COUPLING PIEZOELECTRIC MATERIAL GENERATED STRESSES TO DEVICES FORMED IN INTEGRATED CIRCUITS
    9.
    发明申请
    COUPLING PIEZOELECTRIC MATERIAL GENERATED STRESSES TO DEVICES FORMED IN INTEGRATED CIRCUITS 有权
    联合压电材料生成的应力到集成电路中形成的器件

    公开(公告)号:US20120270353A1

    公开(公告)日:2012-10-25

    申请号:US13532991

    申请日:2012-06-26

    IPC分类号: H01L21/02

    CPC分类号: H01L49/00 H01C10/103

    摘要: A coupling structure for coupling piezoelectric material generated stresses to an actuated device of an integrated circuit includes a rigid stiffener structure formed around a piezoelectric (PE) material and the actuated device, the actuated device comprising a piezoresistive (PR) material that has an electrical resistance dependent upon an applied pressure thereto; and a soft buffer structure formed around the PE material and PR material, the buffer structure disposed between the PE and PR materials and the stiffener structure, wherein the stiffener structure clamps both the PE and PR materials to a substrate over which the PE and PR materials are formed, and wherein the soft buffer structure permits the PE material freedom to move relative to the PR material, thereby coupling stress generated by an applied voltage to the PE material to the PR material so as change the electrical resistance of the PR material.

    摘要翻译: 用于将压电材料产生的应力耦合到集成电路的致动装置的耦合结构包括围绕压电(PE)材料形成的刚性加强结构和致动装置,该致动装置包括具有电阻的压阻(PR)材料 取决于施加的压力; 以及围绕PE材料和PR材料形成的软缓冲结构,缓冲结构设置在PE和PR材料之间以及加强件结构之间,其中加强件结构将PE和PR材料夹持到基底上,PE和PR材料 并且其中软缓冲结构允许PE材料相对于PR材料自由移动,从而将由施加的电压产生的应力耦合到PE材料到PR材料,从而改变PR材料的电阻。