing a flexible printed circuit board (FPC) and a second circuit board, (ii) disposing the connection parts of the FPC to face the connection parts of the second circuit board such that a thermosetting adhesive film is present between the connection parts of the FPC and the connection parts of the second circuit board, and (iii) applying heat and pressure sufficiently high to thoroughly push away the adhesive film for establishing electrical contact and allow for curing of the adhesive, wherein the ratio of conductor width (L)/conductor-to-conductor distance (S) in the conductor wiring end parts constituting the connection parts of FPC is 0.5 or less and the thermosetting adhesive film is adjusted to have a viscosity of 500 to 20,000 Pa·s at 200° C.

    摘要翻译： 一种用于将FPC连接到第二电路板的方法，包括以下步骤：（i）制备柔性印刷电路板（FPC）和第二电路板，（ii）将FPC的连接部分设置为面对 第二电路板，使得在FPC的连接部分和第二电路板的连接部分之间存在热固性粘合膜，并且（iii）施加足够高的热和压力以彻底地推开粘合膜以建立电接触， 允许粘合剂固化，其中构成FPC连接部分的导体布线端部中的导体宽度（L）/导体与导体之间的距离（S）的比率为0.5以下，将热固性粘合膜调整为 在200℃下的粘度为500至20,000Pa.s

    Reactive hot melt composition, composition for preparation of reactive hot melt composition, and film-form hot melt adhesive
    10.
    发明授权
    Reactive hot melt composition, composition for preparation of reactive hot melt composition, and film-form hot melt adhesive 失效
    反应性热熔组合物，反应性热熔组合物的制备用组合物，以及膜状热熔粘合剂

    公开(公告)号：US6051652A

    公开(公告)日：2000-04-18

    申请号：US68073

    申请日：1998-04-30

    申请人： Kohichiro Kawate ,  Shigeyoshi Ishii

    发明人： Kohichiro Kawate ,  Shigeyoshi Ishii

    IPC分类号： C08L23/08 ,  C08L33/04 ,  C08L93/04 ,  C09J123/08 ,  C08K5/04

    CPC分类号： C09J123/0884 ,  C08L23/0869 ,  C08L33/04 ,  C08L93/04

    摘要： A composition for preparing a reactive hot melt composition comprises (a) a thermoplastic polymer which comprises a polyolefin having an epoxy group, and (b) a radiation polymerizable component containing (b-1) an aliphatic alkyl (meth)acrylate and (b-2) an acrylic compound having a functional group reactive with an epoxy group. A reactive hot melt composition is obtained by polymerizing this composition so as to polymerize the radiation polymerizable component.The reactive hot melt composition which can be easily hot melt coated, crosslinked quickly in the absence of radiation or moisture after bonding adherends, does not form moisture during crosslinking, and has high flowability during hot melting.

    摘要翻译： PCT No.PCT / US96 / 16924 Sec。 371日期：1998年4月30日 102（e）1998年4月30日PCT PCT 1996年10月23日PCT公布。 公开号WO97 / 16500 日期1997年5月9日制备反应性热熔组合物的组合物包含（a）包含具有环氧基的聚烯烃的热塑性聚合物，和（b）含（b-1）脂肪族（甲基）丙烯酸烷基酯 和（b-2）具有与环氧基反应的官能团的丙烯酸类化合物。 通过聚合该组合物以聚合可辐射聚合组分来获得反应性热熔组合物。 可以容易地热熔融涂覆的反应性热熔组合物，在粘合被粘物之后，在没有辐射或湿气的情况下快速交联，在交联过程中不会形成水分，并且在热熔融时具有高流动性。